KR100311810B1 - Layer type lower case of isolator - Google Patents

Abstract

The present invention simplifies the manufacturing process by releasing the mechanical structure, integrally forming the metal structure serving as the input / output and the ground electrode and the nonmetal structure for providing the receiving opening of each element, and at the same time, miniaturizing and reducing the weight. A stacked bottom case of an irreversible element capable of pursuing the present invention. The stacked bottom case of an irreversible element into which internal terminals, dielectric elements, and chip resistors are inserted, the lower case is formed of a plurality of greens having a predetermined thickness having insulating properties. After laminating and crimping the sheet, a base sheet having a ground electrode pattern and an input / output electrode pattern printed on the upper surface thereof, and a base sheet having an input / output terminal and a ground terminal electrically connected to the ground electrode pattern and the input / output electrode pattern through the through holes on the lower surface thereof, respectively And, to be sequentially stacked on top of the base sheet, the mouth of the layer directly below through the through hole on the upper surface One or more first green sheets printed with an input / output electrode pattern electrically connected to the output electrode pattern, and having a predetermined device insertion hole formed thereon, and sequentially stacked on the first green sheets, the inside of which is punched leaving only a predetermined distance from the edge. It is formed by sequentially stacking one or more second green sheets.

Description

Stacked lower case of irreversible devices {LAYER TYPE LOWER CASE OF ISOLATOR}

The present invention relates to a lower case of an irreversible device, and more particularly, to a multilayered bottom case of an irreversible device capable of reducing the soldering area and increasing the reliability of the product while simplifying the manufacturing process to increase product productivity and miniaturization. .

In general, an irreversible element (isolator or circulator) is inserted between a power amplifier module for amplifying a transmission signal of a wireless communication device and an antenna switch connected to an antenna for switching a transmission / reception signal and reflected from the antenna switch. It is used to protect the power amplifier module by absorbing the transmission signal.

As shown in FIG. 1, the irreversible element includes a cover case 1 made of a metal material, a ferromagnetic material 2 inserted into the cover case 1 and generating a static magnetic field by an input current, and the Located at the bottom of the ferromagnetic material (2) and connected to the internal terminal portion (3) and the inner terminal portion (3), which is provided with an internal terminal such as input and output and ground, along with the garnet ferrite to generate an induction magnetic field, respectively, The lower end of the chip resistor 4 and the dielectric elements 5a, 5b, 5c connected to the ground electrode, the through hole into which the inner terminal part 3 is inserted, and the chip resistor 4 and the dielectric element 5a, An injection case in which an accommodating part accommodating 5b and 5c and a ground electrode 7 and an input / output electrode 8 and 9 are connected to the accommodating part of the chip resistor 4 and the dielectric elements 5a, 5b and 5c. 6) and outside the injection case 6 to shield the magnetic field and protect the device. Cheap and constituted by the upper case 1 and the lower case 10 of metallic material is solder.

In the conventional non-reciprocal element as described above, the lower case is composed of an injection case 6 and a lower case 7 in which an accommodating part and an electrode are formed, and an injection case 6 in which the accommodating part and an electrode is formed. After bonding the ground frame made of a metal material on the base substrate, and then bonding the injection case of the plastic material formed in each of the elements, that is, the housing formed with the insertion hole into which the chip resistance, the dielectric element and the inner terminal portion is inserted, and then again The lower case of the metal material surrounds the outside of the injection case.

However, the conventional injection case manufactured on the basis of the injection molding as described above has many difficulties in manufacturing due to its structure or mechanical defects.

In particular, in the case of high-frequency circuit components, the soldering joint in the stripline inevitably increases the joint resistance, which is very sensitive to the product characteristics, and also causes spot welding and solder reflow in the process. By repeating the process, the insertion element is adversely affected.

