KR100298143B1 - Air conditioner - Google Patents

Abstract

The present invention relates to a air conditioner using a thermoelectric semiconductor, and the present invention relates to a refrigerant tank (40) having a duct (20), a circulation fan (30), a circulation pump (50) in the main body (10), It includes a temperature and humidity sensor 60 for detecting the temperature of the air discharged into the room, and a control unit 70 for generating a control signal in accordance with a signal input from each functional unit, and the heat exchange with the refrigerant as the air passes through The first heat exchanger 80, the second heat exchanger 90 provided on the air outlet 22 side of the duct 20 to exchange heat with the refrigerant while the air passes therethrough, and the first heat exchanger A plurality of air cooling thermoelectric semiconductors (100) attached to (80) to supply cold heat to the air passing through the duct (20), and a plurality of air cooling surfaces attached to the outer surface of the coolant tank (40) to cool the coolant. Two refrigerant cooling thermoelectric semiconductors (100).

Description

Air conditioner

The present invention relates to a air conditioner using a thermoelectric semiconductor (thermoelectric element), and more particularly, to a heat exchanger installed in a duct and a cooler (commonly known as an air conditioner) to supply cool air by attaching a thermoelectric semiconductor to a tank in which a refrigerant is stored. .

This application is a priority application of the applicant for 1998 Patent Registration No. 22848.

In general, an air conditioner includes an evaporator, a condenser, a compressor, an expansion valve, and the like, and is connected to a pipe so that the refrigerant is circulated and the indoor air is cooled by a heat exchanger.

However, such a conventional air conditioner has a disadvantage in that a large number of expensive components increases manufacturing costs and low thermal efficiency, resulting in very high power consumption.

In particular, the large capacity so-called stand-type air conditioner has to install the condenser outside the building and to work with the main body installed in the building, and the work and cost of the installation, as well as the discomfort that is inconvenient to move.

An object of the present invention is to provide a cooler with a simple structure, high thermal efficiency and very low power consumption by appropriately applying a thermoelectric semiconductor together with a refrigerant circulating the first and second heat exchangers through a pipe without a condenser, a compressor, an expansion valve, and the like. To provide.

1 is a vertical side cross-sectional view of a cooler according to a first embodiment of the present invention.

2 is a vertical front cross-sectional view of FIG.

3 is an enlarged sectional view taken along the line A-A of FIG.

Figure 4 is a block diagram of a first heat exchanger applied to the present invention.

5 is a circuit diagram according to a first embodiment of the present invention.

Figure 6 is a vertical side cross-sectional view of the air conditioner according to the second embodiment of the present invention.

7 is a circuit diagram according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10; Main body 11; Insulation 12; Nozzle

20; Duct 21; Air inlet 22; Air outlet

30; Circulation fan 40; Refrigerant tank 41; Refrigerant inlet

42; Refrigerant outlet 43; Cover 44; insulator

50; Circulating pump 60; Temperature and humidity sensor 70; Control

71; Power switch 72; Air volume control switch 73; Temperature control switch

80; First heat exchanger 81; Case 82; core

83; Hollow tube 90; Second heat exchanger 91; core

92; Heat dissipation fins 100; Thermoelectric semiconductors P1, P2, P3; pipe

110; Auxiliary duct 111; Second air inlet 112; 2nd air outlet

120; Heat dissipation core 121; Cooling fan 130; 2nd pump

140; water tank

The present invention has been made in view of the above disadvantages, according to the first embodiment of the present invention, the air inlet 21 and the air outlet 22 are arranged on the lower side and the upper side of the main body 10, respectively ( 10 and a circulation fan 30 installed on the air inlet 21 side of the duct 20 to blow outside air from the air inlet 21 side to the air outlet 22 side; A refrigerant tank (40) having a refrigerant inlet (41) and a refrigerant outlet (42) and having a circulation pump (50) installed at the bottom of the main body (10) to circulate the stored refrigerant, and the air outlet (42) side Installed in the temperature and humidity sensor 60 for detecting the temperature of the air discharged from the duct 20, the circulation fan 30, the circulation pump 50 and the temperature and humidity sensor 60 by connecting to the electrical circuit control And a controller 70 for operating the control signal and generating a control signal according to a signal input from each functional unit. Installed between the air inlet 21 and the air outlet 22 of the air duct 20 and connected to the refrigerant outlet 42 of the refrigerant tank 40 and the pipe (P1) at the same time so that the refrigerant flows The first heat exchanger 80 through which heat is exchanged with the refrigerant, and the refrigerant flows from the first heat exchanger 80 and is discharged into the refrigerant tank 40. ) And the refrigerant inlet 41 of the refrigerant tank 40 and pipes P2 and P3, respectively, and are installed at the air outlet 22 side of the duct 20 to exchange heat with the refrigerant as air passes therethrough. An air cooling thermoelectric for attaching a second heat exchanger 90 and a cooling surface to the first heat exchanger 80 and supplying cooling heat to the air passing through the duct 20 by voltage and current control of the control unit 70. The semiconductor 100 and the cooling surface attached to the outer surface of the refrigerant tank 40, the voltage of the control unit 70 and It is composed of another plurality of refrigerant cooling thermoelectric semiconductor 100 for cooling the refrigerant stored in the refrigerant tank 40 by the current control.

