KR100295551B1 - Conductive metal coating method and aparatus thereof - Google Patents

Abstract

The present invention relates to a method for coating an electromagnetic wave shielding film and a device therefor, wherein the synthetic resin (2) is subjected to plasma etching using a reactive gas and then coated with a shielding film to increase adhesion between the conductive metal coating layer and the synthetic resin (2). Production of high quality coating film, mass production by allowing coating work to be carried out in a state in which a large amount of the coated object (2) is installed in a cylindrical rotary jig (3) rotatably installed inside the large diameter chamber (1) And it is possible to produce a uniform coating film.

Description

Electromagnetic shielding film coating method and device therefor {CONDUCTIVE METAL COATING METHOD AND APARATUS THEREOF}

The present invention relates to a method for coating an electromagnetic wave shielding film and a device therefor, in particular, by performing plasma etching using a reactive gas on a synthetic resin and then coating the shielding film to increase the adhesion between the conductive metal coating layer and the synthetic resin and to produce a high quality coating film. The present invention relates to an electromagnetic shielding film coating method and apparatus for mass production and production of uniform coating film by coating in a state in which a large amount of synthetic resin is installed on a jig rotatably installed inside a large diameter chamber. .

The use of electromagnetic waves is actively used in the fields of electricity, electronics, telecommunications, and computer medical care in modern civilized life, and the scope of application is maximized. Recently, with the development of semiconductors, digitalization is rapidly being promoted in the fields of home appliances, industrial devices, and medical devices for the purpose of miniaturization, light weight, multifunctionality, and high reliability. It causes noise and causes electromagnetic wave disturbance. It causes VDT (Video display terminal) syndrome and abnormal hormone secretion and cancer caused by disturbance of Na ⁺ , Ka ⁺ ion flow. Since it affects the same device and the human body, there is an urgent need to solve the problem of electromagnetic pollution.

The most common method for shielding such harmful electromagnetic waves is spraying method by spraying shielding metal solution to synthetic resin by spraying, and electroless plating which puts synthetic resin inside plating bath and conducts electroless plating. The method is known, and these methods have various problems.

First, in the case of forming the electromagnetic shielding film by the spray method and the electroless plating, a work process is performed in the air, and the technical level is poor, so that the adhesion of the shielding film coated on the synthetic resin is considerably low, nevertheless the coating film is coated. The coating thickness and the concentration of the coating particles of the coating is non-uniformly there was a problem that there is a limit to improve the shielding effect.

Secondly, most of the work was done by hand, so it was impossible to carry out mass work repetitively.

Third, there is a problem that the dust generated when the worker sprays are harmful to the human body, and the waste water treatment cost by the industrial water used in electroless plating is high.

The main object of the present invention devised in view of the above problems is to provide an electromagnetic wave shielding film coating method and apparatus thereof which do not have various problems as described above.

Another object of the present invention is to provide an electromagnetic shielding film coating method and apparatus suitable for improving the adhesion of the shielding film and allowing it to be uniformly coated.

Still another object of the present invention is to provide an electromagnetic wave shielding film coating apparatus capable of repetitively carrying out mass operations.

Still another object of the present invention is to provide an electromagnetic wave shielding film coating apparatus capable of performing a pollution-free operation by performing a dry process as well as having no risk of a safety accident.

1 is a cross-sectional view showing the configuration of the electromagnetic wave shielding film coating apparatus of the present invention.

Figure 2 is a front view of a state in which the door is removed from the electromagnetic wave shielding film coating apparatus of the present invention.

Figure 3 is a cross-sectional view of the rotary jig withdrawal state in the electromagnetic wave shielding film coating apparatus of the present invention.

Figure 4 is a cross-sectional view of the rotary jig inserted state in the electromagnetic wave shielding film coating apparatus of the present invention.

5 is a cross-sectional view taken along the line AA ′ of FIG. 4;

6 is a cross-sectional view taken along line BB ′ of FIG. 4;

Figure 7 is a front view showing the configuration of a rotary jig according to the present invention.

