KR100273752B1 - Printed circuit board pattern structure for protecting and restrainning eletro-static - Google Patents

Printed circuit board pattern structure for protecting and restrainning eletro-static Download PDF

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KR100273752B1
KR100273752B1 KR1019970070441A KR19970070441A KR100273752B1 KR 100273752 B1 KR100273752 B1 KR 100273752B1 KR 1019970070441 A KR1019970070441 A KR 1019970070441A KR 19970070441 A KR19970070441 A KR 19970070441A KR 100273752 B1 KR100273752 B1 KR 100273752B1
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South Korea
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pattern
patterns
circuit board
printed circuit
line patterns
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KR1019970070441A
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Korean (ko)
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KR19990051165A (en
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정경효
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윤종용
삼성전자 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE: A pattern structure of a printed circuit board for avoiding and reducing static electricity is provided to sufficiently avoid and reduce static electricity. CONSTITUTION: A pattern structure of a printed circuit board comprises signal line patterns(4,6) and ground line patterns(8a,8b,8c), each having sawtooth patterns(20) intermediately. The peaks of adjacent sawtooth patterns(20) of the signal line patterns(4,6) and the ground line patterns(8a,8b,8c) are very close to each other. The distance t between adjacent sawtooth patterns(20) of the signal line patterns(4,6) and the ground line patterns(8a,8b,8c) is of several hundreds microns, e.g., 0.25mm. Static electricity to the signal line patterns(4,6) are transferred from the peaks of the sawtooth patterns of the signal line patterns(4,6) to the peaks of the adjacent sawtooth patterns of the ground line patterns(8a,8b,8c). The sawtooth patterns(20) are solder-masked so as to increase conductivity of the sawtooth patterns(20).

Description

정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조{PRINTED CIRCUIT BOARD PATTERN STRUCTURE FOR PROTECTING AND RESTRAINNING ELETRO-STATIC}Printed circuit board pattern structure to prevent static electricity and attenuation {PRINTED CIRCUIT BOARD PATTERN STRUCTURE FOR PROTECTING AND RESTRAINNING ELETRO-STATIC}

본 발명은 정전기방지를 위한 장치에 관한 것으로, 특히 정전기 방지 및 감쇠를 위한 인쇄회로기판(Printed Circuit Board: PCB)의 패턴구조에 관한 것이다.The present invention relates to an apparatus for preventing static electricity, and more particularly, to a pattern structure of a printed circuit board (PCB) for preventing static electricity and attenuation.

일반적으로 인쇄회로기판상에는 인쇄회로기판에 구비된 임의의 포트를 통해 정전기(예를 들면, 15KV정도의 피크성잡음)가 인가되었을 때 상기 정전기가 인쇄회로기판에 구비된 제어부(회로)까지 가게 됨으로 인해 발생되는 시스템의 악영향을 방지하는 정전기방지 대책이 마련되어 있다. 정전기 방지대책의 일반적인 예로서 도 1에 도시된 바와 같이 인쇄회로기판 2상에 있는 신호라인패턴 4, 6과 접지라인패턴 8b 사이에 커패시터 C1,C2를 접속시켜 정전기량을 감쇠시킨다. 정전기는 도 1에 도시된 외부 입력 또는 출력 잭 14 등을 통해 인입될 수 있다. 도 1에 도시된 외부 입력 또는 출력 잭 14의 일예로서 10,12는 오디오신호의 L채널 및 R채널 잭이다. 그리고 8a,8b,8c는 접지라인 패턴이다.In general, when static electricity (for example, peak noise of about 15 KV) is applied to a printed circuit board through an arbitrary port provided on the printed circuit board, the static electricity reaches the controller (circuit) provided in the printed circuit board. Antistatic measures are in place to prevent adverse effects of the system. As a general example of the antistatic measure, as shown in FIG. 1, the capacitors C1 and C2 are connected between the signal line patterns 4 and 6 and the ground line pattern 8b on the printed circuit board 2 to attenuate the amount of static electricity. Static electricity may be drawn through the external input or output jack 14 and the like shown in FIG. As an example of the external input or output jack 14 shown in FIG. 1, 10 and 12 are L channel and R channel jacks of an audio signal. And 8a, 8b, and 8c are ground line patterns.

