KR100244488B1 - Operating method of semiconductor depositing system - Google Patents

Operating method of semiconductor depositing system Download PDF

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KR100244488B1
KR100244488B1 KR1019970033807A KR19970033807A KR100244488B1 KR 100244488 B1 KR100244488 B1 KR 100244488B1 KR 1019970033807 A KR1019970033807 A KR 1019970033807A KR 19970033807 A KR19970033807 A KR 19970033807A KR 100244488 B1 KR100244488 B1 KR 100244488B1
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boat
shutter
wafer
semiconductor deposition
equipment
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KR1019970033807A
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Korean (ko)
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KR19990010925A (en
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김동욱
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김영환
현대반도체주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

본 발명은 반도체 증착장치의 운전방법에 관한 것으로, 종래에는 보트 다운 상태에서 프로세스를 진행해도 장치에 에러가 발생되지 않고, 질소,산소 가스를 개폐하는 밸브의 인터락(interlock) 기능이 없어 계속적으로 공정이 진행되는 문제점이 있었던바, 본 발명의 반도체 증착장비의 운전방법은 정상적인 보트-업 동작을 확인한 후 프로세스가 진행되게 하여 장비의 가동율을 향상시키고 웨이퍼를 보호하여 생산성을 향상시킬 수 있게 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of operating a semiconductor deposition apparatus. In the related art, no error occurs in the apparatus even when the process is performed in a boat down state, and there is no interlock function of a valve for opening and closing nitrogen and oxygen gas. There was a problem that the process proceeds, the operation method of the semiconductor deposition equipment of the present invention is to ensure the normal boat-up operation to proceed the process to improve the operation rate of the equipment and to protect the wafer to improve the productivity .

Description

반도체 증착장치의 운전방법Operation Method of Semiconductor Deposition Device

본 발명은 반도체 증착장치의 운전방법에 관한 것으로, 특히 웨이퍼를 탑재한 보트의 상승(boat-up) 동작을 확인한 후 프로세스 챔버 내부로 공정가스가 유입되도록 하여 장치의 가동률을 향상시키고 웨이퍼의 보호를 통해 생산성 향상을 극대화시킬 수 있는 반도체 증착장치의 운전방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of operating a semiconductor deposition apparatus. In particular, after confirming a boat-up operation of a wafer on which a wafer is mounted, process gas is introduced into the process chamber to improve the operation rate of the apparatus and to protect the wafer. It relates to a method of operating a semiconductor deposition apparatus that can maximize productivity improvement through.

일반적인 반도체 증착장치는, 도 1에 도시한 바와 같이, 장치의 메인 바디(main body) 상부측에 프로세스 챔버(1)가 설치되어 있고, 메인 바디 하부측에는 보트 (2)및 웨이퍼 트랜스퍼(미도시)가 내장되어 있다.In a typical semiconductor deposition apparatus, as shown in FIG. 1, a process chamber 1 is provided on an upper side of a main body of a device, and a boat 2 and a wafer transfer (not shown) are provided on a lower side of a main body. Is built in.

상기 프로세스 챔버(1)의 입구에는 로구셔터(shutter)(4)가 있어 대기된 상태의 챔버(1) 내부의 온도변화를 막아주는 역할을 한다.The inlet of the process chamber (1) has a shutter (shutter) (4) serves to prevent the temperature change inside the chamber (1) in the standby state.

상기 로구셔터(4)의 주위에는 이 로구셔터(4)의 오픈과 클로즈를 감지하는 센서(미도시)가 설치되어 있다.A sensor (not shown) for detecting the opening and closing of the logger shutter 4 is installed around the logger shutter 4.

첨부한 도 2는 일반적인 반도체 증착장치를 도시한 정면도로서, 종래의 반도체 증착장비는 장비의 조작을 명령하는 키와 실행여부를 디스플레이하는 모니터로 구성된 패널부(3)가 설치되어 있다.2 is a front view illustrating a general semiconductor deposition apparatus, and a conventional semiconductor deposition apparatus is provided with a panel unit 3 composed of a key for commanding the operation of the equipment and a monitor for displaying the execution status.

상기와 같이 구성된 종래의 반도체 증착장치의 동작을 설명하면 다음과 같다.Referring to the operation of the conventional semiconductor deposition apparatus configured as described above are as follows.

상기 보트(2)에 웨이퍼(미도시)를 탑재하는 동작 중 에러가 발생하면 이를 조치한 후, 웨이퍼 탑재 동작을 계속 실행하여 정상적인 탑재동작 완료시 웨이퍼를 보트(2)에 탑재시켰던 웨이퍼 트랜스퍼는 초기 위치로 돌아간다.If an error occurs during the operation of mounting a wafer (not shown) on the boat 2, the wafer transfer operation is carried out by continuing to execute the wafer mounting operation and mounting the wafer on the boat 2 when the normal mounting operation is completed. Return to position

이후 장치는 홀드(hold)되어 다음 프로세스 진행을 대기한다. 이와 같은 동작은 에러 조치후 정상적인 웨이퍼 탑재 여부를 확인하기 위해 꼭 필요한 모드이다.The device is then held and waiting for the next process to proceed. This operation is a necessary mode for checking whether the wafer is normally loaded after the error action.

