KR100262498B1 - One block dielectric filter - Google Patents

Abstract

PURPOSE: An unity-type dielectric filter is provided to improve a removal ratio about a neighboring channel signal adjacent to a low frequency area and easily control an attenuation point by improving an attenuation ratio in the lower frequency area than a pass band and controlling a physical length or a width of strip line pattern. CONSTITUTION: A dielectric block(101) is comprised of a first surface and second surface opposite to each other and a side surface between the first surface and the second surface. At least one portion of the second surface and the side surface of the dielectric block(101) is applied by a conductive material. Plural resonant holes(107,108) parallel pass through the first surface and the second surface of the dielectric block(101,201). At least one portion of inner surface of the plural resonant holes(107,108) is applied by the conductive material to form a resonator. A first conductor pattern(117,118) is formed between the resonant holes(107,108) to provide an electric coupling between the resonators. An input pad receiving a signal from the outside and an output pad transmitting to the outside are comprised of the conductive material of the side surface of the dielectric block(101) and an isolated electrode area to provide the electric coupling with the resonant hole(107,108). At least one second conductor pattern(125) is formed along an arrange direction of the resonant hole(107,108) on the first surface of the dielectric block(101) and is insulated from the input pad and the output pad to reinforce a coupling capacitance between the neighboring resonator.

Description

Integrated dielectric filter {One block dielectric filter}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated dielectric filter, and more particularly, to an integrated dielectric filter capable of adjusting the attenuation ratio in a low frequency region where the attenuation ratio of a desired band is easily adjusted in a low frequency region based on a pass band.

In general, a dielectric filter is obtained by connecting a plurality of dielectric blocks provided with a coaxial resonator to obtain desired passband characteristics. An integrated dielectric filter is an advanced filter in the dielectric filter, and a plurality of coaxial resonators in one dielectric block. To simplify the structure.

The dielectric filter is used as a bandpass filter in order to obtain a signal of a desired channel band only in a mobile communication device such as a car phone or a mobile phone using a high frequency band as a communication band. Therefore, the dielectric filter is miniaturized. , Light weight and high impact resistance are required, and the bandpass characteristic of 20-30MHz is required.

1 to 3 show a conventional integrated dielectric filter, in which the integrated dielectric filter shown in FIG. 1 forms a coupling hole 9 between resonance holes 7 and 8 to form mutual inductance and mutual capacitance. By adjusting, the degree of coupling is determined by the size, length, position, and the like of the coupling holes 9. However, this increase in the coupling hole 9 is difficult to form the dielectric filter and the mechanical strength is lowered, there is a problem that it is difficult to meet the requirements of the current mobile communication device. In addition, the integral dielectric filter shown in FIG. 2 does not make the inner diameters of the resonant holes 7 and 8 constant, but varies the inner diameters of specific parts so that the coupling is made by the characteristic impedance difference due to the difference in the inner diameters. As a result, the characteristics are improved as compared to the dielectric filter of FIG. 1, but the manufacturing is complicated and it is difficult to obtain a uniform molded body by varying the inner diameter of the small resonance hole. In addition, unlike the other dielectric filters, another dielectric filter illustrated in FIG. 3 forms an electrode by applying a conductive material to the side of the dielectric block 1 without an open surface, and forms internal electrodes of the resonance holes 7 and 8. The electrodes of the parts 17 and 18 are removed to form a resonance period. This dielectric filter has a problem that it is difficult to remove the electrode accurately at any position on the inner surface of the small resonance holes 7 and 8.

In addition, these days, when the spacing between communication channels is getting closer, a higher attenuation characteristic is required for the dielectric filter, and especially in the case of being very close such as a transmission channel and a reception channel, a higher attenuation ratio is required in a specific band.

For example, in the case of a dielectric filter having a transmission channel as a pass band, a higher attenuation ratio is required in the low frequency region so that a signal of a reception channel close to the low frequency region is not mixed with respect to the pass band. The dielectric filter of cannot satisfy this requirement.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and provides an integrated dielectric filter capable of adjusting the attenuation ratio in a low frequency region capable of blocking a lower frequency out-of-band signal with a higher attenuation ratio based on a passband. It aims to do it.

