JP2002025918A - Semiconductor manufacturing device - Google Patents

Semiconductor manufacturing device

Info

Publication number
JP2002025918A
JP2002025918A JP2000211224A JP2000211224A JP2002025918A JP 2002025918 A JP2002025918 A JP 2002025918A JP 2000211224 A JP2000211224 A JP 2000211224A JP 2000211224 A JP2000211224 A JP 2000211224A JP 2002025918 A JP2002025918 A JP 2002025918A
Authority
JP
Japan
Prior art keywords
gas
state
electromagnetic valve
section
communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000211224A
Other languages
Japanese (ja)
Other versions
JP4794031B2 (en
Inventor
Masato Shirakawa
真人 白川
Masanori Okuno
正則 奥野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Kokusai Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2000211224A priority Critical patent/JP4794031B2/en
Publication of JP2002025918A publication Critical patent/JP2002025918A/en
Application granted granted Critical
Publication of JP4794031B2 publication Critical patent/JP4794031B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve safety of operation in maintenance operation, etc., by enabling the filling state of gas in a gas piping to be displayed in a semiconductor manufacturing device. SOLUTION: The device is provided with gas state detection means 15, 30, 31, which detect the state of gas in a piping based on the opening and closing state of an opening/closing valve provided to a gas piping and the state of gas in a gas piping detected in the previous detection; and a display means 12 for displaying the state of gas in a gas piping in a display means.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は半導体製造装置、特
にガス配管中のガスの状態を表示する機能を具備する半
導体製造装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus having a function of displaying a gas state in a gas pipe.

【0002】[0002]

【従来の技術】半導体製造装置は、気密なプロセスチャ
ンバを具備し、該プロセスチャンバに各種ガスを供給し
てウェーハに薄膜を生成し、或はエッチングガスを供給
して薄膜をエッチングし、パターンの生成を行う等して
半導体装置を製造するものである。
2. Description of the Related Art A semiconductor manufacturing apparatus is provided with an airtight process chamber. Various gases are supplied to the process chamber to form a thin film on a wafer, or an etching gas is supplied to etch the thin film to form a pattern. A semiconductor device is manufactured by performing generation or the like.

【0003】従って、半導体製造装置には図5に示され
る様に、プロセスチャンバ1に対して複数系統のガス供
給ライン2…2n 、及び排気系3が接続され、各ガス供
給ライン2はガス供給配管10を有し、該ガス供給配管
10には上流側から圧力計4、ガス供給用電磁バルブ
5、流量制御器6、インタロック用電磁バルブ7が設け
られ、前記排気系3には真空ポンプ8が設けられてい
る。
Accordingly, as shown in FIG. 5, a plurality of gas supply lines 2... 2n and an exhaust system 3 are connected to a process chamber 1 in the semiconductor manufacturing apparatus. The gas supply pipe 10 is provided with a pressure gauge 4, a gas supply solenoid valve 5, a flow controller 6, and an interlock solenoid valve 7 from the upstream side, and the exhaust system 3 has a vacuum pump. 8 are provided.

【0004】又、前記半導体製造装置は前記ガス供給ラ
イン2、排気系3のガス給排作動を制御する制御装置1
1、プロセスチャンバ1でのウェーハの処理状態、或は
前記ガス供給ライン2、排気系3のガス給排状態を示す
表示装置12を具備している。
The semiconductor manufacturing apparatus includes a control device 1 for controlling the gas supply / discharge operation of the gas supply line 2 and the exhaust system 3.
1. A display device 12 is provided for indicating a wafer processing state in the process chamber 1 or a gas supply / discharge state of the gas supply line 2 and the exhaust system 3.

【0005】図6は制御系統を示すブロック図であり、
前記制御装置11には前記ガス供給用電磁バルブ5、イ
ンタロック用電磁バルブ7、真空ポンプ8、圧力スイッ
チ9等デジタル機器がデジタル入出力用ポート13を介
して接続され、又前記圧力計4、流量制御器6等のアナ
ログ機器がアナログ入出力用ポート14を介して接続さ
れている。又、前記制御装置11には前記圧力計4、流
量制御器6からの信号に基づき前記ガス供給用電磁バル
ブ5、インタロック用電磁バルブ7、真空ポンプ8、圧
力スイッチ9を制御する為の制御プログラム16、CP
U15を具備している。
FIG. 6 is a block diagram showing a control system.
Digital devices such as the gas supply electromagnetic valve 5, the interlocking electromagnetic valve 7, the vacuum pump 8, and the pressure switch 9 are connected to the control device 11 via a digital input / output port 13. Analog devices such as a flow controller 6 are connected via an analog input / output port 14. The control device 11 controls the gas supply electromagnetic valve 5, the interlock electromagnetic valve 7, the vacuum pump 8, and the pressure switch 9 based on signals from the pressure gauge 4 and the flow controller 6. Program 16, CP
U15 is provided.