In the second embodiment of the present invention, the second air inlet 111 is in communication with the duct 20 to be located behind the air outlet 22 and the second air outlet 112 is lower than the main body 10 Auxiliary duct 110 in communication with the rear, a heat dissipation core 120 provided with a cooling fan 121 in the auxiliary duct 110, and the second pump 130 so that the water circulates in a predetermined direction The tank 140 further includes a water tank 140 connected to the heat dissipation core 120 and installed in the lower portion of the main body 10, wherein the water tank 140 is formed of the thermoelectric semiconductor 100 attached to the refrigerant tank 40. The outer surface is attached to the heat dissipation surface.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

1 and 2, the duct 20 is embedded in the main body 10, and the space between the main body 10 and the duct 20 is filled with a heat insulating material 11. The air inlet 21 of this duct 20 is located below the main body 10 front side, and the air outlet 12 is located above the main body 10 front side.

The nozzle 12 is normally provided in front of the air outlet 22, and the nozzle 12 is adapted to adjust the direction of the blowing air automatically or manually.

The circulation fan 30 is installed inside the main body 10 to be located at the air inlet 21 side of the duct 20.

The coolant tank 40 has a coolant inlet 41 and a coolant outlet 42, and is installed at the bottom of the main body 10, that is, the bottom surface, and the circulation pump 50 connects the coolant outlet and the first heat exchanger 80. It is provided on the pipe P1 to be thermally connected. Refrigerant cooling thermoelectric semiconductors 100 are attached to both sides of the refrigerant tank 40 so as to cool the refrigerant stored in the refrigerant tank 40 by voltage and current control of the controller 70. The outside of the coolant tank 40 has a so-called double structure filled with a heat insulating material 11 and covered with a cover 44.

There may be several types of refrigerants, but it is preferable to use a refrigerant such as R-124 that maintains an image of 5 ° C. to minus 30 ° C. under a constant pressure (1 to 10 bar). If the appropriate amount of salt is added to the ethyl alcohol, the freezing point can be lowered.

The temperature and humidity sensor 60 is installed at the air outlet 61 side of the duct 20 to detect the temperature of the air discharged from the duct 20 and output a voltage according to the resistance value to the controller 70.

The control unit 70 is mounted on the front of the main body 10 by using a microcomputer, the air volume control switch 2 for driving the power switch 71, the circulation fan 30, the circulation pump 50 and the thermoelectric semiconductor 100 And a temperature control switch 73 for driving a cooling system such as

3 and 4, the first heat exchanger 80 integrally couples a case 81 coupled to the middle of the duct 20 and a plurality of cores 82 disposed vertically in the case 81. The air is passed between the core 82 and the case 81. The refrigerant is communicated in order to pass through the core 82 in turn, and is connected to the refrigerant outlet 42 of the refrigerant tank 40 by a pipe P1.

In the illustrated core 82, six copper tubes having an outer diameter and a length of 80 mm were prepared and densely arranged in a case 81 having a circumference of a hollow tube 83 positioned at the center and a polygonal column, and a thermoelectric semiconductor 100. ) Was provided with six and attached to the outside of the case 81 at regular intervals. Illustrative core 82 is used as a cylindrical but can be used as a square tube or polygonal tube.

The second heat exchanger 90 has a structure in which the core 91 and the heat dissipation fin 92 are combined like a kind of evaporator, and the refrigerant inlet 41 of the first heat exchanger 80 and the refrigerant tank 40 and the pipe P2, respectively. , P3 is connected to the refrigerant circulating and heat exchanged with the air discharged to the air outlet (22).