FIG. 8 is a cross-sectional view taken along line CC ′ of FIG. 7;

FIG. 9 is an enlarged view showing part D of FIG. 8 in detail; FIG.

10 is a cross-sectional view showing the structure of a target according to the present invention.

11 is a cross-sectional view schematically showing the structure of an O ₂ plasma etching apparatus.

12 AFM properties of polycarbonate.

13 is an XPS spectrum of polycarbonate.

14 is a sectional view of an electromagnetic shielding film.

15 is a scanning electron micrograph of a copper film.

16 is a photograph comparing the structure of the electromagnetic shielding film according to the prior art and the present invention.

17 is a conventional EDS component analysis of the electromagnetic shielding film according to the present invention.

Figure 18 is a comparison photograph after the adhesion test of the conventional electric wave shielding film according to the present invention.

19 is an electromagnetic shielding effect of ASTM of the electromagnetic shielding film according to the prior art and the present invention.

Explanation of symbols on the main parts of the drawings

1 chamber 2 synthetic resin

3: jig rotation 4: jig rotation means

5: jig movement means 6: target

7: controller 8: jig feeder

9,9 ', 44,44': Rail 14: Door

21,21 ': fixing plate 22: holder

23: clamping means 24: movable clamp

25: Bolt 26: Tightening Screw

27: jig side projection 31: motor

31a: motor shaft 32: drive gear

33: support roller 34: driven gear

35: driving side protrusion 41,41 ': jig support

42,42 ': Support 43: Roller

53: bar magnet 55: cooling water circulation hole

In order to achieve the object of the present invention as described above, the surface of the synthetic resin is etched using a plasma generated by applying a voltage of 100 to 150 W while injecting a reaction gas of 20 to 50 cm into the etching chamber having a vacuum degree of 30 to 60 mTorr. To do that,

The etched synthetic resin was applied to a copper electrode and a stainless electrode in turn by applying a voltage of 300 to 600 V / 5 to 10 A while rotating the cylindrical coating region in a cylindrical process chamber having a vacuum degree of 10 ^-2 to 10 ^-4 Torr. The electromagnetic wave shielding film coating method is provided so that the electromagnetic shielding film is coated on the synthetic resin by sequentially depositing a copper film and a stainless film on the surface of the synthetic resin by sputtering generated.

In addition, a target is disposed inside the process chamber, and a rotating jig for mounting the object to be coated is disposed inside the chamber, and a coating having jig rotating means for rotating the rotating jig at a constant speed. In the apparatus,

The rotary jig is a pair of circular fixing plate that is arranged at a predetermined interval, a plurality of fixing rods fixed at regular intervals to form a cylindrical shape between the circular fixing plates, and positioned on the outside of the jeongdae outside the synthetic resin The electromagnetic shielding film coating apparatus is provided, characterized in that the synthetic resin is made to rotate the cylindrical coating area to the coating is made of a clamping means for fixing in multiple stages.

Hereinafter, an embodiment of the electromagnetic wave shielding film coating apparatus of the present invention as described above will be described in detail with reference to the accompanying drawings.

As shown in Figures 1 to 10, the electromagnetic wave shielding film coating apparatus of the present invention is a cylindrical chamber (1), and a cylindrical rotation that can be installed inside the chamber (1) to mount a plurality of synthetic resin (2) Jig (3), jig rotating means (4) provided at the rear of the rotary jig (3) for rotating the rotary jig (3) at a constant speed, and jig rotation means is provided below the rotary jig (3) Jig moving means (5) for putting or removing (3) into or out of the chamber (1), several targets (6: 6a, 6b) disposed inside the chamber (1) and being electrically negative electrodes; The controller 7 is installed at one side of the chamber 1 to supply power and is installed outside the chamber 1 to control the operation of the apparatus, and the jig feeder 8 is mounted on the rotary jig 3. It consists of).