It is another object of the present invention to provide an integrated dielectric filter capable of adjusting the attenuation ratio in a low frequency region capable of blocking an out-of-band signal of a desired frequency with a higher attenuation ratio among lower frequency bands based on a pass band.

In order to achieve the above object, the dielectric filter according to the first aspect of the present invention includes a first surface and a second surface facing each other and a side surface between the first and second surfaces, and the second surface and the side surface. A dielectric block coated with a conductive material, a plurality of resonant holes penetrating parallel to the first and second surfaces of the dielectric block and having an inner surface coated with a conductive material to form a resonator; An input pad and an output pad, each of which is formed of an electrically conductive material and an isolated electrode region, form an electromagnetic coupling with the resonance hole, and are disposed adjacent to each other at a distance from an end of the resonance hole of the first surface of the dielectric block. It consists of at least one conductor pattern forming an electronic coupling between the resonators.

The conductor pattern is to form coupling capacitance between adjacent resonators and cross coupling inductance between non-adjacent resonators, and is disposed along the resonance hole 配 列 direction at a predetermined distance from the end of the resonance hole on the first surface of the dielectric block. do. As the coupling inductance between the resonators increases by the conductor pattern, it is possible to form a passband having a low frequency region.

In addition, the dielectric filter according to the second aspect of the present invention comprises a first surface and a second surface facing each other and the side between the first surface and the second surface, the second surface and the side is coated with a conductive material A plurality of resonant holes penetrating in parallel with the dielectric block, the first and second surfaces of the dielectric block, the inner surface of which is coated with a conductive material to form a resonator, and an electrode isolated from the conductive material on the side of the dielectric block; An input pad and an output pad each having an area and forming an electromagnetic coupling with the resonance hole, and a resonance frequency adjustment for adjusting a resonance frequency of the resonator extending from a side of the dielectric block toward an end of the resonance hole of the first surface. Consists of a conductor pattern.

1 is a perspective view showing an example of a conventional integrated dielectric filter.

Figure 2A is a perspective view showing another example of a conventional integrated dielectric filter.

FIG. 2B is a cross-sectional view taken along the line A-A 'of the integrated dielectric filter shown in FIG. 2A.

Figure 3A is a perspective view showing another example of a conventional integrated dielectric filter.

3B is a cross-sectional view taken along line B-B 'of the integrated dielectric filter shown in FIG. 3A.

4A-4F are perspective views illustrating examples of dielectric filters in accordance with one embodiment of the present invention.

5 is an equivalent circuit diagram of the integral dielectric filter shown in FIG.

6 is a graph comparing the characteristics of the integrated dielectric filter and the conventional integrated dielectric filter according to the present invention.

7 illustrates another embodiment of an integrated dielectric filter in accordance with the present invention.

FIG. 8 is an equivalent circuit diagram of the integrated dielectric filter shown in FIG. 7. FIG.

* Description of the symbols for the main parts of the drawings *

101,201: dielectric block 107,108: resonance hole

110: input and output pad 117, 118: the first conductor pattern

125,126,127: second conductor pattern

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention.

4 is a perspective view showing an embodiment of an integrated dielectric filter according to the present invention. FIGS. 4A to 4F are views showing examples in which the structure of the entire dielectric block is the same and only the structure of the conductor pattern formed on the front surface is different. . First, as shown in FIG. 4A, the dielectric filter includes a dielectric block including a first surface 120 and a second surface 12 that face each other, and a side surface between the first surface 120 and the second surface 121. 101). A conductive material is coated on the second surface 121 and the side surface to form a ground electrode, and a plurality of resonance holes penetrate substantially parallel to the first surface 120 and the second surface 121 therein. 107,108 are formed. Although not shown in the drawing, internal electrodes made of a conductive material are also applied to the inner surfaces of the resonant holes 107 and 108 to form a resonator.