그러나 종래기술과 같은 정전기 방지대책으로는 정전기 방지 및 감쇄가 충분히 이루어지지 않을 수 있다.However, antistatic measures such as the prior art may not be sufficiently prevented and attenuated.

따라서 본 발명의 목적은 개선된 정전기 방지 및 감쇄를 위한 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조를 제공하는데 있다.Accordingly, an object of the present invention is to provide a pattern structure of a printed circuit board for antistatic and attenuation for improved antistatic and attenuation.

상기한 목적에 따라 본 발명은, 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조에 있어서, 상기 인쇄회로기판상의 신호라인패턴과 접지라인패턴을 부분적으로 톱니모양이 되게 하고, 상기 신호라인패턴과 상기 접지라인패턴의 톱니 뾰족한 부분을 상호 근접시키며, 상기 신호라인패턴과 접지라인패턴의 톱니모양 부분을 납땝마스크시킴을 특징으로 한다.According to the above object, the present invention, in the pattern structure of the printed circuit board for the static electricity prevention and attenuation, the signal line pattern and the ground line pattern on the printed circuit board partially sawtoothed, and the signal line pattern and The sawtooth sharp portions of the ground line pattern are close to each other, and the sawtooth-shaped portions of the signal line pattern and the ground line pattern are soldered.

또한 본 발명은, 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조에 있어서, 상기 인쇄회로기판상의 신호라인패턴과 접지라인패턴의 폭을 상대편 접지라인패턴과 신호라인패턴이 서로 근접될 수 있을 만큼 넓게하고 상기 신호라인패턴과 접지라인패턴내 중간중간에 상대편 라인패턴쪽으로 꼭지부분이 있는 도형모양을 형성하여 납땝마스크시키는데, 서로 인접하는 신호라인패턴과 접지라인패턴내 상기 도형모양의 납땝마스크들이 서로 근접하여 마주보고 있음을 특징으로 한다.In addition, the present invention, in the pattern structure of the printed circuit board for preventing static electricity and attenuation, the width of the signal line pattern and the ground line pattern on the printed circuit board so that the opposite ground line pattern and the signal line pattern can be close to each other A lead mask is formed by forming a figure having a tip portion toward the opposite line pattern in the middle of the signal line pattern and the ground line pattern, wherein the lead masks of the figure shape in the adjacent signal line pattern and the ground line pattern It is characterized in that it faces close.

도 1은 종래기술의 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조도,1 is a pattern structure diagram of a printed circuit board for antistatic and attenuation of the prior art;

도 2는 본 발명의 제1실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조도,2 is a pattern structure diagram of a printed circuit board for preventing and attenuating static electricity according to a first embodiment of the present invention;

도 3은 본 발명의 제2실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조도.Figure 3 is a pattern structure diagram of a printed circuit board for preventing and attenuating static electricity according to a second embodiment of the present invention.

이하 본 발명의 바람직한 실시예들을 첨부한 도면을 참조하여 상세히 설명한다. 도면들중 동일한 구성요소들 및 동일한 부품들은 가능한한 어느 곳에서든지 동일한 부호들로 나타내고 있음에 유의해야 한다. 또한 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대한 상세한 설명은 생략한다. 그리고 하기 설명에서는 특정 상세들이 본 발명의 이해를 돕기 위해 개시될 것인데 본 발명은 이들 특정 상세들에 의해 한정되지 아니함을 유의하여야 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that like elements and like parts in the figures are denoted by the same reference numerals wherever possible. In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted. And in the following description specific details will be disclosed to aid the understanding of the present invention, it should be noted that the present invention is not limited by these specific details.

도 2는 본 발명의 제1실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조도이고, 도 3은 본 발명의 제2실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조도이다.2 is a pattern structure diagram of a printed circuit board for antistatic and attenuation according to the first embodiment of the present invention, and FIG. 3 is a pattern structure diagram of a printed circuit board for antistatic and attenuation according to a second embodiment of the present invention. to be.

먼저 도 2를 참조하여 본 발명의 제1실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조를 설명한다.First, a pattern structure of a printed circuit board for preventing and attenuating static electricity according to the first embodiment of the present invention will be described with reference to FIG. 2.