Two diffusion pumps 11 and 11 'are connected to the exhaust line 12 at one side of the chamber 1, and one cryopump 13 is connected to the exhaust line 12' at the other side. It is connected, the front door 14 with a viewport (14a) is installed to open and close, the rear end is provided with an outer protective tube 15 to which the cooling water, power and gas lines are connected, the outer protective tube An inner protective tube is provided in the interior of the chamber 15 to protrude a predetermined portion into the chamber 1 and to protect the power line 16, the coolant line 16 ′, and the gas line 16 ″ coming into the chamber 1. (17) is provided, and the target support 18 is connected to the inner protection pipe 17 located inside the chamber 1 downward.

The rotary jig 3 has a circular ring shape and a pair of fixing plates 21 and 21 'arranged at regular intervals, and a plurality of fixing tables 22 fixed radially between the fixing plates 21 and 21'. )Wow. It is located on the outside of the fixture 22 and consists of clamping means 23 for fixing the synthetic resin 2.

The clamping means 23 is a movable clamp 24 disposed on the outside of the holder 22, bolts 25 are installed at regular intervals so as to pass through the holder 22 and the movable clamp 24, and Composed to the bolt 25 is composed of a tightening screw 26 for tightening or loosening the movable clamp (24).

The jig rotation means 4 is connected to a motor 31 installed outside the rear surface of the chamber 1 and the motor shaft 31a of the motor 31 and rotatably inside the chamber 1. The drive gear 32 is arranged, and the donut-shaped driven gear 34 which is gear-coupled with the drive gear 32 and whose inner peripheral surface is supported by the support rollers 33 is comprised.

A driving side protrusion 35 is provided at a predetermined portion of the driven gear 34, and the driven gear 34 is rotated to the driving side protrusion 35 when the driven gear 34 is rotated on the fixed plate 21 ′ of the rotary jig 3. The jig side protrusion 27 is provided so that it may be caught.

The jig movement means (5) is a pair of semi-circular jig support 41, 41 'installed at a predetermined interval on the lower side of the rotary jig 3, both sides so that the pedestal 41, 41' is connected A pair of supports 42 and 42 'installed at the plurality of rollers, and several rollers 43 and a plurality of rollers 43 provided at predetermined intervals on the supports 42 and 42' and disposed inside both sides of the chamber 1 The rollers 43 are constituted by a pair of rails 44 and 44 'which can be rolled forward and backward.

Departure preventing grooves 41a and 41a 'having a predetermined depth are formed on the upper surfaces of the pedestals 41 and 41', respectively, and bearings 45 are formed inside the separation preventing grooves 41a and 41a '. The guide protrusions 21a and 21a 'formed on the outer circumferential surface of the fixed plate 21 and 21' of the rotary jig 3 are inserted into the release preventing grooves 41a and 41a ', so that The rotation jig 3 is prevented from being detached from the jig movement means 5.

The inner upper portion of the chamber 1 and the target support 18 are provided with two copper targets 6a and stainless targets 6b each at a predetermined distance to insulate the chamber 1 with an insulator (not shown). The targets 6a and 6b installed in the upper part of the chamber 1 are disposed to face the inner center of the chamber 1, and the targets 6a and 6b installed in the target support 18 are chambers 1. It is arranged to face the inner circumferential surface of the.

A plurality of bar magnets 53 for generating magnetic force are arranged on the rear of the targets 6: 6a and 6b, and holders for fixing the targets 6: 6a and 6b and the bar magnets 53 ( A cooling water circulation hole 55 is formed at 54, and a gas line 56 is provided at the outside of the holder 54 in which a plurality of gas injection holes (not shown) are formed.

The cooling water circulation hole 55 is connected to the cooling water line 16 ′ introduced into the inner protection tube 17, so that the cooling water can circulate while cooling the targets 6: 6a and 6b.