Input and output pads 110a and 110b shorted to the ground electrode are formed on the side of the dielectric block. The input / output pads 110a and 110b are insulated from the ground electrode by removing a part of the ground electrode, and are formed over the other surface adjacent to one surface of the side surface. That is, an open area in which the conductive material is not applied is formed between the input / output pads 110a and 110b and the ground electrode, and are shorted to each other. At this time, as shown in the figure, the open area extends to the first surface 120 which is an open surface. However, although the open areas of the input / output pads 110a and 110b can extend to the open surface of the first surface 120 as described above, the first surface 120 as shown in FIGS. 4B to 4F described later. Of course, it is possible to apply a conductive material therebetween without extending to the open side.

The front surface of the dielectric block 101, that is, the first surface 120, forms an open surface to which the conductive material is not coated, and has a predetermined size connected to the conductive material inside the resonance holes 107 and 108 around the resonance holes 107 and 108. First conductor patterns 117 and 118 are formed. The first conductor patterns 117 and 118 add load capacitance to the resonator and form coupling capacitance between adjacent resonators.

In addition, a second conductor pattern 125 having a strip line shape formed in a straight line along the arrangement direction of the resonance holes 107 and 108 between the upper side, the resonance holes 107 and 108 and the side surfaces of the resonance holes 107 and 108 is formed. It is disposed substantially parallel to the arrangement of the resonance holes (107, 108). As shown in the drawing, the first conductor pattern 125 is formed at a predetermined distance from the first conductor patterns 117 and 118 to form coupling capacitance between adjacent resonators. In addition, since the second conductor pattern forms an electronic coupling with the input / output terminal, the input / output capacitance can be easily adjusted.

In the present invention described above, the input / output pad, the first conductor pattern and the second conductor pattern are all formed by plating or printing process.

In the example shown in FIG. 4B, the structure of the entire dielectric block 101 is the same as the example shown in FIG. 4A, and since only the structure of the conductor pattern formed on the front surface is different, the description of the dielectric block 101 will be omitted. That is, only the structure of the conductor pattern formed on the first surface 120 will be described. In this case, although the shape of the input / output pads 110a and 110b is different from the example of FIG. 4A, the input / output pads 110a and 110b shown in FIGS. 4A and 4B may be equally applied to all the described examples.

As shown in the drawing, a second conductor pattern having a stripline shape is formed on the first surface 120 of the dielectric block 101 along the arrangement direction of the resonance holes 107 and 108 at a predetermined distance from the ends of the resonance holes 107 and 108. 125 is disposed to form coupling capacitance between adjacent resonators. The above example differs from the example shown in FIG. 4A in that the first conductor pattern is not formed around the resonance holes 107 and 108. In this case, the second conductor pattern 125 may be formed above or below the resonance holes 107 and 108, and may be formed on both upper and lower portions.

In the example shown in FIG. 4C, a third conductor pattern 126 having a stripline shape is formed between the resonance holes 107 and 108 to form coupling capacitance between adjacent resonators. At this time, although the third conductor pattern 126 is formed at a predetermined distance from the conductive material on the side of the dielectric block 101, the third conductor pattern 126 is formed on the conductive material of the side of the dielectric block 101. It may also be connected to. In this case, a coupling capacitance is formed between the internal electrode of the resonance hole 107 and the third conductor pattern 126 and between the internal electrode of the resonance hole 108 and the third conductive pattern 126 so that the dielectric filter is combined as a whole. Capacitance increases.

The example shown in FIG. 4D is a composite example of the example shown in FIG. 4B and the example shown in FIG. 4C. That is, the first surface 120 of the dielectric block 101 has a predetermined width at least one of the upper and lower portions of the resonance holes 107 and 108 along the arrangement direction of the resonance holes 107 and 108 with a predetermined distance from the ends of the resonance holes 107 and 108. And a stripline-shaped second conductor pattern 125 having a length, and a stripline-shaped third conductor pattern 126 is formed between the resonant holes 107 and 108 to form coupling capacitance between adjacent resonators. do. The second conductor pattern 125 and the third conductor pattern 126 may be integrally formed as shown in the drawing, but may be separated from each other.