도 2를 참조하면, 인쇄회로기판 2상의 신호라인패턴 4,6과 접지라인패턴 8a,8b,8c 각각에는 중간 중간에 톱니모양의 패턴 20들이 존재한다. 상기 신호라인패턴 4,6과 상기 접지라인패턴 8a,8b,8c의 톱니 뾰족한 부분은 옆라인 패턴의 톱니 뾰족한 부분과 아주 근접되어 있다. 상기 신호라인패턴 4,6과 그의 옆라인패턴인 접지라인패턴 8a,8b,8c의 톱니 뾰족한 부분의 근접된 거리폭 t는 수백 미크론(㎛)으로서, 바람직하게는 약 0.25mm정도이다. 상기 약 0.25mm정도의 거리폭 t는 현재 이 분야의 기술 수준에서 라인패턴 서로간이 단락(short)이 되지 않고 인쇄회로기판 제조도 용이한 값이다. 따라서 기술수준이 높아지면 상기 거리폭 t는 인접한 라인패턴 서로 간이 단락이 되지 않는 범위내에서 충분히 좁혀 질 수도 있다. 이렇게 신호라인패턴 4,6과 접지라인패턴 8a,8b,8c에 톱니 뾰족한 부분이 서로 근접한 톱니모양의 패턴 20들을 형성시킴으로서, 입력 및 출력 잭 14를 통해 신호라인패턴 4,6에 인입되는 정전기는 톱니모양의 패턴 20들의 톱니 뾰족한 부분에서 인접한 접지라인패턴 8a,8b,8c의 톱니 뾰족한 부분으로 전달된다. 즉, 접지로 흡수된다.Referring to FIG. 2, in the signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c of the printed circuit board 2, jagged patterns 20 exist in the middle. The jagged points of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b and 8c are very close to the jagged points of the side line pattern. The adjacent distance width t of the pointed teeth of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b and 8c, which are the side line patterns thereof, is several hundred microns (µm), preferably about 0.25 mm. The distance width t of about 0.25 mm is a value that is easy to manufacture a printed circuit board without shorting between the line patterns at the present technical level. Therefore, as the level of technology increases, the distance t may be sufficiently narrowed within a range in which adjacent line patterns do not become short between each other. By forming the sawtooth-shaped patterns 20 in the signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c close to each other, the static electricity introduced into the signal line patterns 4 and 6 through the input and output jacks 14 It is transmitted from the sawtooth point of the sawtooth pattern 20 to the sawtooth point of the adjacent ground line pattern 8a, 8b, 8c. That is, it is absorbed into the ground.

본 발명의 제1실시예에서는 톱니모양의 라인패턴 20들의 도전율을 높이기 위해 상기 톱니모양의 라인패턴 20들의 부분을 납땝 마스크(solder mask)시킨다. 그에 따라, 신호라인패턴 4,6에 인입된 정전기는 접지라인패턴 8a,8b,8c로 훨씬 잘 흡수(전달)될 것이다. 또한 본 발명의 제1실시예에서는 신호 및 접지라인패턴 4,6 및 8a,8b,8c내 톱니모양의 라인패턴 20을 각 라인패턴상에 수개, 바람직하게는 2∼3개정도로 형성함으로써 1차 접지로 흡수되었지만 미약하게 신호라인패턴에 남아 있는 정전기까지도 다음의 톱니모양의 패턴 20을 통해 접지로 흡수하게 한다.In the first embodiment of the present invention, a portion of the sawtooth line pattern 20 is solder masked to increase the conductivity of the sawtooth line pattern 20. Accordingly, the static electricity introduced into the signal line patterns 4 and 6 will be absorbed (transmitted) much better into the ground line patterns 8a, 8b and 8c. Further, in the first embodiment of the present invention, the number of serrated line patterns 20 in the signal and ground line patterns 4, 6 and 8a, 8b, and 8c are formed on each line pattern, preferably about 2 to 3, to form the first order. Even the static electricity absorbed by the ground but weakly remaining in the signal line pattern is absorbed into the ground through the following serrated pattern 20.

다음으로 도 3을 참조하여 본 발명의 제2실시예에 따른 정전기 방지 및 감쇠를 위한 인쇄회로기판의 패턴구조를 설명한다.Next, a pattern structure of a printed circuit board for preventing and attenuating static electricity according to a second embodiment of the present invention will be described with reference to FIG. 3.

