KR100300105B1 - Frame body of electronic device and the method of manufacturing the same - Google Patents

Abstract

Since the frame body 21 of the conventional electronic device is simply bent at the connecting portions 21h and 21k to form the partition wall 21g, a part of the thickness portion of the connecting portions 21h and 21k is large when the bend is divided into a large partition wall ( It is bent in the state attracted to the side 21g), and as a result, the front-end | tip part of the partition wall 21g protrudes downward from the side edge part 21m below the side walls 21a and 21b, and therefore the opening part of the frame 21 There is a problem that the covered cover is in a floating state.

The frame 1 of the electronic device of the present invention is provided with a concave portion 1n provided on the surface of the connecting portions 1h and 1k connecting the side edge portions of the side walls 1a and 1b and the side edge portions of the partition wall 1g. Since the wall 1g is bent at a right angle, when the partition wall 1g is bent, a part of the thickness portion of the connecting portions 1h and 1k is drawn to the side of the large partition wall 1g by the recess 1n. It can be prevented from entering, and therefore, the frame body of the electronic device which can be reliably attached can be provided, without the front end part of the partition wall 1g protruding from the side edge part 1m of the side wall 1a, 1b.

Description

FRAME BODY OF ELECTRONIC DEVICE AND THE METHOD OF MANUFACTURING THE SAME

The present invention relates to a frame of an electronic device such as a television tuner, and a method for manufacturing the frame of the electronic device.

11 to 12, the box-shaped frame body 21 made of a flat metal plate has a side wall facing the front side and the rear side. 21a and 21b and sidewalls 21c and 21d which are disposed opposite to the right and left sides and interposed between the sidewalls 21a and 21b, and are formed inside the box by these sidewalls 21a to 21d. The space portion 21e is formed.

In addition, the frame 21 is provided with a connecting portion 21f for connecting the side edges with each other between the front and rear side walls 21a and 21b and the right and left side walls 21c and 21d. By bending at right angles from 21f, the sidewalls 21a and 21b and sidewalls 21c and 21d forming a box shape are formed.

Moreover, the frame 21 is a rectangular connection part which connects the some partition wall 21g which partitions the space part 21e inside a box shape, and the side edge part of the side wall 21a, and the side edge part of the partition wall 21g. 21 h and the rectangular connection part 21k which connects the side edge part of the side wall 21b, and the side edge part of 21 g of partition walls are provided.

The partition wall 21g is formed by bending at right angles from the connecting portions 21h and 21k to be orthogonal to the surfaces of the side walls 21a and 21b. The partition wall 21g forms a space 21e inside the box. It is divided into a plurality of compartments.

The printed circuit board (not shown) provided with various electrical components (not shown) is accommodated in the box-shaped inside of the frame body 21 configured as described above, and the opening of the frame body 21 is covered with a cover (not shown). By covering, an electronic device is constructed.

In addition, the manufacturing method of the frame 21 as described above will be described with reference to Figs. 14 to 19. First, as shown in Fig. 14, a flat metal plate forming a hoop shape is used. The frame plate 22 is formed by punching along the outer shape of the side plate portions 22a, 22b, 22c, and 22d serving as the sidewalls 21a to 21d.

Next, the frame plate 22 is moved to the next step, as shown in FIG. 15, a predetermined hole 23 is punched into the frame plate 22 to form a partition wall 21g of the frame body 21. The partition plate part 22g used as this is formed, and the connecting plate part 22f, 22h, 22k used as the connection part 21f, 21h, 21k is formed.

Next, as shown in FIG. 16, after the grooves 24 cut between the side plate portions 22a and 22b and the partition plate portion 22g are provided, the side plate portions 22a to 22d and the partition plate portion 22g are removed. It folds and bends in the position of the bending line T shown by the dotted line.

On the other hand, when this folding method is demonstrated, as shown in FIG. 17, a pair of 1st jig 25 and a pair of 1st jig 25 for folding and bending side plate part 22c, 22d are shown. The frame plate 22 is placed on the plurality of second jigs 26 for bending and partitioning the partition plate portion 22g, and the part of the lower surface of the frame plate 22 is supported by these jig.