In particular, the injection case with the insert structure uses an LCP, which is an injection resin, based on a frame treated with Ag plating on a bronze material that maintains an internal shape, and a high temperature LCP (about 300 to 400 ° C.) resin is also used. The mechanical strength is very weak due to the repetition of the solder reflow process as described above, and the plating of the frame is also changed, which causes many problems in soldering characteristics and reliability of the device.

As described above, the conventional case based on insert injection molding has a complicated manufacturing process due to excessive generation of solder parts, deterioration of reliability due to impact due to soldering defects generated during soldering, and an increase in the number of parts. It is accompanied with the same manufacturing difficulties, and the injection case formed of resin such as LCP, PVB, etc. is hard to be hardened by repeated solder reflow during manufacturing, so it is very vulnerable to impact and difficult to be miniaturized due to the technical limitations of the injection case manufacturing. In addition, there is a problem that expensive mechanical equipment required for injection molds and the like is difficult and mass production is difficult.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to avoid the mechanical structure containing a number of problems, to provide a metal structure and the storage port of each element to be input and output and ground electrode Simultaneously forming a non-metallic structure for the purpose of simplifying the manufacturing process, it is to provide a laminated lower case of the irreversible device that can seek miniaturization and lightening.

1 is an exploded perspective view showing the configuration of a general irreversible device.

FIG. 2A is an exploded perspective view of a stacked lower case of a single product according to an embodiment of the present invention, and FIG. 2B is a side cross-sectional view of a lower case completed by laminating each green sheet (SHEET) shown in FIG. 2A.

Figure 3a is an exploded perspective view of a stacked lower case unit according to another embodiment of the present invention, Figure 3b is a side cross-sectional view showing a state in which the device is inserted into the stacked lower case formed by Figure 3a.

* Description of the symbols for the main parts of the drawings *

30, 40: green sheet

31a, 32a, 41a, 42a, 43a: input / output electrode pattern

31b, 41b, 42b: ground electrode pattern

31c, 41c: I / O terminal

31d, 41d: Ground terminal

As a technical means for achieving the above object of the present invention, the present invention is a laminated bottom case of an irreversible device for inserting the internal terminal, the dielectric element and the chip resistor,

The lower case

After stacking and compressing a plurality of green sheets having a predetermined thickness having an insulating property, a ground electrode pattern and an input / output electrode pattern are printed on an upper surface thereof, and electrically connected to the ground electrode pattern and an input / output electrode pattern on a lower surface thereof through through holes, respectively. A base sheet formed with an input / output terminal and a ground terminal,

One or more first green sheets stacked on top of the base sheet, one or more first green sheets printed on the upper surface of the base sheet and having an input / output electrode pattern electrically connected to the input / output electrode patterns directly below the through-holes;

The first green sheet is sequentially stacked on the inside, and the inside thereof is formed by sequentially laminating one or more punched second green sheets leaving only a predetermined distance from the edge.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

Figure 2a is an exploded perspective view of a laminated bottom case according to the present invention, as shown, the laminated bottom case according to the present invention after the plurality of green sheets are laminated and pressed and then the ground electrode pattern 21b and the input and output on the upper surface The electrode pattern 22a is printed and the input / output terminal 21c and the ground terminal 21d are electrically connected to the ground electrode pattern 21b and the input / output electrode pattern 22a through the through holes, respectively. The base sheet 21 and a plurality of base sheets 21 are stacked on top of the base sheet 21 to form an input / output electrode unit together with the outer wall of the case, and the same position as the input / output electrode pattern 21a of the base sheet 21 on the upper surface thereof. A first green sheet 22 printed with an input / output electrode pattern 22a and a through-hole formed in the input / output electrode pattern 22a to be electrically connected to a lower electrode pattern and punched in a predetermined shape; First Green City Consists of a 22 second green sheet (23a) to the upper number of dogs are sequentially stacked is formed a through-hole (23a) of the rectangle formed by the outer wall of the case.

