KR100304649B1 - 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 - Google Patents

집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 Download PDF

Info

Publication number
KR100304649B1
KR100304649B1 KR1019990003376A KR19990003376A KR100304649B1 KR 100304649 B1 KR100304649 B1 KR 100304649B1 KR 1019990003376 A KR1019990003376 A KR 1019990003376A KR 19990003376 A KR19990003376 A KR 19990003376A KR 100304649 B1 KR100304649 B1 KR 100304649B1
Authority
KR
South Korea
Prior art keywords
image
package
lead pin
input means
image input
Prior art date
Application number
KR1019990003376A
Other languages
English (en)
Korean (ko)
Other versions
KR20000054979A (ko
Inventor
김재선
조용철
Original Assignee
윤종용
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019990003376A priority Critical patent/KR100304649B1/ko
Priority to CN00100744A priority patent/CN1264169A/zh
Priority to JP2000025651A priority patent/JP2000228579A/ja
Publication of KR20000054979A publication Critical patent/KR20000054979A/ko
Application granted granted Critical
Publication of KR100304649B1 publication Critical patent/KR100304649B1/ko

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646Soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019990003376A 1999-02-02 1999-02-02 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 KR100304649B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019990003376A KR100304649B1 (ko) 1999-02-02 1999-02-02 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치
CN00100744A CN1264169A (zh) 1999-02-02 2000-02-02 用于检测集成电路封装引脚焊接的装置和方法
JP2000025651A JP2000228579A (ja) 1999-02-02 2000-02-02 集積回路パッケ―ジのリ―ドハンダ付け検査方法及び検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990003376A KR100304649B1 (ko) 1999-02-02 1999-02-02 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치

Publications (2)

Publication Number Publication Date
KR20000054979A KR20000054979A (ko) 2000-09-05
KR100304649B1 true KR100304649B1 (ko) 2001-09-13

Family

ID=19573065

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990003376A KR100304649B1 (ko) 1999-02-02 1999-02-02 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치

Country Status (3)

Country Link
JP (1) JP2000228579A (zh)
KR (1) KR100304649B1 (zh)
CN (1) CN1264169A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101497947B1 (ko) * 2013-09-10 2015-03-03 주식회사 고영테크놀러지 솔더 조인트의 검사방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005003682A1 (en) * 2003-07-08 2005-01-13 Heon Jeong Apparatus for detecting adhered portion or edge of sheet
JP2006214820A (ja) * 2005-02-02 2006-08-17 Yamaha Motor Co Ltd 基板検査装置および基板検査方法
JP2007033048A (ja) 2005-07-22 2007-02-08 Ricoh Co Ltd はんだ接合判定方法,はんだ検査方法,はんだ検査装置およびはんだ検査用プログラムならびに記録媒体
TWI320497B (en) * 2005-12-09 2010-02-11 Taiwan Tft Lcd Ass Multiple-angle imaging machine, multiple-angle inspection system and method for blemish measurement of a flat panel display
JP6396633B2 (ja) * 2012-02-15 2018-09-26 サターン ライセンシング エルエルシーSaturn Licensing LLC 回路基板
TWI470214B (zh) * 2013-10-01 2015-01-21 Utechzone Co Ltd Optical testing equipment and methods
CN104483331A (zh) * 2014-12-03 2015-04-01 东莞市神州视觉科技有限公司 一种连接器插针三维检测方法、装置及系统
CN106604628B (zh) * 2015-10-20 2019-07-12 泰科电子(上海)有限公司 用于确定电连接器的插脚的安装状态的系统
CN106338847A (zh) * 2016-10-27 2017-01-18 深圳市深科达智能装备股份有限公司 显示模组自动点亮检测机
CN106413286B (zh) * 2016-11-25 2023-03-21 深圳市易工自动化有限公司 喇叭引线自动焊接机及其控制方法
CN109490308B (zh) * 2018-09-25 2021-08-06 唐山英莱科技有限公司 一种焊缝检测装置和方法
CN109444157A (zh) * 2018-12-25 2019-03-08 苏州凡目视觉科技有限公司 一种划痕检测装置与方法
WO2021187349A1 (ja) * 2020-03-19 2021-09-23 三洋電機株式会社 密閉電池
CN116060814B (zh) * 2023-02-22 2023-06-16 江苏诺森特电子科技有限公司 一种接线的焊接工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101497947B1 (ko) * 2013-09-10 2015-03-03 주식회사 고영테크놀러지 솔더 조인트의 검사방법

Also Published As

Publication number Publication date
KR20000054979A (ko) 2000-09-05
CN1264169A (zh) 2000-08-23
JP2000228579A (ja) 2000-08-15

Similar Documents

Publication Publication Date Title
KR100304649B1 (ko) 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치
US5298977A (en) Visual inspection method for part mounted on printed circuit board
JP5421763B2 (ja) 検査装置および検査方法
US4772125A (en) Apparatus and method for inspecting soldered portions
US5208463A (en) Method and apparatus for detecting deformations of leads of semiconductor device
KR20000075764A (ko) 검사시스템
KR100281881B1 (ko) 인쇄회로기판의크림솔더검사장치및검사방법
JP4434417B2 (ja) プリント配線板の検査装置
KR20000075763A (ko) 검사방법
KR20050080442A (ko) 부품 실장기판 검사 장치
JP2000121338A (ja) 電子部品検査装置
US20020167660A1 (en) Illumination for integrated circuit board inspection
WO2003013213A2 (en) Optical inspection of solder joints
JP3309420B2 (ja) 半田ブリッジの検査方法
JP2012002681A (ja) 半田検査方法
JP2000074845A (ja) バンプ検査方法及びバンプ検査装置
JP2877061B2 (ja) コプラナリティ検査装置
WO2022113369A1 (ja) 実装基板検査装置および検査装置
JP2007242944A (ja) はんだ濡れ性評価装置およびはんだ濡れ性評価方法
KR100333222B1 (ko) 연결 볼들의 존재를 검사하기 위한 방법
KR0179758B1 (ko) 인쇄회로기판상의 부품 실장 상태 검사 방법
JP3162872B2 (ja) 電子部品の輪郭認識装置及びその輪郭認識方法
JPH03192800A (ja) プリント基板の部品実装認識方法
JPH0989525A (ja) リード肩部の位置検出方法およびリード先端部の位置検出方法
JP3030176B2 (ja) 輪郭認識方法を用いた形状検査方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee