KR100299593B1 - Back lapping in-line system for semiconductor fabrication - Google Patents

Abstract

PURPOSE: A back lapping in-line system for semiconductor fabrication is provided to process a wafer polishing process such as a vinyl coating process, a backside polishing process, and a vinyl removal process by using an in-line process. CONSTITUTION: A server(124) including a program performing an in-line process is connected with a network line(120). The server(124) is connected with an in-line system(126). The server(124) exchanges necessary information for performing the in-line process with the in-line system(126). The inline system(126) is formed with a loading portion(128), the first centering portion(130), a taping laser cutting portion(132), the second centering portion(134), a grinding portion(136), a cleaning portion(138), the third centering portion(140), a UV inspection portion(142), a removal portion(144), and an unloading portion(146). A wafer is loaded on the loading portion(128) and unloaded from the unloading portion(146).

Description

Back lapping in-line system for fabrication semiconductor device

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a back lapping in-line system for semiconductor device manufacturing, and more particularly, to improve in-line a series of processes including vinyl coating, back polishing and vinyl removal processes. The present invention relates to a back wrapping inline system for manufacturing a semiconductor device.

In general, a semiconductor wafer is processed into a package, and the process of processing the semiconductor wafer into a package includes a process of polishing the back side of the wafer, and a series of unit processes including backside polishing are performed in the back wrap. (Back Lap) or back grind (Back Grind) process.

Referring to FIG. 1, a back wrap process including a back polishing process using a grinding machine is performed between a wafer fabrication process 10 and an assembly process 20, and the back wrap process is specifically a back surface pre-process. (12), the vinyl coating step 14, the back polishing step 16, the vinyl removal step 18, and the back polishing step 20 are performed in this order.

In the above-described process, the vinyl coating process 14 is to apply vinyl on top of the patterned surface before the wrap in order to protect the patterned surface of the wafer from the silicon powder generated during the subsequent backside polishing process 16, and the vinyl removal process 14 , 18) is to remove unnecessary vinyl on the wafer surface after the backside polishing process 16, which is an essential process for protecting the pattern of the wafer during the backside polishing process.

In the above-described back surface polishing process 16, the back surface of the wafer is ground by a diamond wheel, and friction heat is inevitably generated by the strong rotation of the diamond wheel during back surface polishing of the wafer, and the wafer is often bent to some extent by this frictional heat. Is generated. This is called a wrappage failure.

Lap page defects are more severe as the wafer size increases, and lap page defects can lead to improper loading or loading / unloading of the wafer during cassette loading / unloading of the wafer, which can result in severe damage to the wafer. .

In order to perform the process of FIG. 1, a facility for performing a vinyl coating process, a back surface polishing process, and a vinyl removing process is configured as shown in FIG. 2.

That is, the manual interface 32, 34, 36 is connected to the network line 30, and the manual interface 32, 34, 36 is a laminator 38 for performing vinyl coating, which is a corresponding facility, and backside polishing. The back grinder 40 for performing the operation and the remover 42 for performing the vinyl removal are connected to the network line 30.

In detail, the reiner 38 includes a loading unit 44, a pre-cut unit 46, a centering unit 48, a wire cut unit 50, and an unmounter unit. It consists of a loading unit 52. The back grinder 40 includes a loading part 54, a centering part 56, a grinding part 58, a cleaning part 60, and an unloading part 62. In addition, the remover 42 includes a loading unit 64, a centering unit 66, a UV irradiation unit 68, a removing unit 70, and an unloading unit 72.

The above-described laminator 38, back grinder 40, and eliminator 42 perform predetermined operations while communicating information with a host computer (not shown) or other facilities through respective manual interfaces 32, 34, and 36. do.

However, in the conventional apparatus for performing backside polishing of the wafer, as shown in FIG. 2, the loading unit and the unloading unit are essentially provided for each facility, that is, the laminator 38, the back grinder 40, and the remover 42. Duplicate components have been created to perform a series of successive processes.

In addition, a time delay as long as a redundant component is generated is inevitable in a conventional installation, and a temporary storage, a back grinder 40, and a remover 42 for wafer transfer between the laminator 38 and the back grinder 40 are removed. There was a need for temporary storage for wafer transfer between them, thus requiring unnecessary work space.

In addition, in the case of the wafers in which the lappage defects are generated after the polishing of the back surface of each of the above-described unit facilities, scratches or breakages are often caused depending on the degree of warpage during three loading and three unloading operations. In particular, in recent years with large wafers, this has been recognized as a serious consideration.

In other words, the conventional apparatus for performing backside polishing has a high probability of damaging the wafer because the number of times the loaded and unloaded wafers are first loaded and unloaded is high, and the second unit processes are different from each other. Since it was separated from other facilities, unnecessary storage space was required.Turn Around Time was performed because the next process was completed after each process was completed by disconnecting the continuity between facilities in the third run. There is a problem that the longer the) occurs, the lower the productivity.