Fig. 2A is a side cross-sectional view after inserting an element (i.e., an internal terminal portion, a dielectric element, and a chip resistor) into a lower case formed by stacking each sheet shown in Fig. 2A, and shows the strip line of the internal terminal portion 24; The uppermost input / output electrode pattern 22a to be bonded is electrically connected to the input / output terminal 21c outside the case through the through hole, and the ground electrode pattern 21b to which each element is bonded is also connected through the through hole as described above. It is electrically connected to the external ground terminal 21d. Therefore, the electric signal input and output to the outside becomes possible.

In addition, the lower case 200 formed according to the above embodiment has a lower junction surface height of the dielectric element 25 inserted into the lower case 200 than the height of the upper input / output electrode pattern 22a. The strip line 24a of the inner terminal portion 24 is bent.

Accordingly, FIG. 3 illustrates an example in which a lower case is formed such that the dielectric element and the input / output electrode can be joined to the strip line of the inner terminal portion at parallel heights.

Figure 3a is a perspective view showing a unitary structure of a laminated lower case according to another embodiment of the present invention, as shown in the laminated lower case is laminated with a plurality of green sheets after pressing the ground electrode pattern (31b) on the upper surface And an input / output electrode pattern 31a and an input / output terminal 31 and a ground terminal 31d electrically connected to each of the ground electrode pattern 31b and the input / output electrode pattern 31a by a through hole on opposite surfaces thereof. Formed base sheet 31 and a plurality of stacked on the base sheet 31 to form an insertion hole of the inner terminal to form an insertion hole (32c) of the size enough to insert the inner terminal portion in the center portion A first green sheet 32 printed with an input / output electrode pattern 32a and a ground electrode pattern 32b electrically connected to a lower input / output electrode pattern and a ground electrode pattern through a through hole, and the first green sheet 32. On top of) A second green sheet which is layered to form an insertion hole of a dielectric element together with an outer wall and is printed with an input / output electrode pattern 33a electrically connected to another electrode pattern underlying therethrough through a through hole and punched in a rectangle inside thereof. 33) and one or more stacked on top of the second green sheet 33 to form an outer wall, and the third green sheet 34 punched in a rectangle leaving only a predetermined thickness at an edge thereof.

In the lower case of the irreversible device formed by sequentially stacking the green sheets shown in FIG. 3A, as illustrated in FIG. 3B, the strip line 36a of the inserted internal terminal part 36 is formed of the dielectric element 35 (or the chip). Resistor) and the I / O electrode pattern 33a parallel to the upper surface of the dielectric element 35, and the ground electrode pattern 32b to which the lower surface of the dielectric element 35 is bonded, or the I / O electrode pattern to which the strip line 36b is bonded. 33a) is electrically connected to the input / output terminal 31c and the ground electrode 31d formed outside the case through the through hole, thereby enabling the input and output of the electric signal.

As described above, the lower case according to the present invention is a basic concept that is formed by stacking a plurality of green sheets punched in a predetermined shape and printed with a pattern to form an electrode and a receiving structure at once, the basic material of the lower case according to the present invention Phosphorus green sheet is manufactured as follows.

First, a binder (i.e., a polymeric binder such as MSI, PBV, acrylic, etc.) is added to a powder obtained by grinding a ceramic material (i.e., Al203, soft-ferrite package case, LTCC, etc.) to 0.1 to 10 µm. ), Defoaming is carried out to remove internal bubbles. At this time, in order to activate the gelation of the product, antifoaming agents, surfactants and the like may be added in nature. However, for ceramic materials, select materials that can be electrically insulated at room temperature and have no magnetic properties. In addition, the gelled ceramic binder mixture is manufactured into a sheet through a tape casting process. The sheet thus manufactured is referred to as green sheet, and the thickness of the green sheet is preferably produced within the range of 10 μm to 1 mm. The green sheet thus manufactured has no magnetism at room temperature, maintains an insulating state, and has a dielectric constant of ε _r = 5000 or less.

After forming a hole of a predetermined shape using a punch or a drill and printing a predetermined electrode pattern on the green sheet manufactured according to the design, and then fabricating a lower case by stacking and compressing several sheets according to the order. will be.

