KR100261549B1 - Dielectric ceramic composition for microwave - Google Patents
Dielectric ceramic composition for microwave Download PDFInfo
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- KR100261549B1 KR100261549B1 KR1019970072533A KR19970072533A KR100261549B1 KR 100261549 B1 KR100261549 B1 KR 100261549B1 KR 1019970072533 A KR1019970072533 A KR 1019970072533A KR 19970072533 A KR19970072533 A KR 19970072533A KR 100261549 B1 KR100261549 B1 KR 100261549B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 239000000919 ceramic Substances 0.000 title 1
- 238000005245 sintering Methods 0.000 claims abstract description 25
- 238000002156 mixing Methods 0.000 claims abstract 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 abstract description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract 2
- 230000001413 cellular effect Effects 0.000 abstract 1
- 238000009766 low-temperature sintering Methods 0.000 abstract 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 16
- 239000003989 dielectric material Substances 0.000 description 12
- 238000002844 melting Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000006467 substitution reaction Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000002123 temporal effect Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005467 ceramic manufacturing process Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1254—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
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Abstract
Description
본 발명은 공진주파수의 온도계수가 상대적으로 큰 유전체 재료의 구성원소중 한 원소를 같은 원자가를 가지는 다른 원소로 치환하여 높은 유전율 및 Q×fo값을 지니면서, 공진주파수의 온도계수의 안정성이 큰 고주파 유전체 조성물 및 이의 제조 방법에 관한 것이다.According to the present invention, a high frequency of stability of the temperature coefficient of the resonant frequency has a high dielectric constant and Q × f o value by substituting one element of a member of the dielectric material having a relatively high temperature coefficient of resonant frequency with another element having the same valence. A dielectric composition and a method of making the same.
휴대용 이동전화기와 같은 고주파대역에서 사용하는 이동통신기기의 사용이 급격히 보편화됨에 따라 여기에 사용되는 마이크로파 유전체소자의 소형, 경량화, 고성능화에 대한 요구가 증대하고 있다. 이의 해결방안으로 주목을 받는 제작공정상의 기술은 적층형 캐패시터(capacitor)나 다중회로기판의 제작분야에서 보편화되어 있는 소자의 다층화 기술인데, 이 기술을 적용하려면 소자를 구성하는 유전체 물질이 내부회로를 구성하는 금속의 용융점보다 낮은 온도에서 소결이 가능해야 한다. 특히 수백 MHZ이상의 마이크로파 대역에서는 다층소자의 내부 도체 금속의 저항에 의한 손실이 소자의 성능에 큰 영향을 끼치므로 내부도체금속 은(Ag)이나 구리(Cu)와 같은 높은 전기 전도도를 가지는 금속을 사용하는 것이 유리하다. 그러나 휴대용 전화기의 공진소자나 필터, 듀플렉서(duplexer) 제조에 사용되는 마이크로파 유전체 재료의 경우 소결온도 범위가 대개 1,200℃∼1,500℃ 사이로 은(용융점 961℃)이나 구리(용융점 1,064℃)의 용융점 보다 매우 높으므로 이들을 그대로 사용하는 것을 불가능하다.As the use of mobile communication devices used in high frequency bands, such as portable mobile phones, is rapidly becoming more common, the demand for miniaturization, light weight, and high performance of microwave dielectric elements used therein is increasing. The manufacturing process technology attracting attention as a solution to this problem is a multilayer technology of devices that are common in the fabrication of multilayer capacitors and multi-circuit boards. To apply this technology, the dielectric material constituting the device constitutes an internal circuit. It must be possible to sinter at temperatures below the melting point of the metal. Especially in the microwave band of several hundred MH Z or more, the loss due to the resistance of the internal conductor metal of the multilayer device greatly affects the performance of the device. Therefore, a metal having high electrical conductivity such as silver (Ag) or copper (Cu) It is advantageous to use. However, microwave dielectric materials used in the manufacture of resonators, filters, and duplexers in portable telephones usually have a sintering temperature range of 1,200 ° C to 1500 ° C, much higher than the melting point of silver (melting point 961 ° C) or copper (melting point 1,064 ° C). Therefore, it is impossible to use them as they are.
