KR100313097B1 - A method for manufacturing the analogue semiconductor - Google Patents
A method for manufacturing the analogue semiconductor Download PDFInfo
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- KR100313097B1 KR100313097B1 KR1019980038754A KR19980038754A KR100313097B1 KR 100313097 B1 KR100313097 B1 KR 100313097B1 KR 1019980038754 A KR1019980038754 A KR 1019980038754A KR 19980038754 A KR19980038754 A KR 19980038754A KR 100313097 B1 KR100313097 B1 KR 100313097B1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823475—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type interconnection or wiring or contact manufacturing related aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823418—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/823443—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes silicided or salicided gate conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
Abstract
본 발명은 아날로그 반도체소자에 관한 것으로서, 특히, 필드산화막이 형성된 반도체기판상에 게이트산화막, 제1폴리실리콘층, 텅스텐실리사이드층 및 버퍼폴리실리콘층을 순차적으로 적층하는 단계와; 상기 버퍼폴리실리콘층상에 유전체산화막과 제2폴리실리콘층을 형성한 후 커패시터가 형성될 부분에 감광막을 적층하고 패터닝하여 커패시터의 상부전극을 형성하는 단계와; 상기 결과물의 전면에 버퍼산화막과 반사방지막을 적층하는 단계와; 상기 반사방지막 상에 감광막을 적층하여 식각으로 패터닝한 후 게이트전극과 커패시터전극을 형성하고, 게이트전극에 이온을 주입하여 소오스/드레인영역을 형성한 후 게이트전극과 커패시터전극에 스페이서막을 형성하는 단계와; 상기 결과물에 제1절연막을 적층한 후 트랜지스터영역과 커패시터영역간의 단차를 줄이기 위하여 커패시터전극의 제2폴리실리콘층까지 노출되도록 평탄화하는 단계와; 상기 결과물 상에 제2절연막을 적층하여 제1,제2절연막에 콘택홀을 형성한 후 게이트전극의 활성영역과 커패시터전극으로 연결되는 금속배선을 형성하는 단계로 이루어진 아날로그반도체소자의 제조방법인 바, 전체적으로 트랜지스터영역과 커패시터영역의 단차를 균일하게 유지하므로 아날로그소자의 특성을 향상시키도록 하는 매우 유용하고 효과적인 발명이다.The present invention relates to an analog semiconductor device, and in particular, sequentially depositing a gate oxide film, a first polysilicon layer, a tungsten silicide layer and a buffer polysilicon layer on a semiconductor substrate on which a field oxide film is formed; Forming a dielectric oxide film and a second polysilicon layer on the buffer polysilicon layer, and then stacking and patterning a photoresist on a portion where the capacitor is to be formed to form an upper electrode of the capacitor; Stacking a buffer oxide film and an anti-reflection film on the entire surface of the resultant product; Forming a gate electrode and a capacitor electrode after forming a photoresist film on the anti-reflection film by etching, forming a source / drain region by implanting ions into the gate electrode, and forming a spacer film on the gate electrode and the capacitor electrode; ; Stacking the first insulating layer on the resultant and then planarizing the semiconductor substrate to be exposed to the second polysilicon layer of the capacitor electrode in order to reduce the step difference between the transistor region and the capacitor region; Forming a contact hole in the first and second insulating layers by stacking a second insulating layer on the resultant, and then forming a metal wiring connected to the active region of the gate electrode and the capacitor electrode. Therefore, the present invention is very useful and effective to improve the characteristics of the analog device because the steps of the transistor area and the capacitor area are kept uniform.
Description
본 발명은 아날로그반도체소자에 관한 것으로서, 특히, 게이트전극 및 커패시터전극을 형성하고서 그 위에 제1절연막을 적층하고 단차를 줄이도록 식각하여 그 위에 제2절연막을 적층한 후에 금속배선을 형성하므로 커패시터영역과 트랜지스터영역의 단차를 없애주어 아날로그소자의 전기적인 특성을 향상시키도록 하는 아날로그반도체소자의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an analog semiconductor device. In particular, a capacitor region is formed by forming a gate electrode and a capacitor electrode, stacking a first insulating layer thereon, etching to reduce a step, and stacking a second insulating layer thereon to form a metal wiring. The present invention relates to a method for manufacturing an analog semiconductor device to eliminate the step of the transistor region and to improve the electrical characteristics of the analog device.