【0006】又、前記制御装置11から前記表示装置1
2に対して、ウェーハ処理の状態、前記圧力計4、流量
制御器6の検出状態、前記ガス供給用電磁バルブ5、イ
ンタロック用電磁バルブ7、真空ポンプ8、圧力スイッ
チ9の作動状態に関する情報が送出される。
Further, the control device 11 sends the display device 1
2, information on the wafer processing state, the detection state of the pressure gauge 4 and the flow controller 6, and the operation states of the gas supply electromagnetic valve 5, the interlock electromagnetic valve 7, the vacuum pump 8 and the pressure switch 9. Is sent.

【0007】前記表示装置12はデータ送受信プログラ
ム17、表示プログラム18、CPU19を具備し、該
CPU19は前記データ送受信プログラム17に従って
表示装置12と前記制御装置11との信号の送受信を制
御し、又制御装置11から送出された情報を前記表示プ
ログラム18を介してディスプレイ20に表示する。
The display device 12 includes a data transmission / reception program 17, a display program 18, and a CPU 19. The CPU 19 controls transmission and reception of signals between the display device 12 and the control device 11 according to the data transmission / reception program 17. The information sent from the device 11 is displayed on the display 20 via the display program 18.

【0008】ウェーハの処理を行う場合は、前記排気系
3により前記プロセスチャンバ1を真空排気し、前記ガ
ス供給ライン2…2n の1つにより、ウェーハの処理に
適応する反応ガスを供給しつつ、前記プロセスチャンバ
1が所定圧力に維持される様、前記排気系3により排気
を行う。
When processing a wafer, the process chamber 1 is evacuated by the exhaust system 3 and a reaction gas adapted to the processing of the wafer is supplied through one of the gas supply lines 2. Evacuation is performed by the exhaust system 3 so that the process chamber 1 is maintained at a predetermined pressure.

【0009】ウェーハの処理完了後、ウェーハを払出し
する場合は、前記排気系3によりプロセスチャンバ1を
真空引きし、前記ガス供給ライン2…2n の1つによ
り、パージガスを供給して前記プロセスチャンバ1内を
ガスパージする。
In order to discharge the wafer after the wafer processing is completed, the process chamber 1 is evacuated by the exhaust system 3 and a purge gas is supplied through one of the gas supply lines 2. The inside is gas purged.

【0010】前記プロセスチャンバ1には複数のガス供
給ライン2…2n が接続され、処理内容に応じて前記ガ
ス供給用電磁バルブ5、インタロック用電磁バルブ7の
開閉が前記制御装置11により制御され、ガスの給排が
行われる。
A plurality of gas supply lines 2... 2 n are connected to the process chamber 1, and the opening and closing of the gas supply electromagnetic valve 5 and the interlock electromagnetic valve 7 are controlled by the control device 11 according to the processing contents. The supply and discharge of gas are performed.

【0011】又、前記表示装置12にはガスの給排状態
を示す為のガスモニタ表示部があり、各ガス供給ライン
2…2n のバルブの開閉状態が示され、どのガス配管か
らのガスが供給されているかが分る様になっている。
The display device 12 has a gas monitor display section for indicating the gas supply / discharge state, and indicates the open / closed state of the valves of the gas supply lines 2... 2n. You can see if it is done.

【0012】[0012]

【発明が解決しようとする課題】上記した様に、従来の
半導体製造装置では各ガス供給ライン2…2n の電磁バ
ルブの開閉状態が前記ガスモニタ表示部に表示され、電
磁バルブの開閉状態から各ガス供給ライン2…2n のガ
スの供給状態を知る様になっている。
As described above, in the conventional semiconductor manufacturing apparatus, the open / closed state of the electromagnetic valves of each of the gas supply lines 2... 2n is displayed on the gas monitor display section. The supply state of the gas in the supply lines 2... 2n is known.