따라서 기존의 마이크로파 유전체 재료에 저온에서의 소결성을 높이기 위한 소결조제를 첨가하거나 그 자체로 소결온도가 낮은 저온소결형 마이크로파 유전체 재료를 개발하여 은이나 구리와 동시소결이 가능하도록 하기위한 연구가 활발이 진행되고 있다.Therefore, research is being actively conducted to add co-sintering with silver or copper by adding a sintering aid to increase the sinterability at low temperature to existing microwave dielectric materials or developing low-temperature sintered microwave dielectric materials with low sintering temperature. It's going on.
마이크로파 유전체 재료에서 요구되는 가장 중요한 특성으로는The most important properties required for microwave dielectric materials are
1) 유전체의 크기가 유전율의 1/2 승에 반비례하여 감소하기 때문에 소자의 소형화를 위해 유전율(εr)이 커야 하고,1) Since the size of the dielectric decreases in inverse proportion to the half power of the dielectric constant, the dielectric constant (ε r ) must be large to reduce the size of the device.
2) 공진주파수의 선택성을 향상시키기 위해 Q값(=1/tan δ)이 높아야 하고,2) The Q value (= 1 / tan δ) should be high to improve the selectivity of the resonance frequency.
3) 온도변화에 따른 안정된 공진특성을 얻기 위해서 공진주파수의 온도계수(τf)의 경시변화가 양호해야 한다.3) The temporal change of the temperature coefficient (τ f ) of the resonance frequency should be good in order to obtain stable resonance characteristics according to the temperature change.
따라서 마이크로파 유전체 재료는 위의 요구 특성을 만족해야 하므로 소결온도를 낮추더라도 제반 유전특성을 저하시키지는 않아야 한다.Therefore, the microwave dielectric material must satisfy the above requirements, and therefore, even if the sintering temperature is lowered, the dielectric properties should not be reduced.
여러 가지 마이크로파 유전체 재료 중 Bi2O3-Nb2O5계 유전체는 낮은소결온도(1,100℃)를 가지며 따라서 이에 소결조제를 첨가하여 소결온도를 1,000℃ 이하로 낮추어 은 등과 동시소결이 가능한 마이크로파 유전체 재료로 응용이 가능하다. 이동통신기기의 공진주파수의 온도특성이 안정화되고 공진회로의 온도보상이 용이하려면 공진주파수의 온도계수의 경시변화가 안정되는 것이 중요하다.Among various microwave dielectric materials, Bi 2 O 3 -Nb 2 O 5 -based dielectrics have a low sintering temperature (1,100 ° C). Therefore, the sintering aid is added to reduce the sintering temperature to 1,000 ° C or below. It can be applied as a material. In order to stabilize the temperature characteristics of the resonant frequency of the mobile communication device and to facilitate temperature compensation of the resonant circuit, it is important to stabilize the temporal change of the temperature coefficient of the resonant frequency.
따라서, 본 발명은 유전체의 고유한 유전특성을 저하시키지 않거나 오히려 양호한 유전특성을 나타내면서도 공진주파수의 온도계수의 경시변화가 작고 소결온도가 은의 용융점인 961℃이하인 마이크로파용 유전체 조성물을 제공하고자 한다.Accordingly, the present invention is to provide a dielectric composition for microwaves, which does not degrade the intrinsic dielectric properties of the dielectric or rather exhibits good dielectric properties, but has a small change over time in the temperature coefficient of the resonance frequency and a sintering temperature of 961 ° C. or less, which is a melting point of silver.
제1도는 Nd2O3의 몰비변화에 따른 Bi1-XNdxNbO4마이크로파 유전체의 온도계수변화를 나타낸 그래프.1 is a graph showing the temperature coefficient change of Bi 1-X Nd x NbO 4 microwave dielectric according to the molar ratio change of Nd 2 O 3 .
Bi2O3와 Nb2O5가 몰비로 1:1인 조성에서 유전특성을 결정하는 인자는 Nb2O5이므로, 본 발명에서는, 유전특성값을 저하시키지 않기 위해 Nb2O5의 양은 고정하는 대신, Bi2O3를 같은 원자가를 가지는 다른 원소로 치환하여 Bi2O3유전체의 고유한 유전특성을 저하시키지 않거나 오히려 양호한 유전특성을 나타내면서도 공진주파수의 온도계수의 경시변화가 작은 값을 가지고 소결온도가 은의 용융점인 961℃이하인 마이크로파용 유전체 조성물을 얻는 데 그 기술적 특징을 두고 있다.In the composition of Bi 2 O 3 and Nb 2 O 5 in a molar ratio of 1: 1, the factor for determining the dielectric properties is Nb 2 O 5, so in the present invention, the amount of Nb 2 O 5 is fixed so as not to lower the dielectric property value. Instead, it replaces Bi 2 O 3 with another element having the same valence so as not to reduce the inherent dielectric properties of the Bi 2 O 3 dielectric or to show good dielectric properties but to change the temporal coefficient of resonant frequency over time. The technical characteristics thereof are to obtain a microwave dielectric composition having a sintering temperature of 961 ° C. or less, which is a melting point of silver.