In this state, the plurality of third jigs 27 are lowered from the upper surface side of the frame plate 22 to contact the upper surfaces of the connecting plate portions 22f, 22h, and 22k.

Then, as shown in FIG. 18, when the 3rd jig 27 is fixed and the 1st jig 25 and the 2nd jig 26 are moved upwards simultaneously, the side plate part 22c, 22d, and a plurality of The two partition plate portions 22g start to bend at the same time at the position of the bend line T.

In addition, although illustration is abbreviate | omitted here, the side plate part 22a, 22b also starts to bend in the position of bending line T. As shown in FIG.

Then, the bending process is completed when the first and second jigs 25 and 26 are moved to the state as shown in FIG. 19 by continuing the folding and bending. Finally, the first, second and third jigs 25 And 26, 27 are returned to their original state, and the frame 21 is taken out to manufacture the frame 21.

In the manufacturing method as described above, a part of the thickness portion of the connecting plate portions 22h and 22k is bent while being drawn to the large partition plate portion 22g side during the bending step.

As a result, in Fig. 12, the tip end portion of the partition wall 21g protrudes downward from the side edge portion 21m below the side walls 21a and 21b, so that the cover covered by the opening of the frame 21 is lifted. In this case, the position of the partition wall 21g is shifted from the predetermined position in the X direction in FIG. 12, which causes a problem in the installation of the printed board in the frame body 21. As shown in FIG.

Since the partition body 21 of the conventional electronic device is simply bent at the connecting portions 21h and 21k to form the partition wall 21g, a part of the thick portion of the connecting portions 21h and 21k has a large area when bent. It is bent in the state attracted to the side of 21g, and as a result, the front end of the partition wall 21g protrudes downward from the side edge 21m below the side walls 21a and 21b, so that it is covered with the opening of the frame 21. There is a problem that the cover is lifted.

In addition, according to the above configuration, the position of the partition wall 21g is shifted in the X direction from the predetermined position, which causes a problem in the installation of the printed board in the frame body 21.

In the conventional method for manufacturing a frame body of an electronic device, the first and second jigs 25 and 26 are formed by bringing the third jig 27 into contact with the upper surfaces of the partition plates 22h and 22k. Since the bending was performed, a part of the thickness portion of the connecting plate portions 22h and 22k was bent in the state of being drawn to the large partition plate portion 22g side during the bending process, and as a result, the tip end portion of the partition wall 21g. Protrudes downward from the lower side edge portion 21m of the side walls 21a and 21b, so that the cover covered by the opening of the frame 21 is excited, or the position of the partition wall 21g is a predetermined position. There arises a problem that the frame body 21 with a good precision cannot be manufactured because it shifts from the X direction to the X direction and interferes with the installation of the printed board in the frame body 21.

1 is a perspective view of a frame of an electronic device of the present invention;

2 is a cross-sectional view taken along line 2-2 of FIG. 1;

3 is a cross-sectional view taken along line 3-3 of FIG. 1;

4 is a plan view of a frame plate part in a first state showing a method for manufacturing an electronic device frame body of the present invention;

5 is a plan view of a frame plate portion in a second state, showing a method for manufacturing an electronic device frame body of the present invention;

6 is a plan view of a frame plate part in a third state, showing a method for manufacturing an electronic device frame body of the present invention;

Fig. 7 shows a method for manufacturing the electronic device frame body of the present invention and is a first state explanatory diagram of bending of the frame plate portion;

8 shows a method for manufacturing the electronic device frame body of the present invention, and a second state explanatory diagram of the bending of the frame plate portion;

Fig. 9 shows a method for manufacturing the electronic device frame body of the present invention, and a third state explanatory diagram of the bending of the frame plate portion;

10 is a perspective view of main parts of a jig illustrating a method for manufacturing an electronic device frame body of the present invention;

11 is a perspective view of a conventional electronic device frame body,

12 is a cross-sectional view taken along a 12-12 line in FIG. 11;

FIG. 13 is a sectional view taken along the 13-13 line of FIG. 11;

14 is a plan view of a frame plate part in a first state showing a method of manufacturing a conventional electronic device frame body;

15 is a plan view of a frame plate part in a second state, showing a conventional method for manufacturing an electronic device frame body;

16 is a plan view of a frame plate portion in a third state showing a conventional method for manufacturing an electronic device frame body;

17 is an explanatory view of a first state of bending of a frame plate portion, showing a conventional method for manufacturing an electronic device frame body;

18 is an explanatory view of a second state of bending of a frame plate portion, showing a conventional method for manufacturing an electronic device frame body;

Fig. 19 shows a conventional method for manufacturing an electronic device frame body and is an explanatory diagram of a third state of bending of the frame plate portion.