일반적으로, 반도체장치의 종류에는 여러 가지가 있으며, 이 반도체장치 내에 형성되는 트랜지스터 및 커패시터등을 구성시키는 방법에는 다양한 제조기술이 사용되고 있다. 최근에는 반도체기판 상에 산화막을 입혀 전계효과를 내도록 하는 모스형 전계효과트랜지스터(MOSFET; metal oxide semiconductor field effect transistor)를 점차적으로 많이 사용하고 있는 실정에 있다.In general, there are various kinds of semiconductor devices, and various manufacturing techniques are used in the method of constructing transistors, capacitors, and the like formed in the semiconductor device. Recently, MOSFETs (metal oxide semiconductor field effect transistors) for applying an oxide film on a semiconductor substrate to produce an electric field effect have been gradually used.
상기한 모스형 전계효과트랜지스터는 반도체 기판상에 형성된 게이트가 반도체층에서 얇은 산화 실리콘막에 의해 격리되어 있는 전계효과 트랜지스터로 접합형과 같이 임피던스가 저하되는 일이 없으며, 확산 공정이 1회로 간단하고, 소자간의 분리가 필요 없는 장점을 지니고 있어서, 고밀도 집적화에 적합한 특성을 지니고 있는 반도체 장치이다.The MOS type field effect transistor is a field effect transistor in which a gate formed on a semiconductor substrate is isolated by a thin silicon oxide film in a semiconductor layer, and the impedance is not lowered like a junction type. The semiconductor device is advantageous in that it does not require separation between devices, and is suitable for high density integration.
이러한 반도체 장치에는 모스형 전계효과트랜지스터에서 아날로그 신호를 디지털 신호로 변화시켜야 하는 옵션프로세스가 적용되는 경우에 디지털부분인 트랜지스터(Transistor) 영역을 형성하면서 동시에 아날로그(Analogue) 회로용으로 사용되는 커패시터(Capacitor) 영역이 형성된 아날로그형 반도체소자를 제조하여 사용하고 있으며, 본 발명은 아날로그 회로용으로 사용되는 커패시터의 특성을 개선시킨 새로운 발명을 제안하고 있다.In such a semiconductor device, a capacitor used for an analog circuit while forming a transistor region, which is a digital part, when an option process for converting an analog signal into a digital signal is applied in a MOS type field effect transistor. The present invention proposes a new invention that improves the characteristics of capacitors used for analog circuits.
도 1은 종래의 아날로그 반도체장치의 공정 단면을 개략적으로 예시하여 보인 도면으로서, 종래의 공정은 반도체기판(1)에 필드산화막(2)을 형성하여 커패시터영역(디지털 부분)과 트랜지스터영역(트랜지스터 부분)을 분리시키고, 그 결과물 상에 게이트산화막(3)을 형성하고, 이 게이트산화막(3)상에 트랜지스터 영역의 게이트전극인 동시에 커패시터 영역의 하부전극으로 사용되는 제1폴리실리콘층(4) 및 텅스텐실리사이드층(5)을 연속적으로 도포하여 형성한다.1 is a schematic cross-sectional view of a conventional analog semiconductor device. In the conventional process, a field oxide film 2 is formed on a semiconductor substrate 1 to form a capacitor region (digital portion) and a transistor region (transistor portion). ), The gate oxide film 3 is formed on the resultant, and the first polysilicon layer 4 used as the gate electrode of the transistor region and the lower electrode of the capacitor region on the gate oxide film 3 and It is formed by applying the tungsten silicide layer 5 continuously.
