KR100304649B1 - 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 - Google Patents
집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 Download PDFInfo
- Publication number
- KR100304649B1 KR100304649B1 KR1019990003376A KR19990003376A KR100304649B1 KR 100304649 B1 KR100304649 B1 KR 100304649B1 KR 1019990003376 A KR1019990003376 A KR 1019990003376A KR 19990003376 A KR19990003376 A KR 19990003376A KR 100304649 B1 KR100304649 B1 KR 100304649B1
- Authority
- KR
- South Korea
- Prior art keywords
- image
- package
- lead pin
- input means
- image input
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000005476 soldering Methods 0.000 claims abstract description 65
- 238000007689 inspection Methods 0.000 claims abstract description 45
- 230000003287 optical effect Effects 0.000 claims abstract description 37
- 238000005286 illumination Methods 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000519995 Stachys sylvatica Species 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990003376A KR100304649B1 (ko) | 1999-02-02 | 1999-02-02 | 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 |
CN00100744A CN1264169A (zh) | 1999-02-02 | 2000-02-02 | 用于检测集成电路封装引脚焊接的装置和方法 |
JP2000025651A JP2000228579A (ja) | 1999-02-02 | 2000-02-02 | 集積回路パッケ―ジのリ―ドハンダ付け検査方法及び検査装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990003376A KR100304649B1 (ko) | 1999-02-02 | 1999-02-02 | 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000054979A KR20000054979A (ko) | 2000-09-05 |
KR100304649B1 true KR100304649B1 (ko) | 2001-09-13 |
Family
ID=19573065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990003376A KR100304649B1 (ko) | 1999-02-02 | 1999-02-02 | 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2000228579A (zh) |
KR (1) | KR100304649B1 (zh) |
CN (1) | CN1264169A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101497947B1 (ko) * | 2013-09-10 | 2015-03-03 | 주식회사 고영테크놀러지 | 솔더 조인트의 검사방법 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005003682A1 (en) * | 2003-07-08 | 2005-01-13 | Heon Jeong | Apparatus for detecting adhered portion or edge of sheet |
JP2006214820A (ja) * | 2005-02-02 | 2006-08-17 | Yamaha Motor Co Ltd | 基板検査装置および基板検査方法 |
JP2007033048A (ja) | 2005-07-22 | 2007-02-08 | Ricoh Co Ltd | はんだ接合判定方法,はんだ検査方法,はんだ検査装置およびはんだ検査用プログラムならびに記録媒体 |
TWI320497B (en) * | 2005-12-09 | 2010-02-11 | Taiwan Tft Lcd Ass | Multiple-angle imaging machine, multiple-angle inspection system and method for blemish measurement of a flat panel display |
JP6396633B2 (ja) * | 2012-02-15 | 2018-09-26 | サターン ライセンシング エルエルシーSaturn Licensing LLC | 回路基板 |
TWI470214B (zh) * | 2013-10-01 | 2015-01-21 | Utechzone Co Ltd | Optical testing equipment and methods |
CN104483331A (zh) * | 2014-12-03 | 2015-04-01 | 东莞市神州视觉科技有限公司 | 一种连接器插针三维检测方法、装置及系统 |
CN106604628B (zh) * | 2015-10-20 | 2019-07-12 | 泰科电子(上海)有限公司 | 用于确定电连接器的插脚的安装状态的系统 |
CN106338847A (zh) * | 2016-10-27 | 2017-01-18 | 深圳市深科达智能装备股份有限公司 | 显示模组自动点亮检测机 |
CN106413286B (zh) * | 2016-11-25 | 2023-03-21 | 深圳市易工自动化有限公司 | 喇叭引线自动焊接机及其控制方法 |
CN109490308B (zh) * | 2018-09-25 | 2021-08-06 | 唐山英莱科技有限公司 | 一种焊缝检测装置和方法 |
CN109444157A (zh) * | 2018-12-25 | 2019-03-08 | 苏州凡目视觉科技有限公司 | 一种划痕检测装置与方法 |
WO2021187349A1 (ja) * | 2020-03-19 | 2021-09-23 | 三洋電機株式会社 | 密閉電池 |
CN116060814B (zh) * | 2023-02-22 | 2023-06-16 | 江苏诺森特电子科技有限公司 | 一种接线的焊接工艺 |
-
1999
- 1999-02-02 KR KR1019990003376A patent/KR100304649B1/ko not_active IP Right Cessation
-
2000
- 2000-02-02 CN CN00100744A patent/CN1264169A/zh active Pending
- 2000-02-02 JP JP2000025651A patent/JP2000228579A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101497947B1 (ko) * | 2013-09-10 | 2015-03-03 | 주식회사 고영테크놀러지 | 솔더 조인트의 검사방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20000054979A (ko) | 2000-09-05 |
CN1264169A (zh) | 2000-08-23 |
JP2000228579A (ja) | 2000-08-15 |
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