The process of manufacturing the lower case by processing the green sheet will be described with reference to FIGS. 2 and 3 described above.

In the accompanying drawings, the base sheet necessary for both embodiments is cut to a predetermined length of the green sheet fabricated as described above, and several sheets are laminated and compressed to have a predetermined thickness (for example, 50 μm). To 5 mm).

2A or 3B are printed on the base sheet and the other green sheets as shown in FIG. 2A or 3B, respectively, so that the electrode patterns are repeated at regular intervals, and through-holes and element insertion holes are formed in each of the base sheets and the green sheet. Each sheet processed as described above is laminated in the order shown, and when lamination is completed, after pressing, forming a separation groove, or by cutting, to produce a plurality of lower cases at a time. When the lamination and cutting process is completed, firing is performed, in which the firing is carried out in the range of 500 ~ 1900 ℃, depending on the material, it is carried out in nitrogen, hydrogen atmosphere. The finished product is baked to form a coating of conductive metal (Ag, Au) through a plating process. At this time, a step of attaching an arbitrary metal object to the contact surface in contact with the upper case to improve the bonding force and the magnetic shield with the upper case may be added.

After the process is completed, it may be separated and used in an irreversible device assembly process, or assembly may be performed in a package array state.

The shape of the electrode pattern and the element insertion hole formed on the green sheet can be variously modified according to the design and the demand of the consumer.

In the above example, the electrode patterns formed on the green sheets are separated through the through holes, but may be connected to the outer side of the case without forming the through holes.

According to the present invention as described above, it is possible to manufacture a large number of lower cases at a low cost, and can exhibit excellent mechanical and thermal properties. In addition, by using a through hole for the electrical connection between the electrodes inside the case, the solder portion can be reduced and the space inside the case can be reduced, so that it can be made smaller and the ceramic element made of the green sheet absorbs heat from the inside. By increasing the reliability of the product, it is possible to increase the productivity of the product by a simple manufacturing process, there is no need for expensive injection mold equipment as in the prior art has an excellent effect of reducing the manufacturing cost.

In addition, by slightly changing the design, the position of the stripline of the internal terminal inserted into the center of the case can be fixed, and the device and the input / output end can be positioned horizontally, so that soldering between devices is easy and product stability is improved. There is an excellent effect that can be secured.

Claims (3)

In a stacked lower case of an irreversible device in which an internal terminal, a dielectric element, and a chip resistor are inserted, The lower case After stacking and compressing a plurality of green sheets having a predetermined thickness having an insulating property, a ground electrode pattern and an input / output electrode pattern are printed on an upper surface thereof, and electrically connected to the ground electrode pattern and an input / output electrode pattern on a lower surface thereof through through holes, respectively. A base sheet formed with an input / output terminal and a ground terminal, One or more first green sheets stacked on top of the base sheet, one or more first green sheets printed on the upper surface of the base sheet and having an input / output electrode pattern electrically connected to the input / output electrode patterns directly below the through-holes; Stacked sequentially on the first green sheet, the inside of the laminated lower case of the irreversible device, characterized in that formed by laminating one or more punched second green sheet in sequence leaving only a predetermined distance from the edge. The method of claim 1, The stacked lower case of the irreversible device An inner terminal insertion hole having the same diameter as an inner terminal is formed between the base sheet and the first green sheet, and an input / output electrode pattern and ground electrically connected to the electrode pattern on the green sheet positioned below the through hole through the periphery thereof. Stacked lower case of the irreversible device, characterized in that for stacking at least one green sheet printed with the electrode pattern. The method according to claim 1 and 2, After the green sheet is fired, it is not magnetic at room temperature and maintains an insulating state. The green sheet is gelled by adding a binder to ceramic powder having a dielectric constant of ε _r = 5000 or less, and then taped (TAPE CASTING) to 10㎛. Stacked lower case of the irreversible device, characterized in that the sheet is made of ~ 5㎜ thick.