그리고, 계속하여 상기 텅스텐실리사이드층(5) 상에 커패시터 영역의 하부전극의 절연을 방지하면서 폴리사이드게이트 마스크 작업시 노광공정에서 조사되는 빛의 반사를 방지하기 위한 버퍼폴리실리콘막(6)을 적층하고서 그 위에 커패시터 영역에서 상부전극으로 사용되는 유전체산화막(7) 및 제2폴리실리콘층(8)을 연속하여 도포한다.Subsequently, a buffer polysilicon film 6 is laminated on the tungsten silicide layer 5 to prevent reflection of light irradiated in the exposure process during the polyside gate mask operation while preventing insulation of the lower electrode of the capacitor region. Then, the dielectric oxide film 7 and the second polysilicon layer 8 used as the upper electrode in the capacitor region are successively applied thereon.
그 이후에 마스킹 공정을 통하여 커패시터 영역의 제2폴리실리콘층(8)을 식각하게 되면, 트랜지스터 영역에 있던 제2폴리실리콘층(8), 유전체산화막(7)을 식각으로 제거하여 버퍼폴리실리콘막(6)을 노출시킨 후 측면부분에 스페이서막을 적층하여 게이트전극과 커패시터전극을 형성하도록 한다.Subsequently, when the second polysilicon layer 8 in the capacitor region is etched through the masking process, the second polysilicon layer 8 and the dielectric oxide film 7 in the transistor region are etched to remove the buffer polysilicon layer. After exposing (6), a spacer film is laminated on the side portions to form a gate electrode and a capacitor electrode.
그리고, 상기 결과물 상에 제1절연막(9)을 적층한 후에 마스킹식각으로 콘택홀을 형성하고, 그 콘택홀에 금속을 몰입시켜 식각으로 금속배선(10)을 형성하게 된는 것이다.After the first insulating layer 9 is stacked on the resultant, a contact hole is formed by masking etching, and the metal wiring 10 is formed by etching the metal into the contact hole.
그런데, 상기한 바와 같이, 종래의 필드산화막은 LOCOS(Local Oxidation Of Silicon)공정 혹은 PBL(Poly Buffered LOCOS)공정에 의하여 형성되므로 반도체기판으로 부터 필드산화막 두께의 상당부분이 상부로 돌출되어지고, 그 필드산화막 상에 커패시터가 형성되므로 결과적으로 높은 위상차를 갖는 상태에서 커패시터의 상층부위에 금속배선이 형성되는 공정을 진행하게 되면, 빽엔드(Back-End)공정중에서 특히, 마스크 공정진행시에 마스크의 균일도가 나빠져서 마스크의 형성상태가 불량하여지는 문제를 지니고 있었으며, 연이어서 진행되는 식각공정시에 커패시터의 상부전극이 높은 위상차로 인하여 공격(Attack)을 받아서 커패시터가 파손되는 문제를 지니고 있었다.As described above, the conventional field oxide film is formed by a local oxide of silicon (LOCOS) process or a poly buffered LOCOS (PBL) process, so that a substantial portion of the thickness of the field oxide film protrudes upward from the semiconductor substrate. Since the capacitor is formed on the field oxide film, as a result, when the metal wiring is formed on the upper layer of the capacitor in a state having a high phase difference, the uniformity of the mask during the back-end process, in particular, during the mask process It had a problem that the formation of the mask is poor due to the deterioration, and the capacitor was damaged due to the attack due to the high phase difference in the upper electrode of the capacitor during the subsequent etching process.
따라서, 상기 게이트전극과 커패시터전극의 단차를 줄이기 위하여 트랜지스터의 패터닝시에 반사방지막(ARC Layer)을 사용하게 되지만, 트랜지스터가 초소형화 되어짐에 따라 반사방지막을 사용하는 것에도 한계가 왔으며, 이를 보다 개선하기 위하여 반사방지막으로 흡수율이 높은 물질을 사용하다가 보면, 거의 Semi-절연체에 가까운 물질을 사용하게 되므로 이에 따른 누설전류효과에 의하여 아날로그반도체소자의 커패시터의 특성을 열화시켜 소자의 신뢰성을 저하시키는 단점을 지니고 있었다.Therefore, in order to reduce the difference between the gate electrode and the capacitor electrode, an ARC layer is used at the time of patterning of the transistor. However, as the transistor is miniaturized, there is a limit to using an antireflection film. In order to prevent the antireflection film from being used, a material with a high absorption rate is used, and a material almost close to a semi-insulator is used. Therefore, the leakage current effect deteriorates the characteristics of the capacitor of the analog semiconductor device. I had it.