【0013】然し乍ら、図7、図8に示す様に、ガス配
管23に開閉バルブ、例えば電磁バルブ24,25,2
6,27が上流側より順次設けられ、ガスが供給されて
いる状態で、図7の様に上流側の電磁バルブ24が閉じ
られ、次に下流側の電磁バルブ26が閉じられた場合
は、前記ガス配管23にガス溜りが生じることはない
が、図8の様に、下流側の電磁バルブ26が閉じられ、
次に上流側の電磁バルブ24が閉じられた場合には、該
電磁バルブ24と前記電磁バルブ26間にガス溜りが生
じてしまう。
However, as shown in FIGS. 7 and 8, an on-off valve, for example, an electromagnetic valve 24, 25, 2 is connected to the gas pipe 23.
If the upstream electromagnetic valve 24 is closed and then the downstream electromagnetic valve 26 is closed as shown in FIG. Although no gas accumulation occurs in the gas pipe 23, the electromagnetic valve 26 on the downstream side is closed as shown in FIG.
Next, when the electromagnetic valve 24 on the upstream side is closed, gas accumulation occurs between the electromagnetic valve 24 and the electromagnetic valve 26.

【0014】図7、図8で示した様に、電磁バルブの開
閉順序によりガス溜りが生じたり、生じなかったりす
る。従って、図5で示した電磁バルブの開閉状態が表示
されるだけでは、非供給状態のガス供給ライン2のガス
供給配管10のガス充満状態までは知ることができなか
った。
As shown in FIGS. 7 and 8, gas accumulation may or may not occur depending on the opening and closing sequence of the electromagnetic valve. Therefore, it was not possible to know the gas filled state of the gas supply pipe 10 of the gas supply line 2 in the non-supplied state only by displaying the open / closed state of the electromagnetic valve shown in FIG.

【0015】半導体装置の製造に使用されるガスは、有
害ガス、可燃ガスが使用される場合が多く、又ガス配管
は定期的、或は所定稼働時間毎に、メンテナンスする必
要があるが、不用意にガス配管を取外す等すると危険で
あり、メンテナンス時にガス配管にガスが充満している
かどうかを作業者が知っておく必要がある。
In many cases, harmful gases and flammable gases are used as gases used in the manufacture of semiconductor devices, and gas pipes need to be maintained periodically or every predetermined operating time. It is dangerous to easily remove the gas pipe, and it is necessary for the operator to know whether the gas pipe is full of gas during maintenance.

【0016】本発明は斯かる実情に鑑み、ガス配管中の
ガスの充満状態、ガス溜りの状態等配管中のガスの状態
を表示可能とし、メンテナンス作業等に於ける作業の安
全性を向上するものである。
In view of such circumstances, the present invention makes it possible to display the state of gas in a pipe such as the state of gas filling and the state of a gas reservoir in a gas pipe, thereby improving the safety of work in maintenance work and the like. Things.

【0017】[0017]

【課題を解決するための手段】本発明は、ガス配管に設
けられた開閉バルブの開閉状態と、前回検知されたガス
配管中のガスの状態とに基づき配管のガスの状態を検知
するガス状態検知手段と、表示手段とを有し、前記ガス
状態検知手段により検知されたガス配管中のガスの状態
を前記表示手段に表示する様にした半導体製造装置に係
るものである。
According to the present invention, there is provided a gas condition for detecting a gas condition of a gas pipe based on an open / close state of an open / close valve provided in the gas pipe and a gas state in the gas pipe detected last time. The present invention relates to a semiconductor manufacturing apparatus having a detection means and a display means, wherein a state of gas in a gas pipe detected by the gas state detection means is displayed on the display means.

【0018】[0018]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態を説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0019】本発明は、ガス配管にガスが充填された状
態を検出し、検出結果を表示装置に示すものであり、図
1により第1の実施の形態について説明する。
In the present invention, a state in which gas is filled in a gas pipe is detected, and a detection result is shown on a display device. A first embodiment will be described with reference to FIG.

【0020】図1は第1の実施の形態の要部を示す制御
ブロック図であり、図1中、図6で示したものと同一の
ものには同符号を付し、その説明を省略する。
FIG. 1 is a control block diagram showing a main part of the first embodiment. In FIG. 1, the same components as those shown in FIG. 6 are denoted by the same reference numerals, and the description thereof will be omitted. .