The jig carriage 8 is an auxiliary mechanism for supporting the rotary jig 3 when the rotary jig 3 is taken out of the chamber 1, and a pair of rails 9, 9 'are provided on both sides. The rollers 43 provided on the rotary jig 3 are capable of rolling.

In the figure, reference numeral 60 denotes a chamber supporter supporting the chamber 1.

Referring to the method of coating using the electromagnetic shielding film coating apparatus as described above are as follows.

The synthetic resin 2 to be coated is a mobile phone case which is used a lot recently as polycarbonate which is a plastic injection product.

1. Injection product inspection and ultrasonic cleaning

As a pretreatment step for synthetic resins, contaminants such as release agents, fingerprints, dust, and organic substances generated during injection molding that may affect the coating are visually inspected, and ultrasonic cleaning is performed in an ultrasonic cleaner.

2. oven hot air drying step

Put the synthetic resin that went through the ultrasonic cleaning step into the oven, and remove the gas that may be generated on the surface of the synthetic resin within the range that the injection product is not damaged by heat, thereby lowering the initial process pressure due to the gas that may be generated during mass production. Reduce the process time to save process time and increase profitability.

3. Plasma Etching Step.

A synthetic resin is placed inside the chamber of the etching apparatus, a voltage of 100 to 150 W is applied to the inside of the chamber while maintaining a vacuum degree of 30 to 60 mTorr, and oxygen gas (O ₂ ) of about 20 to 50 sccm is injected for about 10 to 30 minutes. Plasma etching is performed.

4. Loading of the coating material.

Mounting the synthetic resin (2), the etching operation is completed as described above to the electromagnetic shielding film coating apparatus according to the present invention, by opening the door 14 of the chamber (1), the jig support (inside the chamber 1) ( 41) 41 'and the rotary jig 3 are pulled so that the jig support 41, 41' and the rotary jig 3 are positioned above the jig carriage 8.

Then, loosen the tightening screws 26 installed on the rotary jig 3 and, with the movable clamp 24 loosened, one side of the object to be coated 2 between the movable clamp 24 and the holder 22. The other side is fastened to the cylindrical rotary jig 3 in two rows by fastening the tightening screw 26 to fix the synthetic resin 2 in the state sandwiched between the other movable clamp 24 and the holder 22 adjacent to each other. Dogs are installed, but the coating surfaces are disposed to face the outside.

Then, the rotary jig 3, on which the synthetic resins 2 are mounted, is pushed into the chamber 1, and the rotary jig 3 is formed by the rollers 43 installed on the supports 42, 42 '. Rolling along the rails 44 and 44 ′ moves into the chamber 1 together with the jig support 41 and 41 ′, and the door 14 that has been opened is closed again.

5. Copper film coating step

After loading the synthetic resins 2 into the chamber 1 as described above, the pumps are pumped by the diffusion pumps 11 and 11 ′ so that the inner vacuum of the chamber 1 is maintained at 10 ⁻⁵ mbar. Argon gas (Ar gas) is injected into the chamber 1 through the gas line 56 at about 10 to 20 sccm. Then, by rotating the motor 31, the jig side projection 26 formed on the fixed plate 21 'of the rotary jig 3 is caught by the driving side projection 35 formed on the driven gear 34, so that the rotary jig 3 is held together. Let it rotate As described above, a DC voltage of 300 to 600 V / 5 to 10 A is applied to the copper target 6a by the controller 7 while the rotary jig 3 on which the synthetic resins 2 are mounted is rotated. After sputtering the super copper target 6a, the copper film is coated on the synthetic resin 2 by sputtering by plasma for a certain time while adjusting the degree of vacuum to be maintained at about 10 ^-2 to 10 ^-4 mTorr. do.