본 발명의 목적은 트랜지스터영역및 커패시터영역에 제1폴리실리콘층, 텅스텐실리사이드층 및 유전체산화막등을 적층하여 커패시터의 하부전극 과 트랜지스터의 게이트전극으로 이용하고, 그 이외에 커패시터영역에 유전체산화막 및 제2폴리실리콘층을 커패시터의 상부전극으로 사용하고 그 위에 버퍼산화막 및 반사방지막을 적층한 후 시각으로 게이트전극 및 커패시터전극을 형성하고서 제1절연막을 적층하고 단차를 줄이도록 식각하여 그 위에 제2절연막을 적층한 후에 금속배선을 형성하므로 트랜지스터영역과 커패시터영역의 단차를 없애도록 하여 아날로그소자의 특성을 향상시키는 것이 목적이다.An object of the present invention is to laminate a first polysilicon layer, a tungsten silicide layer and a dielectric oxide film in a transistor region and a capacitor region, and to use it as a lower electrode of a capacitor and a gate electrode of a transistor. The polysilicon layer is used as the upper electrode of the capacitor, the buffer oxide film and the anti-reflection film are stacked thereon, and then the gate electrode and the capacitor electrode are formed at a time, the first insulating film is laminated, and the second insulating film is etched to reduce the step. Since the metal wiring is formed after the lamination, the object is to improve the characteristics of the analog device by eliminating the step between the transistor region and the capacitor region.
도 1은 종래의 일반적인 아날로그 반도체소자의 구성 단면을 보인 도면이고,1 is a view showing a cross-sectional view of a conventional analog semiconductor device,
도 2(a) 내지 도 2(h)는 본 발명에 따른 아날로그 반도체소자를 제조하는 방법을 순차적으로 보인 도면이다.2 (a) to 2 (h) are views sequentially showing a method of manufacturing an analog semiconductor device according to the present invention.
*도면의 주요 부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
20 : 반도체기판 25 : 필드산화막20: semiconductor substrate 25: field oxide film
30 : 게이트산화막 35 : 제1폴리실리콘층30 gate oxide film 35 first polysilicon layer
40 : 텅스텐실리사이드층 45 : 버퍼폴리실리콘막40: tungsten silicide layer 45: buffer polysilicon film
50 : 유전체산화막 55 : 제2폴리실리콘층50 dielectric oxide film 55 second polysilicon layer
60 : 감광막 65 : 버퍼산화막60: photosensitive film 65: buffer oxide film
70 : 반사방지막 75 : 스페이서막70: antireflection film 75: spacer film
80 : 제1절연막 85 : 제2절연막80: first insulating film 85: second insulating film
90 : 금속배선90: metal wiring
이러한 목적은 필드산화막이 형성된 반도체기판상에 게이트산화막, 제1폴리실리콘층, 텅스텐실리사이드층 및 버퍼폴리실리콘막을 순차적으로 적층하는 단계와; 상기 버퍼폴리실리콘막상에 유전체산화막과 제2폴리실리콘층을 형성한 후 커패시터가 형성될 부분에 감광막을 적층하고 패터닝하여 커패시터의 상부전극을 형성하는 단계와; 상기 결과물의 전면에 버퍼산화막과 반사방지막을 적층하는 단계와; 상기 반사방지막 상에 감광막을 적층하여 식각으로 패터닝한 후 게이트전극과 커패시터전극을 형성하고, 게이트전극에 이온을 주입하여 소오스/드레인영역을 형성한 후 게이트전극과 커패시터전극에 스페이서막을 형성하는 단계와; 상기 결과물에 제1절연막을 적층한 후 트랜지스터영역과 커패시터영역간의 단차를 줄이기 위하여 커패시터전극의 제2폴리실리콘층까지 노출되도록 평탄화하는 단계와; 상기 결과물상에 제2절연막을 적층하여 제1,제2절연막에 콘택홀을 형성한 후 게이트전극의 활성영역과 커패시터전극으로 연결되는 금속배선을 형성하는 단계로 이루어진 아날로그반도체소자의 제조방법을 제공함으로써 달성된다.The object is to sequentially deposit a gate oxide film, a first polysilicon layer, a tungsten silicide layer and a buffer polysilicon film on a semiconductor substrate on which a field oxide film is formed; Forming a dielectric oxide film and a second polysilicon layer on the buffer polysilicon film, and then stacking and patterning a photoresist on a portion where the capacitor is to be formed to form