도 3을 참조하면, 인쇄회로기판 2상의 신호라인패턴 4,6과 접지라인패턴 8a,8b,8c의 폭 S를 상대편 라인패턴과 서로 근접될 수 있을 만큼 넓게한다. 상기 폭 S는 예컨대, 0.5mm정도가 바람직하다. 그리고 상기 신호라인패턴 4,6과 접지라인패턴 8a,8b,8c내에 상대편 라인패턴쪽으로 꼭지부분이 있는 도형모양이 상대편 라인패턴의 도형모양과 서로 마주보게 하고, 상기 각 도형모양 부분을 납땝마스크(solder mask)시킨다. 도 3을 자세히 살피면, 납땝마스크된 도형모양은 삼각형 모양(▲) 30 및 마름모 모양(◆) 32인데, 삼각형 모양(▲) 30의 납땝마스크는 외곽에 있는 접지라인패턴 8a,8c내에 존재하고 있음을 알 수 있고, 마름모 모양(◆) 32의 납땝마스크는 라인패턴과 라인패턴 사이에 위치하는 라인패턴내에 존재함을 알 수 있다. 즉, 도 3에서 신호라인패턴 4,6과 접지라인패턴 8b내에는 마름모 모양(◆) 32의 납땝마스크가 존재한다. 상기 제2실시예와 같이 마름모 모양(◆) 32 또는 삼각형 모양(▲) 30의 납땝마스크를 각 라인패턴내에 형성시킴으로써 입력 및 출력 잭 14를 통해 신호라인패턴 4,6에 인입되는 정전기는 마름모 모양(◆) 32 또는 삼각형 모양(▲) 30의 납땝마스크의 꼭지점 부분에서 인접한 접지라인패턴 8a,8b,8c의 납땝마스크의 꼭지점 부분으로 전달된다. 즉, 접지로 흡수된다.Referring to FIG. 3, the width S of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b and 8c on the printed circuit board 2 may be widened so as to be close to each other. As for the said width | variety S, about 0.5 mm is preferable, for example. In addition, the shape of a shape having a ridge on the opposite line pattern in the signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c face each other with the shape of the opposite line pattern, and each of the shape portions is a solder mask ( solder mask). Referring to FIG. 3 in detail, the leaded masks have a triangular shape (▲) 30 and a rhombus shape (◆) 32, and the leaded mask of the triangular shape (▲) 30 exists in the ground line patterns 8a and 8c at the outside. It can be seen that the solder mask having a rhombus shape (◆) 32 exists in the line pattern located between the line pattern and the line pattern. That is, in FIG. 3, a solder mask having a rhombus shape is present in the signal line patterns 4 and 6 and the ground line pattern 8b. As shown in the second embodiment, by forming a solder mask having a rhombus shape (◆) 32 or a triangle shape (▲) 30 in each line pattern, the static electricity introduced into the signal line patterns 4 and 6 through the input and output jacks 14 is a rhombus shape. (◆) It is transmitted from the vertex portion of the solder mask of 32 or triangle shape (▲) 30 to the vertex portion of the solder mask of adjacent ground line patterns 8a, 8b, and 8c. That is, it is absorbed into the ground.

제2실시예에서도 신호 및 접지라인패턴 4,6 및 8a,8b,8c내 마름모 모양(◆) 32 또는 삼각형 모양(▲) 30의 납땝마스크를 각 라인패턴상에 수개, 바람직하게는 2∼3개정도로 형성함으로써 1차 접지로 흡수되었지만 미약하게 신호라인패턴에 남아 있는 정전기까지도 다음의 톱니모양의 패턴 20을 통해 접지로 흡수하게 한다.Also in the second embodiment, several soldering masks (R) 32 or triangular (▲) 30 in the signal and ground line patterns 4, 6 and 8a, 8b, and 8c are formed on each line pattern, preferably 2 to 3 By forming the correction diagram, even the static electricity absorbed by the primary ground but weakly remaining in the signal line pattern is absorbed into the ground through the following serrated pattern 20.

상술한 바와 같이 본 발명은 인쇄회로기판상에 신호라인패턴 및 접지라인 패턴의 중간 중간에 톱니모양이 되게 또는 삼각형 및 마름모와 같은 도형모양이 되게 납땝 마스크를 하여 신호라인패턴에 인입된 정전기가 접지라인패턴으로 흡수되게 한다.As described above, the present invention uses a solder mask to form a sawtooth in the middle of the signal line pattern and the ground line pattern on the printed circuit board or a shape such as a triangle and a rhombus to ground the static electricity introduced into the signal line pattern. To be absorbed into the line pattern.