6. Stainless film coating step

After the copper film coating operation is performed for the time set as described above, a DC (DC) voltage of 400 to 700 V / 5 to 10 A is applied to the stainless target 6b, and argon gas (Ar gas) is formed inside the chamber 1. The stainless film is coated on the outside of the copper film by sputtering by plasma while injecting about 20 to 50 sccm. The stainless film thus coated serves as a protective film to prevent the copper film from being oxidized or worn out.

11 shows an example of a plasma etching apparatus used in the coating operation as described above. A holder 73 for mounting the object to be coated 2 inside the chamber 71 is provided, and the holder 73 is provided. The grounding electrode 74 is provided to surround the holder, and is mounted on the holder 73 while injecting O ₂ and a reactive gas into the chamber 71 through the gas inlet 76 installed in the cover 75. The surface of the synthetic resin 2 is uniformly etched by the O ₂ plasma by applying power to the RF electrode 77 to enhance the adhesion of the conductive coatings.

When the synthetic resins 2 are etched in the plasma etching apparatus as described above, the reason why the adhesion between the coated material (polycarbonate, which is a plastic injection product used as a mobile phone case) and the copper coating, which is a conductive coating, is improved is as follows. .

Figure 12 is a picture seen by comparing the AFM (Atomic Force Microscopy, atomic force electron microscope) before etching characteristics of the surface 12-1 and etching after the surface state (12-2) of the coating is water polycarbonate blood, O ₂ And the reactive gas etching process removes contaminants adsorbed on the surface of the coated object to increase the adsorption rate of the copper film with the copper film coating.

That is, as shown in the photo by the uniform fine surface roughness increases when etching, not only the surface energy increases but also the area in contact with the coating has the effect of anchoring the copper coating when coating the copper film.

FIG. 13 shows the XPS (X-ray Photoelectron Spectroscopy, X-ray Photoelectron Analyzer), which can compare the surface binding energy of the polycarbonate, which is the coated object, with no etching (top graph) and when etching (bottom graph). Compared with the spectra, O ₂ and reactive gas plasma etching process increases the atomic amount of oxygen by about 2 times that of the original synthetic resin, and reduces the COC bond, which is a bond form of the polycarbonate to be coated, and C. When the O bond is increased to coat the copper film, a thin layer of copper-oxygen-carbon composite thin film and copper oxide film is formed at the interface between the coating material and the coating material to promote the interfacial reaction. Promote.

Figure 14 shows a cross-sectional state of a state in which the coating is coated after etching the polycarbonate, the surface state of the polycarbonate is changed to form a copper-oxygen-carbon composite and a copper oxide film at the interface, thereby improving adhesion By coating a stainless film with excellent adhesion to the copper film on the upper surface of the copper film having excellent conductivity and excellent electromagnetic shielding properties, the coating film has excellent adhesion as well as excellent electromagnetic shielding properties despite being coated to a thickness of several micrometers or less. Appears.

Fig. 15 shows the preparation of specimens in which the polycarbonate coated material is not etched (15-1) and in the case of etching (15-2), and coated the copper film on the specimen, followed by scotch tape (3M). A scanning electron microscope photograph showing the adhesion test using a magic tape) shows that the copper film coated on the unetched coated material is easily peeled off by Scotch tape. The copper film can be confirmed that the adhesion is excellent, and even after the heat applied for 2 hours in the water of 100 ℃ exhibited excellent adhesion not peeled off by the Scotch tape.

16 is a scanning microscope photograph comparing the structure of the electromagnetic wave shielding film formed by the conventional spray method with the structure of the electromagnetic wave shielding film formed by the method and the electromagnetic wave shielding apparatus of the present invention. As the surface photograph of the prepared electromagnetic shielding film, the particles coated on the surface of the coating layer are coarse, not dense, and have a large roughness, and much of the coating is exposed to the outside of the coating layer, as shown in 16-2. Electromagnetic shielding film prepared by the present invention can be seen that the surface coating particles are fine, dense, and excellent surface leveling.