SUMMARY OF THE INVENTION An object of the present invention is to provide a back lapping inline system for manufacturing a semiconductor device for inlining a vinyl coating process for backside polishing of a wafer, a backside polishing process and a vinyl removal process in a single process.

Another object of the present invention is to manufacture a semiconductor device that can reduce damage to a defective wafer wafer by reducing the transfer frequency of wafers between unit processes by inlining a vinyl coating process, a back polishing process, and a vinyl removal process for backside polishing of a wafer. To provide a back wrapping inline system for the system.

It is still another object of the present invention to provide a back lapping inline for manufacturing a semiconductor device for eliminating unnecessary storage elements between equipment for performing a unit process by inlining a vinyl coating process for backside polishing of a wafer, and a backside polishing process and a vinyl removal process. To provide a system.

It is still another object of the present invention to provide a back lapping inline system for manufacturing a semiconductor device for reducing turn around time by inlining a vinyl coating process, a back polishing process, and a vinyl removal process for backside polishing of a wafer. There is.

1 is a process diagram showing a process including a back lapping process for manufacturing a conventional semiconductor device.

2 is a block diagram of a system for performing a conventional back lapping process.

3 is a process diagram showing a process including an inline process for back lapping according to the present invention.

4 is a block diagram illustrating an embodiment of a back wrapping inline system for manufacturing a semiconductor device according to the present invention.

※ Explanation of symbols for main parts of drawing

10, 110: wafer manufacturing process 12, 112: backside polishing process

14: vinyl coating process 16: back surface polishing process

18: vinyl removal process 20, 116: back side polishing process

22, 118: assembly process 30, 120: network circuit

32, 34, 36: manual interface 38: laminator

40: Back Grinder 42: Eliminator

44, 54, 62, 128: Loading part 46: Precut part

50: wire cut portion 52, 64, 72, 146: unloading portion

58, 136: grinding unit 60, 138: cleaning unit

68, 142: UV irradiation 70, 144: removal

114: Inline Process 124: Server

126: in-line equipment 132: taping laser cutting unit

In order to achieve the above object, a back lapping inline system for manufacturing a semiconductor device according to the present invention includes a program for controlling an inline process connected to a network line and including a predetermined vinyl coating process, a backside polishing process and a vinyl removal process for a wafer. Connected to a server and a standardized line for normal communication to the server, the respective parts being combined in order to perform the vinyl coating process, the back polishing process and the vinyl removal process, wherein each part is information communicated with the server. By performing the process for the wafer by the, and is provided with an on-line facility for transferring the loaded wafer to be unloaded while going through the corresponding process of each part sequentially.

The on-line facility includes: a taping laser for applying and cutting vinyl to a loading portion on which a wafer is loaded, a first centering portion on which the loaded wafer is transferred to perform primary centering, and a pattern forming surface of the wafer to be primarily centered and transferred A cutting unit, a second centering unit performing secondary centering when the vinyl-coated wafer is transferred, a grinding unit polishing the back surface of the secondary-centered wafer to be transported, a cleaning unit to clean the wafer to be transferred, and the cleaning unit A third centering unit for transferring and transferring the wafer to the third center, a UV irradiation unit for transferring the third centered wafer and irradiating with UV, a removing unit for removing the UV-irradiated softened vinyl, and a wafer from which the vinyl is removed In order of unloading part to load Combined; Each of the parts may be configured to perform unit processing and wafer transfer by exchanging information with the server.

Each of the portions performing the unit process is provided with a transfer belt for transferring wafers and configured to perform wafer transfer for inline, or a robot for transferring wafers is provided for wafer transfer by the arm of the robot. This can be configured to be performed.

In addition, the server may be configured to perform the process in a portion selected to perform a process in advance among the respective parts of the inline facility, and transfer the wafer in another portion without performing the process.

In addition, the inline facility may be configured by adding or subtracting a part for performing a unit process as necessary among the respective parts.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

An embodiment of a back lapping inline system for manufacturing a semiconductor device according to the present invention is applied to vinyl backing and back polishing during the back wrap process between the fabrication process 110 and the assembly process 118 as shown in FIG. And the vinyl removal process is performed in one unit process, the in-line process 114, and before and after the in-line process 114, the pre-grinding process 112 and the post-grinding process 116 are performed.

The inline process 114 of FIG. 3 is performed by the system of FIG.

Referring to Fig. 4, another system is connected to the network line 120, and a server 124 in which a program for executing an inline process is embedded is connected. The server 124 is configured to be connected to the inline facility 126 via a line having a standard for normal server-to-server communication to exchange information with the inline facility 126 necessary to proceed with the inline process.