본 발명의 마이크로파용 유전체 조성물은, Bi1-XMxNbO4로 표시되는 조성계에서 0<x≤0.15이며, M+3은 Nd+3, La+3, Sm+3, Pr+3이루어진 그룹에서 선택된다.The dielectric composition for microwaves of the present invention is 0 <x≤0.15 in a composition system represented by Bi 1-X M x NbO 4 , and M +3 is a group consisting of Nd +3 , La +3 , Sm +3 , and Pr +3 Is selected.
본 발명의 마이크로파용 유전체 조성물은, 소결조제로 CuO를 0.105wt%-0.125wt% 첨가한 (-)의 공진주파수의 온도계수값을 가지는 BiNbO4유전체의 Bi+3를 M+3로 일정비율 치환하여 이루어진다.In the dielectric composition for microwaves of the present invention, Bi + 3 of BiNbO 4 dielectric having a temperature coefficient value of a negative resonance frequency of 0.105 wt% -0.125 wt% of CuO as a sintering aid is substituted by a constant ratio M + 3 Is done.
본 발명에서 Bi2O3를 치환하는 원소는 Nd2O3,La2O3, Sm2O3, Pr2O3등이 있으며, Nd2O3가 가장 바람직하고, Nd2O3의 치환량이 0.025몰일 때 가장 양호한 유전특성 및 공진 주파수의 온도계수값을 나타내며 일반적인 세라믹 제조공정을 거쳐 마이크로파 소자로 제조된다.In the present invention, the elements for substituting Bi 2 O 3 include Nd 2 O 3, La 2 O 3 , Sm 2 O 3 , Pr 2 O 3, and the like. Nd 2 O 3 is most preferable, and the amount of substitution of Nd 2 O 3 is It is 0.025 mole which shows the best dielectric characteristic and temperature coefficient value of resonant frequency and it is manufactured by microwave device through general ceramic manufacturing process.
도 1은, Nd2O3의 몰비변화에 따른 Bi1-XNdxNbO4(이하 BNN 이라 칭함) 마이크로파 유전체의 공진주파수의 온도계수값 ( f)의 변화를 나타낸 것으로 Nd2O3의 치환량이 증가할수록 그 값이 (+) 방향으로 점차 커지는 것을 볼 수 있다. 전술한 바와 같이 Nd2O3를 치환하지 않은 순수한 BiNbO4는 공진주파수의 온도계수가 약 -21ppm/℃이나 Bi2O3를 Nd2O3로 일정량 치환하면 그값을 (+) 방향으로 증가시켜 0에 근접하는 양호한 공진주파수의 온도계수값을 나타내게 된다.1 is a temperature coefficient value of the resonance frequency of a Bi 1-X Nd x NbO 4 (hereinafter referred to as BNN) microwave dielectric according to a change in the molar ratio of Nd 2 O 3 ( f ) shows a change in the value of Nd 2 O 3 It can be seen that the value gradually increases in the (+) direction. As described above, pure BiNbO 4 which does not substitute Nd 2 O 3 has a temperature coefficient of resonant frequency of about -21 ppm / ° C., but when Bi 2 O 3 is replaced with Nd 2 O 3 by a certain amount, the value is increased in the (+) direction to 0. The temperature coefficient value of the good resonant frequency close to is shown.
본 발명의 마이크로파 유전체 조성물의 제조과정과 제반 고주파 유전특성은 다음의 실시예를 통하여 보다 명확하게 이해할 수 있을 것이나, 본 발명이 이에 한정되는 것은 아니다.The manufacturing process and general high frequency dielectric properties of the microwave dielectric composition of the present invention will be more clearly understood through the following examples, but the present invention is not limited thereto.