웨이퍼 탑재가 완료된 후 확인자가 패널부(3)의 스킵(skip) 키를 눌러 장치의 홀드 상태를 해제시켜야만 다음 프로세스인 보트-업(boat-up) 동작이 실행된다.After wafer loading is completed, the verifier must release the hold state of the device by pressing the skip key of the panel portion 3, and the next process, the boat-up operation, is executed.

장치가 런 모드(run mode) 즉, 자동운전 상태로 동작하는 중 인터락(interlock) 또는 보수(maintenance)로 인해 홀드 상태로 전환된 경우 다시 정상운전 상태로 복귀하기 위해서는 반드시 수동으로 스킵 키를 눌러 런 모드를 실행해야 한다.If the device is switched to the hold mode due to interlock or maintenance during run mode, that is, in automatic operation mode, the skip key must be manually pressed to return to normal operation. Run mode must be executed.

그러나, 상기와 같은 종래의 반도체 증착장치는 보트(2)에 웨이퍼 적재완료 후 웨이퍼 트랜스퍼가 초기 위치로 완전히 이동하기 전에 패널부(3)의 스킵 키를 조작하면 모니터 화면상에는 다음 프로세스인 보트-업(boat-up) 로딩이 표시되어 프로세스 타임이 흘러가지만 실제 동작은 실행이 안되어 보트-다운(boat-down) 상태로 남게 되는 문제점이 있었다.However, in the conventional semiconductor deposition apparatus as described above, if the skip key of the panel 3 is operated before the wafer transfer is completely moved to the initial position after the wafer is loaded on the boat 2, the next process on the monitor screen is boat-up. (boat-up) Loading is displayed and the process time is flowing, but the actual operation is not executed, there is a problem that remains in the boat-down state.

또한, 보트-다운 상태에서 프로세스를 진행해도 장치에 에러가 발생되지 않고, 질소, 산소 가스를 개폐하는 밸브의 인터락(interlock) 기능이 없어 계속적으로 공정이 진행되는 문제점이 있었던바, 이에 대한 보완이 요구되어 왔다.In addition, there is a problem that the process does not occur even if the process proceeds in the boat-down state, and there is no interlock function of the valve that opens and closes nitrogen and oxygen gas, so that the process continues. This has been required.

따라서, 본 발명은 상기와 같은 문제점을 감안하여 안출한 것으로서, 정상적인 보트-업 동작을 확인한 후 프로세스가 진행되게 하여 장비의 가동율을 향상시키고 웨이퍼를 보호하여 생산성을 향상시킬 수 있는 반도체 증착장치의 운전방법을 제공하는데 그 목적이 있다.Therefore, the present invention has been made in view of the above problems, and after the normal boat-up operation is confirmed, the process proceeds to improve the operation rate of the equipment and the operation of the semiconductor deposition apparatus that can improve the productivity by protecting the wafer The purpose is to provide a method.

도 1은 일반적인 반도체 증착장치의 내부구성을 도시한 사시도,1 is a perspective view showing an internal configuration of a general semiconductor deposition apparatus;

도 2는 종래의 반도체 증착장비를 도시한 정면도,Figure 2 is a front view showing a conventional semiconductor deposition equipment,

도 3은 본 발명의 반도체 증착장비의 운전방법을 도시한 순서도.3 is a flowchart illustrating a method of operating a semiconductor deposition apparatus of the present invention.

(도면의 주요부분에 대한 부호의 설명)(Explanation of symbols for the main parts of the drawing)

1; 프로세스 챔버 2; 보트One; Process chamber 2; boat

4; 로구셔터4; Rogu Shutter

상기와 같은 목적을 달성하기 위하여 본 발명은 보트에 웨이퍼를 탑재하고 패널부의 키를 조작한 후, 프로세스 챔버 내부의 온도변화를 막아주는 로구셔터가 오픈되었는가를 판단하는 제1단계와; 상기 제1단계의 판단결과 로구셔터가 오픈되어 있으면 산소 가스 밸브를 오픈하고 보트-업(boat-up)을 진행한 후, 일련의 다음 과정을 수행하는 제2단계와; 상기 제1단계의 판단결과 로구셔터가 오픈되어 있지 않으면 산소 가스 밸브를 잠그고, 프로세스 진행을 홀드하며, 장비에 조치를 취하고 상기 제1단계로 궤환하는 제3단계로 이루어진 것을 특징으로 하는 반도체 증착장치의 운전방법이 제공된다.In order to achieve the above object, the present invention includes a first step of mounting a wafer in a boat and operating a key of the panel unit, and determining whether the logger shutter is opened to prevent a temperature change inside the process chamber; A second step of opening the oxygen gas valve and performing a boat-up if the rogu shutter is open as a result of the determination of the first step, and then performing a series of next steps; And the third step of closing the oxygen gas valve, holding the process, taking action on the equipment, and returning to the first step if the log shutter is not open. The operation method of is provided.