In the example shown in FIG. 4E, as shown in the drawing, a fourth conductor pattern having a stripline shape is formed between the resonance holes 107 and 108, but the fourth conductor pattern has two conductor patterns 127a and 127b separated by a set width. Divided into One fourth conductor pattern 127a extends from the conductive material on the side of the dielectric block 101 to the resonance holes 107 and 108, while the other fourth conductor pattern 127b extends from the opposite side of the dielectric block 101. It extends between the resonant holes (107, 108), a predetermined width is maintained between the fourth conductor pattern (127a, 127b).

The example shown in Fig. 4F has a different shape and structure than the example shown in Figs. 4A to 4E. The second conductor pattern 125 having a stripline shape is disposed on the resonance holes 107 and 108 on the first surface 120 of the dielectric block 101 along the arrangement direction of the resonance holes 107 and 108 to form coupling capacitance between the resonators. The fifth conductor patterns 129a and 129b having predetermined sizes are formed on the left and right sides of the strip line-shaped second conductor pattern 125 and below the resonance holes 107 and 108. The fifth conductor pattern 129a formed on the left and right in the longitudinal direction of the second conductor pattern 125 is integrally formed with the second conductor pattern 125 and the fifth conductor pattern 129b formed under the resonance holes 107 and 108 is formed. It is connected to the conductive material on the side of the dielectric block 101.

The fifth conductor pattern 129b is a conductor pattern for resonant frequency adjustment for adjusting the resonant frequency of the resonator. The fifth conductor patterns 129a and 129b for adjusting the resonant frequency, like the first to fourth conductor patterns, form a conductive pattern having a predetermined size on the first surface 120 of the dielectric block 101, and then, in some regions. By eliminating this, the resonance frequency of the resonator can be finely adjusted. The fifth conductor pattern 129a formed on the left and right in the longitudinal direction of the second conductor pattern 125 may be formed integrally with the second conductor pattern 120 as shown in the drawing, but the second conductor pattern 120 may be formed. It is also possible to form at regular intervals apart from). In addition, it may be formed only on the left and right sides of the second conductor pattern 120. The fifth conductor pattern 129b formed under the resonance holes 107 and 108 may also be formed to short-circuit with the conductive material on the side of the dielectric block 101.

As described above, the equivalent circuits of the respective examples of the dielectric filter shown in FIGS. 4A to 4F are the same as those shown in FIG. Therefore, the operation of the dielectric filter according to the temporary embodiment of the present invention will be described in detail with reference to the equivalent circuit diagram and the example shown in FIG. 4A.

In the drawings, reference numerals R ₁ and R ₂ denote resonators, respectively, and C ₁ and C ₁ denote an input / output end coupling formed between the first conductor patterns 117 and 118 of the dielectric block 101 and the input / output pads 110a and 110b. Capacitance is shown and C ₁₂ represents the coupling capacitance between the resonators R ₁ and R ₂ , and M ₁₂ represents the coupling inductance between the resonators R ₁ and R ₂ . The coupling capacitance C ₁₂ coupling the resonator is formed between the first conductor patterns 117 and 118 formed on the first surface 120 of the dielectric block 101. In the equivalent circuit diagram of the above configuration, when a signal is input to the input terminal 110a, an electric field is formed in the two resonance holes 107 and 108 to operate the resonator. At this time, the coupling capacitance C ₁₂ between the resonators is increased by the second conductor pattern 125 formed on the first surface 120, while the coupling inductance M ₁₂ is decreased.

That is, the coupling capacitance C ₁₂ is increased than when the second conductor pattern 125 is not formed. The increase rate of the coupling capacitance C ₁₂ is adjustable according to the length and width of the second conductor pattern 125. As the length and width increase, the coupling capacitance C ₁₂ increases.

That is, as in the equivalent circuit of FIG. 5, the coupling capacitance C ₁₂ and the coupling inductance M ₁₂ between the two resonance holes 107 and 108 are formed by the second conductor pattern 125. Therefore, the impedance value becomes maximum at the resonance point according to the coupling capacitance C ₁₂ and the coupling inductance M ₁₂ , and the attenuation occurs at the resonance point to the maximum.