In addition, the pipes P1, P2, and P3 and the cores 82 and 91 are made of copper tubes, and the above-described air cooling and refrigerant cooling thermoelectric semiconductors 100 generate cold heat below 70 ° C. Using a high-performance type to attach the cold surface to the case 81 and the refrigerant tank 40 of the first heat exchanger 80, respectively, the negative terminal and the positive terminal of the electrical circuit in parallel to configure the control unit 70 Connect with When attaching the air cooling thermoconductor 100, by applying a silver (chemical symbol; Ag) having a very high thermal conductivity on each of the attachment surface can maximize the heat transfer function. In order to reduce the manufacturing cost, aluminum (Al) may be used instead of silver.

The operation of the first embodiment having such a configuration will be described below.

As shown in Figs. 1 to 5, after turning on the power switch 71, the air volume control switch 72 and the temperature control switch 73 are operated to drive the respective functional units connected by the electric circuit. That is, as the circulating pump 50 is driven by the operation of the air volume switch 72, the refrigerant having a low temperature (about minus 30 ° C.) stored in the refrigerant tank 40 passes through a series of pipes P1, P2, and P3. The air is returned to the refrigerant tank 40 through the heat exchanger 80 and the second heat exchanger 90, and hot air is ducted as the circulation fan 30 is driven by the operation of the temperature control switch 73. ) Is introduced from the air inlet 21 side and discharged to the air outlet 22.

The air introduced into the air inlet 21 is absorbed by the refrigerant flowing through the core 82 between the core 82 and the case 81 of the first heat exchanger 80 and passing through the hollow tube 83. When the air is cooled, the air is cooled in two stages by receiving cold heat generated from the cold heat plane of the air cooling thermoelectric semiconductor 100.

In this way, the first cooled air reaches the air outlet 22 side of the duct 20 and passes through the second heat exchanger 90 and once again with the refrigerant circulating through the core 91 of the second heat exchanger 90. It is cooled through the heat exchange process and is discharged to the outside, that is, indoors through the nozzle 12.

In addition, since the cooling heat of the refrigerant cooling thermoelectric semiconductor 100 is supplied into the refrigerant tank 40, the liquid refrigerant absorbing the heat of air is introduced into the refrigerant tank 40 from the second heat exchanger 90. It is mixed with the remaining refrigerant and cooled at the same time, where the cooling cycle is completed.

On the other hand, in Figure 4, the control unit 70 is set by the rotational speed of the circulation fan 30 in multiple stages in accordance with the operation of the air volume control switch 72 is adjusted the air volume of the air flowing into the duct 20, discharged, In accordance with the operation of the temperature control switch 73, the heat is supplied to the coolant stored in the coolant tank 40 and the air passing through the first heat exchanger 80 by voltage control applied to the thermoelectric semiconductor 100. At this time, as the resistance value corresponding to the temperature of the air detected by the temperature and humidity sensor 60 is input to the controller 70, the duct 20 by controlling the driving of the circulation pump 50 and the thermoelectric sensor 60 at an appropriate voltage. The set temperature is maintained by the temperature compensation of the air discharged from the air. For example, when the air discharged from the duct 20 to the room temperature is lower than or equal to the set temperature, the circulation pump 50 is driven to supply the cold heat of the thermoelectric semiconductor 100, and when the discharged air reaches the set temperature, the circulation pump The driving of the 50 is interrupted and the cold heat supply of the thermoelectric semiconductor 100 is stopped to keep the temperature of the air supplied to the room constant.

Second Embodiment

As shown in FIG. 6, the auxiliary duct 110, the heat dissipation core 120, the second pump 130, and the water tank 140 are further provided for the first embodiment, and water used as the refrigerant is circulated separately. It is designed to circulate through the path and has the following structure.

The auxiliary duct 110 has a second air inlet 111 and the second air outlet 112, the air inlet 111 is connected in communication with the air outlet 22 of the duct 20 and the second air outlet 112 has a structure in communication with the rear of the lower part of the main body 10. The cross sectional area of the auxiliary duct 110 is about 1/10 of the cross sectional area of the duct 20.

The heat dissipation core 120 is installed in the auxiliary duct 110 and has a structure in which water flows inside and heat exchanges while air passes. The heat dissipation core 120 is provided with a cooling fan 121 to blow a part of the air passing through the duct 20 from the air inlet 111 side of the auxiliary duct 110 toward the air outlet 112. do.

The water tank 140 may be installed at the lower portion of the main body 10 and may be circulated in a predetermined direction by the second pump 130 by connecting to the heat dissipation core 120 and a pipe. The water tank 140 is embedded in the case attached to the heat dissipation surface of the thermoelectric semiconductor 100, and filled with the heat insulating material 12 in the gap between the refrigerant tank 40 and the water tank 140 as in the first embodiment. It is desirable to shield the heat.