이하, 본 발명의 반도체 증착장치의 운전방법을 첨부한 도면을 참조로 하여 상세히 설명하면 다음과 같다.Hereinafter, the operation method of the semiconductor deposition apparatus of the present invention will be described in detail with reference to the accompanying drawings.

본 발명에 따른 반도체 증착장치의 장비 구성은 종래와 동일하며, 본 발명의 반도체 증착장비의 운전방법은 로구셔터(4) 주위에 설치된 센서(미도시)에 인터페이스 유니트(INTERFACE UNIT)를 설치하여, 보트(2)에 웨이퍼가 탑재 완료 후 보트-업 로딩시 상기 센서가 로구셔터(4)의 오픈을 감지하고 이 감지결과 로구셔터(4)가 오픈되어 있으면 산소 가스 밸브(미도시)를 오픈하여 산소 가스가 프로세스 챔버(1) 내부로 유입되면서 보트-업(boat-up)을 진행한다.The equipment configuration of the semiconductor deposition apparatus according to the present invention is the same as the conventional, the operation method of the semiconductor deposition apparatus of the present invention by installing an interface unit (INTERFACE UNIT) in the sensor (not shown) installed around the rogu shutter (4), After the wafer is mounted on the boat 2, the sensor detects the opening of the logger shutter 4 during boat-up loading. When the logger shutter 4 is open as a result of the detection, an oxygen gas valve (not shown) is opened. Oxygen gas enters the process chamber 1 and proceeds boat-up.

상기 센서의 감지결과 로구셔터(4)가 오픈되어 있지 않으면 밸브 인터락(VALVE INTERLOCK) 처리를 하여 산소 가스 밸브를 잠그고, 부져(BUZZER)를 울려 프로세스 진행을 홀드하며, 장비에 조치를 취한다.As a result of the detection of the sensor, if the lock shutter 4 is not opened, the valve is closed to the oxygen gas valve, the buzzer is held to hold the process, and the equipment is actuated.

이때, 질소 가스 밸브는 로구셔터(4)의 오픈/클로즈에 관계없이 작동된다.At this time, the nitrogen gas valve is operated regardless of the open / close of the shutter shutter 4.

본 발명의 반도체 증착장치의 운전방법에 의하면 정상적인 보트-업 동작을 확인한 후 프로세스가 진행되게 하여 웨이퍼의 손실을 방지할 수 있는 효과가 있다.According to the method of operating the semiconductor deposition apparatus of the present invention, after confirming the normal boat-up operation, the process is performed to prevent the loss of the wafer.

또한, 장비의 에러발생을 사전에 감지하여 장비의 가동율을 향상시키고 웨이퍼를 보호하여 생산성을 향상시킬 수 있는 효과가 있다.In addition, there is an effect that can detect the occurrence of the error in advance of the equipment to improve the operation rate of the equipment and to improve the productivity by protecting the wafer.

Claims (1)

보트에 웨이퍼를 탑재하고 패널부의 키를 조작한 후, 프로세스 챔버 내부의 온도변화를 막아주는 로구셔터가 오픈되었는가를 판단하는 제1단계와;Mounting the wafer on the boat and manipulating the keys of the panel unit, and determining whether a logger shutter is opened to prevent a temperature change inside the process chamber; 상기 제1단계의 판단결과 로구셔터가 오픈되어 있으면 산소 가스 밸브를 오픈하고 보트-업(boat-up)을 진행한 후, 일련의 다음 과정을 수행하는 제2단계와;A second step of opening the oxygen gas valve and performing a boat-up if the rogu shutter is open as a result of the determination of the first step, and then performing a series of next steps; 상기 제1단계의 판단결과 로구셔터가 오픈되어 있지 않으면 산소 가스 밸브를 잠그고, 프로세스 진행을 홀드하며, 장비에 조치를 취하고 상기 제1단계로 궤환하는 제3단계로 이루어진 것을 특징으로 하는 반도체 증착장치의 운전방법.And the third step of closing the oxygen gas valve, holding the process, taking action on the equipment, and returning to the first step if the log shutter is not open. How to operate.
KR1019970033807A 1997-07-19 1997-07-19 Operating method of semiconductor depositing system KR100244488B1 (en)

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