The resonance point is changed by changing the coupling capacitance C ₁₂ , the coupling inductance M ₁₂ , or two values. As described above, the values of the coupling capacitance C ₁₂ and the coupling inductance M ₁₂ may be changed by changing the length and width of the second conductor pattern 125. As a result, the second conductor pattern 125 may be changed. By adjusting the length and width of the attenuation point can be adjusted.

In addition, as described above, since the coupling capacitance C ₁₂ is increased than when the second conductor pattern 125 is absent, the attenuation point is always located in a low frequency region based on the pass band of the integrated dielectric filter. Therefore, the attenuation ratio is adjusted in the frequency region lower than the pass band by the second conductor pattern 125.

The filter characteristics of the integrated dielectric filter according to the present invention and the characteristics of the conventional integrated dielectric filter were compared with the graph of FIG. 6. In the graph of FIG. 6, in the dielectric filter having the pass band of 896.1 MHz to about 20 MHz, the solid line in the graph of FIG. 6 adjusts the length and width of the second conductor pattern 125 so that attenuation occurs in the 855.0 MHz band. ) Is a frequency-specific gain of the dielectric filter formed, and the dotted line is a graph showing the characteristics of the dielectric filter without the resonator formed by the stripline pattern as in the prior art.

As shown in the graph of FIG. 6, the frequency region higher than the pass band is not significantly different from the prior art, but it can be seen that more than 20 dB of attenuation occurs in the frequency region lower than the pass band.

In the above description, although only the dielectric block having two resonance holes formed in the dielectric block is described, the present invention is not limited to the above-described example. That is, as shown in FIG. 7, the present invention is also applicable to a dielectric filter having three or more resonance holes. At this time, the conductor pattern 225 disposed above the resonance holes 207, 208, and 209 along the arrangement direction of the resonance holes 207, 208, and 209 is adjacent to the resonators R ₁ , R _2, and R ₂ , as shown in the equivalent circuit diagram of FIG. 8. In addition to forming coupling capacitances C ₁₂ and C ₂₃ between R ₃ ), cross coupling capacitances C ₁₂₃ are formed between non-adjacent resonators R ₂₃ .

In addition, although the input / output pads 210a and 210b are formed on the side of the dielectric block 201 in this embodiment, the input / output pads 210a and 210b may be formed on the first surface of the dielectric block 201. It can also form over a 1st surface and a side surface.

As in the embodiment shown in Fig. 4, the shape and position of the conductor pattern 225 are not limited to a specific place in the example of the sealing but other conductor patterns may also be arranged.

As described above, the integrated dielectric filter according to the present invention can increase the attenuation ratio in the frequency region lower than the pass band, thereby increasing the removal ratio for the adjacent channel signal adjacent to the low frequency region, and in addition, the stripline. By adjusting the physical length or width of the pattern, the attenuation point can be easily adjusted, and the attenuation ratio can be higher in the desired frequency band in the lower frequency band than the pass band, so that the user can meet various needs. .

In addition, the integrated dielectric filter according to the present invention has an excellent effect of increasing the rejection ratio of adjacent channels in a frequency region lower than that of a selected channel, which is used in a wireless communication device in accordance with the demand of the narrower interval between adjacent channels. .

Claims (40)