상술한 본 발명의 설명에서는 구체적인 실시예에 관해 설명하였으나, 여러가지 변형이 본 발명의 범위에서 벗어나지 않고 실시할 수 있다. 따라서 본 발명의 범위는 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위와 특허청구범위의 균등한 것에 의해 정해 져야 한다.In the above description of the present invention, specific embodiments have been described, but various modifications can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the equivalent of claims and claims.

Claims (2)

정전기 방지 및 감쇠를 위한 인쇄회로기판(2)의 패턴구조에 있어서,In the pattern structure of the printed circuit board 2 for antistatic and attenuation, 상기 인쇄회로기판(2) 상에 교호적으로 배치된 신호라인패턴들(4,6)과 접지라인패턴들(8a,8b,8c)의 일부를 톱니모양 패턴라인(20)이 되게 하고, 상기 신호라인패턴들(4,6)과 그에 대응하는 상기 접지라인패턴들(8a,8b,8c)의 톱니모양 패턴라인(20)의 뾰족한 부분이, 신호라인패턴 상의 정전기가 대응 접지라인패턴으로 전달되도록 상호 마주보게 배치시키며, 상기 신호라인패턴들(4,6)과 접지라인패턴들(8a,8b,8c)의 톱니모양 패턴라인(20)을 납땝 마스크시킴을 특징으로 하는 인쇄회로기판의 패턴구조.A portion of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c alternately disposed on the printed circuit board 2 become the sawtooth pattern line 20, and the A sharp portion of the sawtooth pattern line 20 of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b and 8c corresponding thereto transmits static electricity on the signal line pattern to the corresponding ground line pattern. A pattern of a printed circuit board, wherein the printed circuit board is arranged to face each other so as to solder the serrated pattern line 20 of the signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c. rescue. 정전기 방지 및 감쇠를 위한 인쇄회로기판(2)의 패턴구조에 있어서,In the pattern structure of the printed circuit board 2 for antistatic and attenuation, 상기 인쇄회로기판(2)상에 교호적으로 배치되며 각각이 일정 폭(S)을 가지는 신호라인패턴들(4,6)과 접지라인패턴들(8a,8b,8c)을 형성하고, 상기 신호라인패턴들(4,6)과 접지라인패턴들(8a,8b,8c)상의 중간 중간에 상대편 라인패턴쪽으로 꼭지점 부분이 있는 도형모양의 납땝 마스크(30,32)들을 형성하며, 서로 인접하는 신호라인패턴과 접지라인패턴내 상기 도형모양의 납땝마스크들(30,32)의 꼭지점 부분이, 신호라인패턴 상의 정전기가 대응 접지라인패턴으로 전달되도록 상호 마주보게 배치됨을 특징으로 하는 인쇄회로기판의 패턴구조.The signal line patterns 4 and 6 and the ground line patterns 8a, 8b, and 8c, which are alternately disposed on the printed circuit board 2 and have a predetermined width S, are formed. In the middle of the line patterns 4,6 and the ground line patterns 8a, 8b, 8c, the shape-shaped solder masks 30, 32 having vertices toward the opposite line pattern are formed and adjacent signals are formed. The pattern of the printed circuit board, wherein the vertex portions of the figure-shaped solder masks 30 and 32 in the line pattern and the ground line pattern are disposed to face each other such that static electricity on the signal line pattern is transferred to the corresponding ground line pattern. rescue.
KR1019970070441A 1997-12-19 1997-12-19 Printed circuit board pattern structure for protecting and restrainning eletro-static KR100273752B1 (en)

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KR100623866B1 (en) * 2004-07-01 2006-09-19 주식회사 팬택 Print Circuit Board to Improvement Discharge Induction Function of Static Electricity and Mobile Communication Terminal with The Same
KR100733386B1 (en) * 2005-12-01 2007-06-29 주식회사액트 Printed circuit board for intercepting electro magnetic and preventing electro-static and manufactutring method thereof
KR100733287B1 (en) * 2005-12-30 2007-06-29 주식회사액트 Printed circuit board for intercepting electro magnetic and preventing electro-static and method of manufactutring the same
CN118139274A (en) * 2024-05-07 2024-06-04 北京木牛领航科技有限公司 PCB discharge structure and design method thereof

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JPS6276558U (en) * 1985-10-31 1987-05-16

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