In addition, the picture of 16-3 shows that the cross-section of the electric wave shielding film manufactured by the conventional method is not dense in shape, and the coated particles and the particles are separated, and the adhesion between the coated material and the coating layer is separated, resulting in poor adhesion. In the cross-sectional structure, the electromagnetic wave shielding film manufactured by the present invention as shown in 16-4 has a dense coating surface and a surface uniformity as compared with the conventional electromagnetic wave shielding film. And the adhesion between the coating and the coating layer was not only excellent adhesion, it could be confirmed that the coating as thin as 1.3 microns.

17 is an analysis of the components of the conventional electromagnetic shielding film and the electromagnetic shielding film of the present invention with an energy dispersive X-ray spectrometer (EDX), and the electromagnetic shielding film manufactured by the conventional method as shown in 17-1. It can be seen that the main components of the copper and silver, the coating layer is not dense, uneven and exposed to the coating component and the impurity components generated during spray coating carbon and oxygen are present.

However, in the electromagnetic shielding film manufactured by the apparatus and method of the present invention as in 17-2, it can be seen that there are components forming copper and stainless steel, and the coating layer is dense and uniformly exposed to the coated component or impurities. It can be seen that it does not exist.

18 is a tape treatment of the electromagnetic shielding film manufactured by the conventional method and the electromagnetic shielding film manufactured by the apparatus and method of the present invention, and then taken with a scanning microscope picture, respectively, as shown in the photo of 18-1, the conventional electromagnetic shielding film It can be seen that the surface of the coating surface is attached to the tape and peeled off, and as shown in the photograph of 18-2, the surface of the electromagnetic shielding film manufactured by the apparatus and method of the present invention has the same surface shape as before the tape treatment. In this regard, it can be seen that the electromagnetic wave shielding film according to the present invention is superior in adhesion to the conventional electromagnetic wave shielding film.

19 is a comparison of the electromagnetic shielding effect of the ASTM (American Society of Testing and Material) of the electromagnetic shielding film prepared by the conventional spray method and the electromagnetic shielding film manufactured by the apparatus and method according to the present invention, the electromagnetic shielding of the conventional electromagnetic shielding film The effect was 43 to 33 dB at a thickness of 40 micro coating layer, and the electromagnetic shielding film produced by the apparatus and method according to the present invention was 70 to 62 dB at the thickness of 1.3 micro coating layer, so the shielding effect was electromagnetic wave produced by the conventional method. It can be seen that the electromagnetic shielding film produced by the present invention rather than the shielding film has an excellent shielding effect.

By using such a technique, not only plastic (coated material) / metal (coated material), ceramic (coated material) / metal (coated material), fiber (coated material) / metal (coated material), but also micro It can be widely applied to electronic parts, and the above processes are dry coatings using plasma technology and sputtering technology in independent spaces, and are suitable for environmentally friendly industry as a pollution-free process that is differentiated from conventional electroless plating or spray coating.

In addition, since the copper film and the stainless film are manufactured by the sputtering and jig rotation effect precisely, the problem of inferior shielding effect due to the nonuniform coating and the dense coating at the edge of the coated object, which is a problem in the conventional shielding film, could be solved. The thickness of the coating layer and the uniformity of the resistance factor can be maintained within ± 2% by the large-area sputtering cathode, the uniformly arranged gas hole, the close arrangement of the target and the coated object, and the jig rotation.The thickness of the coating layer is controlled to control the thickness of the conductive coating layer. The resistance of the can be finely adjusted.

In addition, the electromagnetic shielding film prepared according to the present invention uses a conductive metal film of a double coating film made of a copper film and a stainless film, thereby producing a copper coating film exhibiting excellent electromagnetic shielding characteristics in a low frequency range and a stainless steel exhibiting excellent electromagnetic shielding characteristics in a high frequency range. It becomes a composite form of the coating film, it is possible to obtain a stable and excellent electromagnetic shielding effect in a wide frequency range.