A dielectric block having a first surface and a second surface facing each other and a side surface between the first surface and the second surface, wherein at least a portion of the second surface and the side surface is coated with a conductive material; A plurality of resonance holes penetrating the first and second surfaces of the dielectric block in parallel and at least a portion of the inner surface of the dielectric block is coated with a conductive material to form a resonator; A first conductor pattern formed between the resonance holes to form an electromagnetic coupling between the resonators; An input pad comprising a conductive material on the side of the dielectric block and an isolated electrode region, the input pad receiving a signal from the outside forming an electromagnetic coupling with the resonance hole, and an output pad transmitting a signal to the outside; And And at least one second conductor pattern formed on the first surface of the dielectric block along an arrangement direction of the resonance hole and insulated from the input pad and the output pad to enhance coupling capacitance between adjacent resonators. The dielectric filter of claim 1, wherein the second conductor pattern is formed on at least one of upper and lower portions of the resonance hole. The dielectric filter as claimed in claim 1, wherein the second conductor pattern is formed over at least two resonance holes. The dielectric filter as claimed in claim 3, wherein at least two resonance hole ends of the second conductor pattern are formed. The dielectric filter of claim 1, wherein the second conductor pattern is insulated from a conductive material on the side of the dielectric block and a conductive material in the resonance hole. The dielectric filter of claim 1, wherein the second conductor pattern has a straight line shape. The resonator of claim 1, wherein the first conductor pattern is formed to have a predetermined size around at least one resonance hole of the first surface of the dielectric block so as to be connected to a conductive material applied in the resonance hole to provide a load capacitor to the resonator. And at least one conductor pattern for forming an electromagnetic coupling between adjacent resonators. The dielectric filter of claim 1, wherein the first conductor pattern is at least one conductor pattern formed between end portions of the resonance holes of the first surface of the dielectric block to form an electromagnetic coupling between adjacent resonators. The dielectric filter of claim 8, wherein one end of the first conductor pattern is connected to a conductive material applied to a side surface of the dielectric block. The dielectric filter of claim 8, wherein both ends of the first conductor pattern are connected to a conductive material applied to a side surface of the dielectric block. The method of claim 8, wherein at least two first conductive patterns are formed between ends of the resonance holes, and one end of each of the patterns is connected to a conductive material applied to the side surface of the dielectric block to face each other at a predetermined distance. Dielectric filter, characterized in that. The dielectric filter of claim 8, wherein the first conductor pattern is integrally formed with the second conductor pattern. The dielectric filter of claim 1, further comprising at least one third conductor pattern for adjusting the resonance frequency formed on the first surface of the dielectric block to adjust the resonance frequency of the resonator. The dielectric filter as claimed in claim 13, wherein the third conductor pattern is formed from the conductive material on the side of the dielectric block toward the end of the resonance hole on the first surface. The dielectric filter according to claim 13, wherein the resonant frequency of the resonator is adjusted by adjusting the distance between the area of the third conductor pattern and the hole end portion. The dielectric filter as claimed in claim 13, wherein the third conductor pattern is formed from the second conductor pattern toward the end of the resonance hole of the first surface. The dielectric filter as claimed in claim 13, wherein the third conductor pattern is formed from the second conductor pattern toward the side of the dielectric block. The dielectric filter of claim 1, wherein the input pad and the output pad are formed on a first surface. The dielectric filter of claim 4, wherein the input pads and the output pads are formed on first and side surfaces thereof. A dielectric block having a first surface and a second surface facing each other and a side surface between the first surface and the second surface, wherein at least a portion of the second surface and the side surface is coated with a conductive material; A plurality of resonance holes penetrating the first and second surfaces of the dielectric block in parallel and at least a portion of the inner surface of the dielectric block is coated with a conductive material to form a resonator; A first conductor pattern formed between the resonance holes to form an electromagnetic coupling between the resonators; An input pad including a conductive material on the side of the dielectric block and an isolated electrode region, the input pad receiving a signal from the outside forming an electromagnetic coupling with the resonance hole, and an output pad outputting the signal to the outside; And At least one second formed along the arrangement direction of the resonance hole at a predetermined distance from an end of the resonance hole of the first surface of the dielectric block and insulated from the input pad and the output pad to enhance coupling capacitance between adjacent resonators; A dielectric filter comprising a conductor pattern. A dielectric block having a first surface and a second surface