[실시예 1]Example 1
기본원료로 순도 99.9%이상의 Bi2O3, Nb2O5, La2O3, Nd2O3,Sm2O3, Pr2O3,CuO를 사용하여 이들 원료 분말들을 아래의 표 1과 같은 조성이 되도록 정확히 평량한 다음 에탄올을 용매로하여 16시간동안 습식홉합하였다.These raw powders were prepared by using Bi 2 O 3 , Nb 2 O 5 , La 2 O 3 , Nd 2 O 3, Sm 2 O 3 , Pr 2 O 3, CuO with a purity of 99.9% or more as a basic raw material. Accurately weighed to the same composition and then wet hopped for 16 hours with ethanol as a solvent.
혼합이 완료된 분말을 건조기에서 12시간이상 충분히 건조시킨다음 800℃의 온도에서 2시간 유지시켜 하소한 다음 소결조제로 CuO를 0.105wt% 첨가하여 16시간동안 습식분쇄시켜 건조분말을 얻었다.The mixed powder was sufficiently dried in a drier for at least 12 hours, and then calcined by maintaining at a temperature of 800 ° C. for 2 hours, followed by wet grinding for 16 hours by adding 0.105 wt% of CuO as a sintering aid to obtain a dry powder.
건조분말에 결합제로 5% PVA 수용액을 혼합하여 체가름한 후 지름 15㎜의 원주형 금형에서 450㎏/㎠의 압력으로 성형한 뒤 백금상자에 넣어 소결하였다.5% PVA aqueous solution was mixed with a dry powder and sieved, and then sieved.
이 때, 소결조건은 은의 용융융온도 이하인 920℃, 940℃, 960℃의 소결온도에서 대기중 2시간으로 하였다.At this time, the sintering conditions were 2 hours in the air at the sintering temperature of 920 degreeC, 940 degreeC, and 960 degreeC which are below the melting-melting temperature of silver.
소결시편에 대한 마이크로파 대역에서의 유전특성 측정으로 유전상수와 Qxfo값은 네트워크 분석기(Hewlett packard HP8510B)에 연결된 두 장의 평행도체판 사이에 원주상 시편을 넣어 구성한 공진기에서 TE11모드의 공진특성을 얻어 유전체의 유전상수와 Q×fo값을 계산하는 Hakki-Coleman법을 이용하여 측정하였다. [참고문헌 : B. W. Hakki, P.D. Coleman, "A Dielectric Resonator Method of measuring Inductive Capacitance in the Millimeter Range.", IRE. Trans., Microwave Theory Tech., 8, p402, (1960)] 공진주파수의 온도계수는 알루미늄으로 만든 공동(cavity) 공진기내에 시편을 넣고 상온(25℃)에서의 공진주파수 f25와 65℃에서의 공진주파수 f65를 측정하여 계산하였다.The dielectric constant and Qxf o values for the sintered specimens were measured in the microwave band, and the dielectric constant and Qxf o value were measured in the resonator of TE 11 mode in a resonator composed of circumferential specimens between two parallel conductor plates connected to a network analyzer (Hewlett packard HP8510B). The dielectric constant and Q × f o value of the obtained dielectric material were measured using the Hakki-Coleman method. [Reference: BW Hakki, PD Coleman, "A Dielectric Resonator Method of measuring Inductive Capacitance in the Millimeter Range.", IRE. Trans., Microwave Theory Tech., 8, p402, (1960)] The temperature coefficient of the resonant frequency is determined by placing the specimen in a cavity resonator made of aluminum at the resonant frequencies f 25 and 65 ° C at room temperature (25 ° C). The resonance frequency f 65 was measured and calculated.
이들 시편에 대한 유전상수, Q×fo값 및 공진주파수의 온도계수 측정결과를 표 1에 나타내었다.Table 1 shows the results of measuring the temperature constants of the dielectric constant, Q × f o value and resonance frequency for these specimens.
[실시예 2]Example 2
실시예 1의 기본제조공정에서 Bi2O3를 Nd2O3만으로 0.015몰에서 0.15몰까지 치환량을 달리하여 소결조제로 CuO를 0.125wt% 첨가한 후 마이크로파용 유전체를 제조하였다.In the basic manufacturing process of Example 1 Bi 2 O 3 was changed from 0.015 mol to 0.15 mol with only Nd 2 O 3 by adding 0.125wt% CuO as a sintering aid to prepare a microwave dielectric.