※ Explanation of symbols for main parts of drawing

1: frame 1a ~ 1d: side wall

1e: space part 1f: connection part

1g: partition wall 1h: connection part

1k: Connection part 1m: Side edge

1n: recess 2: frame plate

2a to 2d: side plate portion 2f, 2h, 2k: connecting plate portion

2g: partition plate 3: hole

4: cropped groove 5: the first jig

6: second jig 7: third jig

7a: convex portion 8: fourth jig

T: Bend Line

As a first solution for solving the above problems, a plurality of side walls forming a box shape by bending a metal plate, a partition wall partitioning an inside of the box shape formed by the side walls, side edge portions of the side wall and side edge portions of the partition wall And a connecting portion for connecting the wires, the partition wall is bent at a right angle from the connecting portion so as to be orthogonal to the surface of the side wall, and a concave portion is formed on the surface of the connecting portion.

Moreover, as a 2nd solution means, the said recessed part formed in the surface of the said connection part was comprised by the concave line parallel to the said partition wall.

Further, as a third solution means, a plurality of side plate portions serving as sidewalls forming a box shape, a partition plate portion serving as a partition wall, and a connecting plate portion connecting the side plate portion and the partition plate portion are provided on a metal plate, and the connection is performed. The first jig is brought into contact with each other on one side of the plate part, and the convex part of the second jig is fitted to the other side of the connecting plate part, and the connecting plate part is fitted with the first and second jig. And the side plate part and the partition plate part as a manufacturing method of bending at a right angle from the connecting plate part.

In addition, as a fourth solution, the convex portion of the second jig is formed by a convex line parallel to the bending line of the partition plate portion, and the convex line is inserted into the connecting plate portion.

Embodiment of the Invention

1 to 10 will be described with reference to the frame of the electronic device and the manufacturing method of the electronic device frame of the present invention, Figure 1 is a perspective view of the frame of the electronic device of the present invention, Figure 2 is 2 of FIG. -Sectional drawing in 2 wire | wires, FIG. 3 is sectional drawing in the 3rd-3rd wire | wire of FIG. 1, FIGS. 3-9 are explanatory drawing which shows the manufacturing method of the electronic device frame body of this invention, FIG. It is a perspective view of the principal part of the jig which concerns on manufacture of an electronic device frame body.

Next, the structure of the frame body of the electronic device in this invention is demonstrated based on FIGS. The box-shaped frame body 1 made of a plate-shaped metal plate is disposed between the side walls 1a and 1b positioned opposite to the front side and the rear side and between the side walls 1a and 1b facing the right and left sides. The side walls 1c and 1d which are interposed are provided, and these side walls 1a-1d form the space | interval 1e which formed the box form inside.

In addition, the frame 1 is provided with a connecting portion 1f connecting the side edges to each other between the front and rear side walls 1a and 1b and the right and left side walls 1c and 1d. By bending at right angles from 1f, the box-shaped sidewalls 1a and 1b and the sidewalls 1c and 1d are formed.

In addition, the frame body 1 includes a plurality of partition walls 1g for partitioning the space portion 1e in the box shape, and a rectangular connecting portion 1h for connecting the side edges of the side walls 1a and the partition walls 1g. And a rectangular connecting portion 1k connecting the side edge portion of the side wall 1b and the side edge portion of the partition wall 1g.

The partition wall 1g is bent at right angles from the connecting portions 1h and 1k so as to be orthogonal to the surfaces of the side walls 1a and 1b, and the partition wall 1g forms the space portion 1e inside the box shape. Is divided into a plurality of compartments.