The chamber is composed of a large chamber of 1200mm in diameter and 1500mm in length to maximize mass production, and the rotating jig is configured to be rotatable in diameter of about 700mm and 1300mm in length, regardless of conductive and non-conductive materials, sizes and shapes. It is possible to install a large amount of coated materials, and to reduce the residual gas pumping time by using the large-scale high speed pumping equipment, and the optimum coating because the surface foreign substances and the injection release agent existing in the apparatus are removed by etching treatment. The condition is created.

In addition, powerful magnets are installed on the backside of the target, so that the sputtered atoms from the target are scattered by the atoms of the discharge gas to improve the sputtering yield reaching the product, and the magnetic field loaded on the target is arranged in equilibrium with the target to be coated. In this way, it is possible to shorten the time for the ionized atoms to reach the coated object and to deposit a wide area, thereby compensating for the disadvantage of the decrease in the film formation rate caused by the conventional shielding film forming methods.

In addition, the coolant is circulated to the rear surface of the target, thereby preventing the magnet from being deformed or aged due to overheating, thereby improving the life of the magnet.

In terms of flammability, the electromagnetic wave shielding film coating apparatus according to the present invention is capable of controlling the amount of power and gas since the entire process is composed of a fully automated system, and it is possible to control the jig rotation speed, so that the jig is superior in terms of economic efficiency, When 10 revolutions have the same film formation speed as the 25-meter in-line sputter system, the manufacturing cost is much lower than that of the 25-meter in-line sputter system.

As described in detail above, in the electromagnetic wave shielding coating method of the present invention, the adhesion between the synthetic resin and the shielding film coated by etching the synthetic resin and then coating the shielding film is improved, the shielding film is dense, and the thickness and composition of the shielding film are uniform. The electromagnetic wave shielding film can be manufactured.

In addition, the synthetic resin is mounted on the cylindrical rotary jig in multiple stages, and by rotating the rotary jig, the shielding coating is performed in the state where the synthetic resin rotates the cylindrical rotary zone, thereby enabling mass coating of the product and uniform coating. Not only is this possible, but no impurities are present in the coating layer.

In addition, the electromagnetic wave shielding film prepared as described above is composed of a double metal film of a copper film and a stainless film to obtain a stable and excellent electromagnetic shielding effect within a wide frequency range, and the stainless film acts as a protective film to prevent surface damage.

Claims (3)

Etching the surface of the synthetic resin using a plasma generated by applying a voltage of 100 to 150 W while injecting a reaction gas of 20 to 50 cm into a etching chamber having a vacuum degree of 30 to 60 mTorr, The etched synthetic resin was applied to a copper electrode and a stainless electrode in turn by applying a voltage of 300 to 600 V / 5 to 10 A while rotating the cylindrical coating region in a cylindrical process chamber having a vacuum degree of 10 ^-2 to 10 ^-4 Torr. Electromagnetic shielding film coating method characterized in that the electromagnetic shielding film is coated on the synthetic resin by sequentially depositing a copper film and a stainless film on the surface of the synthetic resin by sputtering generated. In the coating apparatus, a target is disposed inside the process chamber, and a rotating jig for mounting the object to be coated is disposed inside the chamber, and a jig rotating means is provided for rotating the rotating jig at a constant speed. In The rotary jig is a pair of circular fixing plate that is arranged at a predetermined interval, a plurality of fixing rods fixed at regular intervals to form a cylindrical shape between the circular fixing plates, and positioned on the outside of the jeongdae outside the synthetic resin Electromagnetic shielding film coating apparatus consisting of a clamping means for fixing in a multi-stage in the synthetic resin to rotate the cylindrical coating area and the coating is made. The method of claim 2, wherein the clamping means is a movable clamp disposed on the outer side of the holder, a bolt that is installed at regular intervals so as to penetrate through the holder and the movable clamp, coupled to the bolt to tighten or loosen the movable clamp Electromagnetic shielding film coating device, characterized in that consisting of screws.