【0021】制御プログラム16は判断プログラム30
を具備し、又CPU15には記憶部31が設けられてい
る。
The control program 16 includes a judgment program 30
The storage unit 31 is provided in the CPU 15.

【0022】前記判断プログラム30は、各ガス供給ラ
イン2に設けられた電磁バルブの開閉状態をガス供給元
からチェックし、又、プロセスチャンバ1側からチェッ
クし、その結果を前記記憶部31に記憶させる一連のチ
ェック手順がプログラムされていると共に前記記憶部3
1に記憶された前回の電磁バルブ開閉状態のチェック結
果と、該チェックの結果に基づき判断された配管のガス
の充満状態、ガス溜りの状態等配管中のガスの状態と、
今回のチェック結果とを比較させ、現在の配管中のガス
の状態を判断する判断プログラムを有している。又、前
記記憶部31は配管中のガスの状態の判断結果及びデジ
タル入出力用ポート13から入力される前記ガス供給用
電磁バルブ5、インタロック用電磁バルブ7の開閉デー
タを各ライン毎に又、時系列に記憶するものである。
The determination program 30 checks the open / closed state of the electromagnetic valves provided in each gas supply line 2 from the gas supply source and checks from the process chamber 1 side, and stores the result in the storage unit 31. A series of check procedures to be performed are programmed and the storage unit 3
The result of the previous check of the electromagnetic valve opening / closing state stored in 1 and the state of gas in the pipe such as the state of gas filling and the state of a gas reservoir determined based on the result of the check;
It has a judgment program that compares the current check result with the current check result to judge the current state of gas in the piping. The storage unit 31 stores the judgment result of the state of gas in the pipe and the opening / closing data of the gas supply electromagnetic valve 5 and the interlock electromagnetic valve 7 input from the digital input / output port 13 for each line. , Stored in chronological order.

【0023】而して、前記判断プログラム30、前記記
憶部31、CPU15はガス状態検知手段を構成する。
Thus, the judgment program 30, the storage section 31, and the CPU 15 constitute a gas state detecting means.

【0024】図2を参照して作用について説明する。The operation will be described with reference to FIG.

【0025】ウェーハ処理のプロセスが完了したこと
で、或は何れかのラインの電磁バルブが開閉され、電磁
バルブの状態に変化があった度に、前記判断プログラム
30が起動され、ガスモニタ表示部に電磁バルブの開閉
状態、ガス配管中のガスの充満状態を表示するガスモニ
タ表示部表示処理が開始される。
When the process of wafer processing is completed, or when the solenoid valve of any line is opened and closed, and the state of the solenoid valve changes, the judgment program 30 is started, and the gas monitor display section is displayed. A gas monitor display section display process for displaying the open / close state of the electromagnetic valve and the state of gas filling in the gas pipe is started.

【0026】STEP1:前記記憶部31に記憶された
全ての電磁バルブの開閉データより、各ガス配管毎に全
ての電磁バルブについてガス供給元から順番に開閉状態
をチェックする。
STEP 1: Based on the opening / closing data of all the electromagnetic valves stored in the storage section 31, the opening / closing state of all the electromagnetic valves for each gas pipe is checked in order from the gas supply source.

【0027】STEP2:同様に、前記記憶部31に記
憶された全ての電磁バルブの開閉データより、各ガス配
管毎に全ての電磁バルブについてプロセスチャンバ1側
から順番に開閉状態をチェックする。
STEP 2: Similarly, the open / closed state of all the electromagnetic valves is sequentially checked from the process chamber 1 side for each gas pipe based on the open / close data of all the electromagnetic valves stored in the storage unit 31.

【0028】STEP3:上記STEP1、STEP2
でのチェック結果を基に各ガス配管毎に、又ガス配管の
電磁バルブで仕切られる全ての区分について、区分とガ
ス供給元、プロセスチャンバ1との連通状態をチェック
する。
STEP3: STEP1 and STEP2 above
Based on the result of the check in step (1), the communication state between the division, the gas supply source, and the process chamber 1 is checked for each gas pipe and all divisions partitioned by the electromagnetic valve of the gas pipe.