an upper electrode of the capacitor; Stacking a buffer oxide film and an anti-reflection film on the entire surface of the resultant product; Forming a gate electrode and a capacitor electrode after forming a photoresist film on the anti-reflection film by etching, forming a source / drain region by implanting ions into the gate electrode, and forming a spacer film on the gate electrode and the capacitor electrode; ; Stacking the first insulating layer on the resultant and then planarizing the semiconductor substrate to be exposed to the second polysilicon layer of the capacitor electrode in order to reduce the step difference between the transistor region and the capacitor region; Forming a contact hole in the first and second insulating layers by stacking a second insulating layer on the resultant, and then forming a metal wiring connected to the active region of the gate electrode and the capacitor electrode. Is achieved.
그리고, 상기 제2폴리실리콘층은 제1폴리실리콘층보다 더 두껍게 형성하도록 하고, 상기 반사방지막은 실리콘이 풍부한 옥시나이트라이드물질 혹은 금속성물질이며, 상기 제1절연막을 연마하는 공정은 화학기계적연마공정으로 이루어지도록 한다.The second polysilicon layer is formed to be thicker than the first polysilicon layer, and the anti-reflection film is an oxynitride material or a metallic material rich in silicon, and the polishing of the first insulating film is a chemical mechanical polishing process. To be done.
이하, 첨부한 도면을 참조하여 본 발명의 바람직한 일실시예에 대해 상세하게 설명하고자 한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
도 2(a) 내지 도 2(h)는 본 발명에 따른 아날로그 반도체소자를 제조하는 방법을 순차적으로 보인 도면이다.2 (a) to 2 (h) are views sequentially showing a method of manufacturing an analog semiconductor device according to the present invention.
도 2(a) 및 도 2(b)는 필드산화막(25)이 형성된 반도체기판(20)상에 게이트산화막(30), 제1폴리실리콘층(35), 텅스텐실리사이드층(40) 및 버퍼폴리실리콘막(45)을 순차적으로 적층하는 상태를 도시하고 있다.2 (a) and 2 (b) show a gate oxide film 30, a first polysilicon layer 35, a tungsten silicide layer 40 and a buffer poly on the semiconductor substrate 20 on which the field oxide film 25 is formed. The state in which the silicon films 45 are sequentially stacked is shown.
도 2(c)는 상기 버퍼폴리실리콘막(45)상에 유전체산화막(50)과 충분한 두께를 갖도록 제2폴리실리콘층(55)을 형성하는 상태를 도시하고 있다.FIG. 2C illustrates a state in which the second polysilicon layer 55 is formed on the buffer polysilicon film 45 to have a sufficient thickness with the dielectric oxide film 50.
도 2(d)는 상기 제2폴리실리콘층(55)상에 커패시터가 형성될 부분에 감광막(60)을 적층하고 식각으로 패터닝하여 커패시터의 상부전극을 형성하는 상태를 도시하고 있다.FIG. 2 (d) illustrates a state in which the photoresist layer 60 is stacked on the second polysilicon layer 55 on which the capacitor is to be formed and patterned by etching to form an upper electrode of the capacitor.
도 2(e)는 상기 감광막(60)을 제거하고 이 결과물의 전면에 버퍼산화막(65)과 반사방지막(70)을 적층하는 상태를 도시하고 있으며, 이 반사방지막(70)은 실리콘이 풍부한 옥시나이트라이드물질 혹은 금속성물질을 사용하도록 한다.FIG. 2 (e) shows a state in which the photoresist film 60 is removed and the buffer oxide film 65 and the antireflection film 70 are stacked on the entire surface of the resultant product. Use nitrides or metals.