In addition, the inline facility 126 may include a loading unit 128, a first centering unit 130, a taping laser cutting unit 132, a second centering unit 134, a grinding unit 136, a cleaning unit 138, The third centering part 140, the UV irradiating part 142, the removing part 144 and the unloading part 146 are combined, and each of these parts uses a common robot or a conveying belt for conveying the wafer. A conveying apparatus (not shown) having a mechanism is configured, and the wafer is loaded into the loading unit 128 and then unloaded into the unloading unit 146 after a stepwise process through each of the above-described parts.

Specifically, it is as follows.

The wafer is transferred to the loading unit 128 after finishing the back grinding process 112 to perform the back wrap process, and then the wafer is transferred to the centering unit 130 to perform the first step for the taped laser cutting process. Centering is performed to align the wafers, and the first centered wafer is transferred to the taping laser cutting unit 132 to perform taping laser cutting, and the cut wafer is transferred to the centering unit 134 to perform secondary centering for grinding. This is performed to align the wafer, and the wafer in the aligned state is transferred to the grinding unit 136 to polish the back surface.

At this time, the silicon powder generated while the back surface is polished does not affect the surface pattern of the wafer by the coated vinyl.

The wafer polished on the back surface of the grinding unit 136 is transferred to the cleaning unit 138, cleaned and then transferred to the centering unit 140 to perform tertiary centering, and the wafer on which tertiary centering is performed is transferred to the UV irradiation unit 142. UV light is irradiated. At this time, the vinyl on the surface of the wafer is softened in a good state to be removed by UV, and the wafer is transferred to the removing unit 144 to remove the softened vinyl from the surface, and then transferred to the unloading unit 146 to be unloaded. do.

The above-described series of processes are controlled by the control unit (not shown) of the combined parts and the normalized interface method of the server 124, and process information generated for each process is transmitted to the server 124. This process information is utilized by the main process control program of the host computer (not shown) via the network line 30.

In addition, each part combined as shown in FIG. 4 can be added or subtracted according to the intention of the manufacturer, and whenever there is an addition or decrease of each part, the server 124 updates the control program for it or changes the process control conditions to change the process environment. Applies to

That is, the embodiment according to the present invention is free to change the production method according to the situation. Specifically, for example, selecting two consecutive processes and configuring them inline.

Therefore, according to the present invention, first, the turn-around time can be reduced by minimizing the time required for unnecessary loading / unloading of each equipment, and second, the wrappage generated by the loading / unloading step between the equipments is eliminated. The damage of the defective wafer can be prevented and the yield can be improved. Third, the management degree can be improved as the manual operation or management method by applying the inline is simplified.

As described above, the embodiment according to the present invention is designed by minimizing wafer loss and process time loss of each part, thereby maximizing productivity, and particularly, the effect of the large diameter wafers weak in the wrappage may be apparent.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (5)

A server connected to a network circuit and having a program embedded therein for controlling an inline process including a predetermined vinyl application process, a backside polishing process and a vinyl removal process for the wafer; And Connected to the server by a standardized line for normal communication, and combined in each additional order for performing the vinyl coating process, the back polishing process and the vinyl removal process, each portion being a wafer by information communicated with the server. Including an on-line facility to perform the process for, and to transfer the loaded wafer to be unloaded after sequentially going through the corresponding process of each part, The on-line facility includes a loading part for loading a wafer, a first centering part for transferring the loaded wafer to perform primary centering, a taping laser cutting part for applying and cutting vinyl to a pattern forming surface of the wafer to be primarily centered and transported; A second centering unit performing secondary centering when the wafer coated with vinyl is transferred, a grinding unit polishing the back surface of the secondary centered and transported wafer, a cleaning unit cleaning the ground and transported wafer, and the kneaded wafer A third centering unit for transferring and tertiary centering, a UV irradiating unit for transferring the tertiary centered wafer and irradiating with UV, a removing unit for removing the UV irradiated softened vinyl, and an unloading wafer for unloading the vinyl removed. Combined in the order of the loading section; And each of the portions is configured to perform a unit process and a wafer transfer by exchanging information with the server. The method of claim 1, Each of the portions to be carried out in the unit process is provided with a transfer belt for the transfer of the wafer is configured to perform the wafer transfer for in-line back lapping inline system for manufacturing a semiconductor device. The method of claim 1, Each of the portions performing the unit process is provided with a robot for transferring the wafer is configured to perform the wafer transfer by the arm of the robot. The method of claim 1, And the server is configured to perform a process at a portion selected to perform a process in advance among respective portions of the inline facility and to transfer a wafer at another portion without performing the process. The method of claim 2, The in-line facility is a back-lapping in-line system for manufacturing a semiconductor device, characterized in that by adding or subtracting a portion for performing a unit process of each of the parts as necessary.