Moreover, the recessed part 1n which is a concave line parallel to the partition wall 1g is provided in the surface of the said connection part 1f, 1h, 1k of a rectangle, and this partition part 1n is provided by this recessed part 1n. And when the side walls 1a-1d are formed by bending, a part of the thickness portions of the connecting portions 1f, 1h, 1k is prevented from being drawn toward the partition wall 1g and the side walls 1c, 1d.

The concave portion 1n may be round, angular or the like in addition to the concave string.

Then, a printed circuit board (not shown) provided with various electrical components (not shown) is accommodated in the box shape of the frame body 1 configured as described above, and the opening of the frame 1 is covered with a cover (not shown). The electronics are configured.

Next, the manufacturing method of the frame body 1 of this invention which has the above structure is demonstrated based on FIG. 4 thru | or 10. First, as shown in FIG. 4, the frame body is made from the flat metal plate of the hoop shape. The frame plate 2 is formed by punching according to the outer shape of the side plate portions 2a, 2b, 2c, and 2d serving as sidewalls 1a-1d of (1).

Then, the frame plate 2 is moved to the next step, and as shown in FIG. 5, a predetermined hole 3 is punched and formed in the frame plate 2, and the partition wall 1g of the frame 1 is formed. The partition plate part 2g used is formed, and the connecting plate part 2f, 2h, 2k used as the connection part 1f, 1h, 1k is formed.

Next, as shown in FIG. 6, after the grooves 4 cut between the side plate portions 2a and 2b and the partition plate portion 2g are provided, the side plate portions 2a-2d and the partition plate portion 2g are removed. It bends at the position of the bending line T indicated by the dotted line.

Then, the bending method will be described. As shown in Fig. 7, between the pair of first jig 5 and the pair of first jig 5 for bending the side plate portions 2c and 2d. Are located between the plurality of second jigs 6 for bending the partition plate portion 2g and the pair of first jigs 5 together with the second jig 6 to connect the connecting plate portions 2f, At the position opposite to the lower surface of 2h, 2k), a plurality of third jigs 7 having convex portions 7a of convex lines as shown in Fig. 10 are provided on the upper surface, and these jigs 5, 6, 7) The frame plate 2 is placed on the top, and a part of the lower surface of the frame plate 2 is supported by these jigs 5, 6, and 7.

In this state, the plurality of fourth jigs 8 are lowered from the upper side of the frame plate 2, the fourth jig 8 is pressed against the upper surfaces of the connecting plate portions 2f, 2h, 2k, and the third jig ( The convex part 7a of 7) is inserted into the lower surface of the connection plate part 2f, 2h, 2k, and the connection plate part 2f, 2h, 2k is fitted with the 3rd jig 7 and the 4th jig 8. .

Then, as shown in Fig. 8, when the first jig 5, the second jig 6, and the third jig 7 are moved upward at the same time with the fourth jig 8 fixed, the side plate portion (2c, 2d) and the plurality of partition plate portions 2g start to bend at the same time at the position of the bend line T. FIG.

In addition, although illustration is abbreviate | omitted here, the side plate part 2a, 2b is also bent at the position of bending line T. As shown in FIG.

If the first, second, and third jigs 5, 6, and 7 are moved to the state shown in Fig. 9 after the bending, the bending process is completed, and finally, the first, second, third, When the fourth jig 5, 6, 7, 8 is returned to its original state and the frame 1 is taken out, the manufacture of the frame 1 is completed.

Moreover, in this manufacturing method, a part of the thickness part of the connection plate part 2h, 2k tries to be attracted to the side of the partition plate part 2g with a large area at the time of a bending process, but the convex part 7a of the 3rd jig 7 is carried out. Is bent in a state where the connecting plate portions 2h and 2k are fitted into the third jig 7 and the fourth jig 8 while the fitting plate portions 2h and 2k are fitted into the connecting plate portions 2h and 2k. ) Is not attracted to the partition plate portion 2g side.