도 2(f)는 상기 반사방지막(70)상에 감광막을 적층하여 식각으로 패터닝한 후 디지털부분의 게이트전극(a)과 아날로그부분의 커패시터전극(b)을 형성하고, 게이트전극에 이온을 주입하여 소오스/드레인영역을 형성한 후 게이트전극과 커패시터전극에 스페이서막(75)을 형성하는 상태를 도시하고 있다.FIG. 2 (f) illustrates that the photoresist film is stacked on the anti-reflection film 70 and patterned by etching, thereby forming the gate electrode a of the digital part and the capacitor electrode b of the analog part, and implanting ions into the gate electrode. The spacer film 75 is formed on the gate electrode and the capacitor electrode after the source / drain regions are formed.
도 2(g)는 상기 결과물에 제1절연막(80)을 적층한 후 트랜지스터영역과 커패시터영역간의 단차를 줄이기 위하여 커패시터전극(b)의 제2폴리실리콘층(55)까지 노출되도록 화학기계적연마(Chemical Mechanical Polishing)방법으로 평탄화하는 상태를 도시하고 있다.FIG. 2 (g) shows chemical mechanical polishing to expose the second polysilicon layer 55 of the capacitor electrode b to reduce the step between the transistor region and the capacitor region after stacking the first insulating layer 80 on the resultant. The state of planarization by Chemical Mechanical Polishing) is shown.
도 2(h)는 상기 결과물 상에 제2절연막을 적층하여 제1,제2절연막(80)(85)에 콘택홀을 형성한 후 게이트전극(a)의 활성영역과 커패시터전극(b))으로 연결되는 금속배선을 형성하는 상태를 도시하고 있다.FIG. 2 (h) shows a contact hole formed in the first and second insulating films 80 and 85 by stacking a second insulating film on the resultant, and then the active region of the gate electrode a and the capacitor electrode b). The state of forming a metal wiring connected to the figure is illustrated.
상기한 바와 같이 본 발명에 따른 아날로그반도체소자의 제조방법을 이용하게 되면, 트랜지스터영역및 커패시터영역에 제1폴리실리콘층, 텅스텐실리사이드층 및 유전체산화막등을 적층하여 커패시터의 하부전극과 트랜지스터의 게이트전극으로 이용하고, 그 이외에 커패시터영역에 유전체산화막 및 제2폴리실리콘층을 커패시터의 상부전극으로 사용하고 그 위에 버퍼산화막 및 반사방지막을 적층한 후 식각으로 디지털부분의 게이트전극 및 아날로그부분의 커패시터전극을 형성하고서 제1절연막을 적층하고 단차를 줄이도록 식각하여 그 위에 제2절연막을 적층한 후에 금속배선을 형성하므로 전체적으로 트랜지스터영역과 커패시터영역의 단차를 없애므로 커패시터전극의 열화를 방지하여 아날로그소자의 전기적인 특성을 향상시키도록 하는 매우 유용하고 효과적인 발명이다.As described above, when the method of manufacturing the analog semiconductor device according to the present invention is used, a first polysilicon layer, a tungsten silicide layer, a dielectric oxide film, etc. are stacked in the transistor region and the capacitor region, so that the lower electrode of the capacitor and the gate electrode of the transistor are stacked. In addition, the dielectric oxide film and the second polysilicon layer are used as the upper electrode of the capacitor in the capacitor region, and the buffer oxide film and the anti-reflection film are stacked thereon, and the gate electrode of the digital part and the capacitor electrode of the analog part are etched by etching. After forming the first insulating film and the etching to reduce the step difference, the second insulating film is stacked thereon to form a metal wiring, thereby eliminating the step between the transistor region and the capacitor region as a whole to prevent deterioration of the capacitor electrode to prevent the electrical Every single one to improve Useful and is an effective invention.
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