이 때, 소결조건은 875℃∼960℃의 소결온도에서 대기중 2시간으로 하였다.At this time, sintering conditions were made into the air for 2 hours at the sintering temperature of 875 degreeC-960 degreeC.
Nd2O3의 몰비번화에 따른 BNN 마이크로파 유전체의 유전상수 변화를 살펴보면, Nd2O3의 치환량이 0.015몰에서 0.025몰까지는 유전상수값의 변화가 거의 없다가 그 이상 치환량이 증가하면 유전상수값이 감소하는 것을 알 수 있다. 그러나 소결온도에 대해서는 온도가 증가할수록 미세구조의 치밀화에 따라 BNN 마이크로파 유전체의 품질계수값(Q×fo)의 변화는 유전상수 값의 변화와 마찬가지로 Nd2O3의 치환량이 0.015몰에서 0.025몰까지는 품질계수값에 큰 차이가 없다가 그 이상 치환되면 그 값이 크게 변화하는 것을 알 수 있다.If you look at the BNN dielectric constant changes in microwave dielectric material according to the molar ratio thriving of Nd 2 O 3, Nd 2 O 3 in the degree of substitution is eseo 0.015 mole up to 0.025 mol is a change in the dielectric constant hardly substitution amount is increased more than the dielectric constant It can be seen that this decreases. However, with increasing temperature for the sintering temperature change of the quality coefficient (Q × f o) in the BNN microwave dielectric according to the densification of the microstructure, like the change in the dielectric constant replacement amount of Nd 2 O 3 yi eseo 0.015 mole 0.025 mole Until now, it can be seen that there is no significant difference in the value of the quality factor, but the value is greatly changed if it is substituted more.
그러나 소결온도변화에 따라서는 920℃에서 940℃까지는 그 값에 큰 변화가 없다가 소결온도가 950℃에 이르면 급격히 증가하여 Nd2O3의 치환량이 0.05몰일 때 최대값 (Q×fo)인 약 27725 GHz의 값을 가지고 그 이상소결온도가 증가하면 급격히 그 값이 감소하는 것을 볼 수 있는데 이는 Nd2O3의 치환에 따른 결정구조의 전이가 그 원인이다.However, according to the change of sintering temperature, there is no big change in the value from 920 ℃ to 940 ℃, but rapidly increases when the sintering temperature reaches 950 ℃, which is the maximum value (Q × f o ) when the substitution amount of Nd 2 O 3 is 0.05 mol. It has a value of about 27725 GHz and its value rapidly decreases as the sintering temperature increases, which is due to the transition of the crystal structure due to the substitution of Nd 2 O 3 .
이들 시편에 대한 유전상수, Q×fo값 및 공진주파수의 온도계수 측정결과를 표 2에 나타내었다.The dielectric constant for these samples are shown measurement results of temperature coefficient Q × f o value, and the resonance frequency in Table 2.
표에서 알 수 있는 바와 같이 Bi1-xNdxNbO4의 조성에서 0.025몰 Nd2O3의 치환시킨 다음 CuO를 소결조제로 첨가하여 920℃/2hr 까지의 조건으로 소결한 본 발명의 마이크로파 유전체 조성은 εr=40, Q×fo= 22730GHz (at 5GHz),τf= 1.8ppm/℃ 이하에서 소결이 가능하다.As can be seen from the table, the microwave dielectric of the present invention was sintered under conditions of up to 920 ° C./2hr by substituting 0.025 mol Nd 2 O 3 in the composition of Bi 1-x Nd x NbO 4 , and then adding CuO as a sintering aid. The composition can be sintered at ε r = 40, Q x f o = 22730 GHz (at 5 GHz), τ f = 1.8 ppm / ° C or less.
본 발명의 유전체 조성물은 960℃이하의 온도에서 소결이 가능하며 유전상수 및 Q×fo특성이 우수하고 공진주파수의 온도계수도 양호하며 특히 900MHz 및 1.9GHz 대역 휴대용 전화기의 적층형 대역통과 필터용 유전체 재료로서 유용하게 이용될수 있다.The dielectric composition of the present invention is capable of sintering at a temperature of 960 ° C. or less, and has excellent dielectric constant and Q × f o characteristics, good temperature coefficient of resonant frequency, and especially dielectric material for stacked bandpass filter of 900 MHz and 1.9 GHz band portable telephones. It can be usefully used as.
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