As a result, in Fig. 2, the tip of the partition wall 1g does not protrude downward from the lower side edge 1m of the side walls 1a and 1b, so that the cover covered by the opening of the frame 1 is lifted. 2, the position of the partition wall 1g can be formed at a predetermined position without shifting from the predetermined position in the X direction from the predetermined position. It can be done without any problems.

The frame 1 of the electronic device of the present invention is partitioned by providing recesses 1n on the surfaces of the connecting portions 1h and 1k connecting the side edges of the side walls 1a and 1b and the side edges of the partition wall 1g. Since the wall 1g is configured to be bent at a right angle, when the partition wall 1g is bent, a part of the thickness portion of the connecting portions 1h and 1k is 1g by the concave portion 1n. It is possible to provide an electronic device frame body which can be securely installed without being protruded toward the side and thus the tip of the partition wall 1g does not protrude from the side edge 1m of the side walls 1a and 1b. have.

In addition, since the bending position of the partition wall 1g can be formed at a predetermined position by the above configuration, it is possible to provide an electronic device frame body which is free from installation of a printed board.

In addition, by forming the concave portion 1n into a concave stripe, the concave portion 1g can be supported over a wide width of the connecting portion 1g, whereby a partition wall 1g with higher precision can be formed.

In addition, in the method of manufacturing a frame body of an electronic apparatus according to the present invention, the jig 7 having the convex portion 7a is connected to the lower surface of the connecting plate portions 2h and 2k by another jig 8 again. A state in which the connecting plate portions 2h and 2k are sandwiched by two jigs 7, 8 while the convex portions 7a are inserted into the connecting plate portions 2h and 2k by contacting each other on the upper surfaces of the 2h and 2k portions. Since the partition plate portion 2g was bent in the above manner, a part of the thickness portion of the connecting plate portions 2h and 2k is attracted to the side of the large partition plate portion 2g during the bending process, but the convex portion of the jig 7 Since the connecting plate portions 2h and 2k are bent in the state where the connecting plate portions 2h and 2k are fitted into the jig 7 and the jig 8 while the 7a is fitted into the connecting plate portions 2h and 2k, the connecting plate portions 2h and 2k. ), The thickness portion of the) is not attracted to the side of the partition plate portion 2g, so that the frame body of the electronic device with high precision can be provided.

As a result, the distal end of the partition wall 1g does not protrude downward from the side edge 1m below the side walls 1a and 1b, so that the cover covered by the opening of the frame body 1 is excited. In addition, since the position of the partition wall 1g does not deviate from the predetermined position in the X direction and can be formed at the predetermined position, the printed board in the frame body 1 can be installed without any trouble. It is.

In addition, by forming the convex portion 7a of the jig 7 into a convex line, the pressing of the connecting plate portions 2h and 2k can be carried out in a wide range, so that the partition plate portion 2g of the connecting plate portions 2h and 2k is provided. It is possible to further prevent the pulling in of the electronic device frame, thereby providing an electronic device frame body having a good accuracy of bending the partition plate portion 2g.

Claims (4)

A plurality of sidewalls formed by bending a metal plate to form a box shape, a partition wall partitioning the inside of the box shape formed by the sidewalls, and a connection part connecting the side edge portion of the side wall and the side edge portion of the partition wall; The frame body of the electronic device, characterized in that formed to be bent at a right angle from the connecting portion to be orthogonal to the surface of the, and at the same time to form a recess in the surface of the connecting portion. The method according to claim 1, The concave portion formed on the surface of the connecting portion comprises a concave strip parallel to the partition wall. A plurality of side plate portions serving as sidewalls forming a box shape, a partition plate portion serving as a partition wall, and a connecting plate portion for connecting the side plate portion and the partition plate portion are provided on a metal plate, and a first jig is provided on one side of the connecting plate portion. Contact each other, and insert the convex portion of the second jig into the other side of the connecting plate portion so that the side plate portion and the partition plate portion are in a state where the connecting plate portion is fitted with the first and second jigs. The manufacturing method of the frame body of the electronic device characterized by bending at right angles from a connection plate part. The method according to claim 3, The convex portion of the second jig is formed of a convex line parallel to the bending line of the partition plate portion, and the convex portion is inserted into the connecting plate portion.