facing each other and a side surface between the first surface and the second surface, wherein at least a portion of the second surface and the side surface is coated with a conductive material; A plurality of resonance holes penetrating the first and second surfaces of the dielectric block in parallel and at least a portion of the inner surface of the dielectric block is coated with a conductive material to form a resonator; A first conductor pattern formed between the resonance holes to form an electromagnetic coupling between the resonators; An input pad comprising a conductive material on the side of the dielectric block and an isolated electrode region, the input pad receiving a signal from the outside forming an electromagnetic coupling with the resonance hole, and an output pad transmitting a signal to the outside; And At least one formed on the first surface of the dielectric block along the arrangement direction of the resonance hole and insulated from the input pad and the output pad to enhance coupling capacitance between adjacent resonators and cross-crossing capacitance between non-adjacent resonators. A dielectric filter comprising a second conductor pattern. 22. The dielectric filter of claim 21, wherein the second conductor pattern is formed on at least one of upper and lower portions of the resonance hole. 22. The dielectric filter of claim 21, wherein the second conductor pattern is formed over at least three resonance holes. 24. The dielectric filter of claim 23, wherein at least three resonance hole ends of the second conductor pattern are formed. 22. The dielectric filter of claim 21, wherein the second conductor pattern is insulated from the conductive material on the side of the dielectric block and the conductive material in the resonance hole. 22. The dielectric filter of claim 21, wherein the second conductor pattern is linear. 22. The load capacitor of claim 21, wherein the first conductor pattern is formed to have a predetermined size around at least one resonance hole of the first surface of the dielectric block so as to be connected to a conductive material applied in the resonance hole. And at least one conductor pattern for forming an electromagnetic coupling between adjacent resonators. 22. The dielectric filter of claim 21, wherein the first conductor pattern is at least one conductor pattern formed between end portions of the resonance holes of the first surface of the dielectric block to form an electromagnetic coupling between adjacent resonators. 22. The dielectric filter of claim 21, wherein one end of the first conductor pattern is connected to a conductive material applied to a side surface of the dielectric block. 29. The dielectric filter of claim 28, wherein both ends of the first conductor pattern are formed in contact with a conductive material applied to the side surface of the dielectric block. 29. The method of claim 28, wherein at least two first conductive patterns are formed between the ends of the resonance holes, and one end of each pattern is formed to be connected to the conductive material applied to the side surface of the dielectric block so as to face at a predetermined distance. Dielectric filter, characterized in that. 29. The dielectric filter of claim 28, wherein the first conductor pattern is integrally formed with the second conductor pattern. 22. The dielectric filter of claim 21, further comprising at least one third conductor pattern for adjusting the resonant frequency formed on the first surface of the dielectric block to adjust the resonant frequency of the resonator. 34. The dielectric filter of claim 33, wherein the third conductor pattern is formed from the conductive material on the side of the dielectric block toward the end of the resonance hole of the first surface. 34. The dielectric filter of claim 33, wherein the resonant frequency of the resonator is adjusted by adjusting the distance between the area of the third conductor pattern and the hole end. 34. The dielectric filter of claim 33, wherein the third conductor pattern is formed from the second conductor pattern toward the end of the resonance hole of the first surface. 34. The dielectric filter of claim 33, wherein the third conductor pattern is formed from the second conductor pattern toward the side of the dielectric block. 22. The dielectric filter of claim 21, wherein the input pad and the output pad are formed on a first surface. 22. The dielectric filter of claim 21, wherein the input pads and the output pads are formed on first and side surfaces thereof. A dielectric block having a first surface and a second surface facing each other and a side surface between the first surface and the second surface, wherein at least a portion of the second surface and the side surface is coated with a conductive material; A plurality of resonance holes penetrating the first and second surfaces of the dielectric block in parallel and at least a portion of the inner surface of the dielectric block is coated with a conductive material to form a resonator; A first conductor pattern formed between the resonance holes to form an electromagnetic coupling between the resonators; An input pad including a conductive material on the side of the dielectric block and an electrode region and receiving an external signal to form an electromagnetic coupling with the resonance hole, and an output pad for transmitting a signal to the outside; And It is formed along the arrangement direction of the resonance hole at a distance from the end of the resonance hole of the first surface of the dielectric block and insulated from the input pad and the output pad to strengthen the coupling capacitance between adjacent resonators and cross between non-adjacent resonators. A dielectric filter comprising at least one second conductor pattern forming a coupling capacitance.