As described above, the present invention further includes a heat dissipation core 120 and a water tank 140, as shown in FIG. 6 and FIG. As the pump is driven, the water circulates through the heat dissipation core 120 and the water tank 140, and part of the cold air discharged from the duct 20 to the air outlet 22 is driven by the cooling fan 121. It is discharged to the rear of the main body 10 through the auxiliary duct 110.

Thus, the water absorbs the heat generated from the heat dissipation surface of the thermoelectric semiconductor 100 while passing through the water tank 140, and by some air passing through the auxiliary duct 110 while the water passes through the heat dissipation core 120. The fever is taken away. Thus, the water passing through the water tank 140 serves to increase the cooling efficiency by quickly absorbing the heat emitted from the heat dissipation surface of the thermoelectric semiconductor 100 to increase the Peltier effect.

In other words, the second embodiment circulates water having a separate circulation path as compared with the first embodiment so as to effectively absorb and release the heat emitted from the heat dissipation surface of the thermoelectric semiconductor 100 to release it, which is a kind of turbo air conditioner. Is an implementation of

As described above, the present invention does not include a compressor, a condenser, etc., so it can be manufactured compactly and lightly, and there is an advantage that the manufacturing cost can be reduced and inexpensively supplied since no expensive parts are used.

In addition, the present invention not only enables the temperature control to be finer but also shortens the time for reaching the set temperature by cooling the air and the refrigerant by voltage control using the thermoelectric semiconductor 100.

In addition, the present invention has a simple structure, so that almost no failure occurs and the repair is simple.

In addition, since the present invention does not use a compressor, there is an advantage in that power consumption is greatly reduced and thermal efficiency is further improved.

In addition, since the present invention does not have a separate condenser, there is no need for piping work with the condenser, and thus there is an advantage in that the installation and movement of the product are easy.

Claims (3)

An air inlet 21, a duct 20 installed so that the air outlet 22 is disposed at the lower side and the upper side of the main body 10, and the air inlet 21 is installed at the air inlet 21 side. A circulation fan 30 for blowing to the side, It has a refrigerant inlet 41 and the refrigerant outlet 42 is provided in the bottom of the main body 10 has a circulation pump 50 to circulate the stored refrigerant, and the refrigerant is controlled by the electrical control by the control unit 70 Refrigerant tank 40 to which the cooling surface of the plurality of refrigerant cooling thermoelectric semiconductor 100 to be attached to the outer surface, Installed at the air outlet 22 side, the temperature and humidity sensor 60 for detecting the temperature of the air discharged from the duct 20, the circulation fan 30, the circulation pump 50 and the temperature and humidity sensor 60 And a control unit 70 connected to an electric circuit to control operation and generating a control signal according to a signal input from each functional unit. It is installed to be located between the air inlet 21 and the air outlet 22 of the duct 20 and connected to the refrigerant outlet 42 and the pipe (P1) of the refrigerant tank 40 so that the refrigerant flows at the same time Between the case 81 coupled to the middle of the duct 20, the core 82 vertically disposed in the case 81, and the refrigerant circulating sequentially, between the outer surface of the core 82 and the case 81. By allowing air to pass through, and attaching a cooling surface of the plurality of air cooling thermoelectric semiconductors 100 for supplying cooling heat to the air passing through the duct by the electric control of the control unit 70 by the air to the outer surface of the case 81 A first heat exchanger (80) through which the heat is exchanged with the refrigerant, and Refrigerant is introduced from the first heat exchanger 80 and discharged to the refrigerant tank 40, the refrigerant inlet 41 of the first heat exchanger 80 and the refrigerant tank 40 and the pipe (P2, And a second heat exchanger (90) installed at the air outlet (22) side of the duct (20) so as to exchange heat with the refrigerant while passing through the air (P3). The air conditioner according to claim 1, wherein the refrigerant is one in which salt is added to R-12, R-22, R-123, R-124, R-124a, R-134a, ammonia or ethyl alcohol. The method of claim 1, wherein the second air inlet 111 is in communication with the duct 20 to be located behind the air outlet 22 and the second air outlet 112 and the rear of the lower portion of the main body (10) The heat dissipation core 120 and the heat dissipation core 120 provided with the cooling fan 121 in the auxiliary duct 110 and the second pump 130 communicate with each other to circulate water in a predetermined direction. It further comprises a water tank 140 connected to the core 120 and the pipe is installed in the lower portion of the main body 10, the water tank 140 is a heat dissipation surface of the thermoelectric semiconductor 100 attached to the refrigerant tank 40 Cooler characterized in that the outer surface is attached to.