【0029】先ず、STEP1の電磁バルブのチェック
により、上流側の区分から順番に、各区分がガス供給元
に連通しているかどうかが判断される。即ち、判断の対
象となる区分についてガスが供給されているかどうかが
判断される。判断の方法としては、種々考えられるが、
例えば以下の如く行う。
First, by checking the electromagnetic valve in STEP 1, it is determined whether or not each section communicates with the gas supply source in order from the upstream section. That is, it is determined whether or not gas is supplied for the section to be determined. There are various ways to determine this,
For example, the following is performed.

【0030】判断対象区分に属する上流側の電磁バルブ
の開閉状態と、判断対象区分に隣接する上流区分の連通
状態の2つの情報により、判断対象区分の連通状態を判
断する。
The communication state of the determination target section is determined based on two pieces of information, that is, the open / close state of the upstream electromagnetic valve belonging to the determination target section and the communication state of the upstream section adjacent to the determination target section.

【0031】図3を参照して説明すると、区分bについ
ての判断は、区分aの状態と、電磁バルブ24の開閉の
状態により判断される。区分aは常時ガス供給元に連通
されているので、区分bの連通状態は電磁バルブ24の
開閉により決定される。区分bの連通状態の判断が確定
した後、区分cの判断が行われる。
Referring to FIG. 3, the judgment on the section b is made based on the state of the section a and the open / closed state of the electromagnetic valve 24. Since the section a is always in communication with the gas supply source, the communication state of the section b is determined by the opening and closing of the electromagnetic valve 24. After the determination of the communication state of the section b is determined, the determination of the section c is performed.

【0032】区分cについては、区分bの連通状態と電
磁バルブ25の開閉状態により決定される。即ち、区分
bの連通状態の判断が、ガス供給元と連通していると確
定していれば、電磁バルブ25の開状態で、区分cはガ
ス供給元と連通、電磁バルブ25の閉状態で、区分cは
非連通と判断され、区分bの連通状態の判断が、ガス供
給元と非連通であると確定していれば、区分cは電磁バ
ルブ25の開状態、閉状態のいずれの状態も非連通と判
断される。
The section c is determined by the communication state of the section b and the open / close state of the electromagnetic valve 25. That is, if it is determined that the communication state of the section b is in communication with the gas supply source, the electromagnetic valve 25 is in the open state, and the section c is in communication with the gas supply source and the electromagnetic valve 25 is in the closed state. , The section c is determined to be non-communication, and if the determination of the communication state of the section b is determined to be non-communication with the gas supply source, the section c will be in either the open state or the closed state of the electromagnetic valve 25. Is also determined to be non-communication.

【0033】而して、上流側から下流側に向って順次判
断を行うことで、区分e迄の連通状態が全て判断され
る。
Thus, by sequentially performing determinations from the upstream side to the downstream side, all communication states up to the section e are determined.

【0034】上記の如く、連通状態を判断する方法であ
ると、判断する情報は2つでよく、離れたバルブの開閉
状態をチェックする必要がない。又、上流側、下流側の
バルブの配置等が、判断に影響されなく、バルブの追
加、削除、或はガスラインのレイアウトに変更があった
場合等の構成上の変化があった場合に対応が容易とな
る。
As described above, in the method of determining the communication state, only two pieces of information need be determined, and it is not necessary to check the open / closed state of a remote valve. In addition, the arrangement of upstream and downstream valves is not affected by the judgment, and corresponds to the case where there is a structural change such as addition or deletion of a valve or a change in the layout of a gas line. Becomes easier.

【0035】次に、STEP2の電磁バルブのチェック
により、下流側の区分から順番に、各区分がプロセスチ
ャンバ1に連通しているかどうかが判断される。
Next, by checking the electromagnetic valve in STEP 2, it is determined whether or not each section is in communication with the process chamber 1 in order from the downstream section.

【0036】判断対象区分がプロセスチャンバ1に連通
しているかどうかの判断は、STEP1で判断対象区分
が、前述した供給元に連通しているかどうかの判断と同
様の方法によって行われる。即ち、判断対象区分に属す
る下流側の電磁バルブの開閉状態と、判断対象区分に隣
接する下流側の区分のプロセスチャンバ1に対する連通
状態との2つの情報により判断される。
The determination as to whether or not the determination target section is in communication with the process chamber 1 is performed in the same manner as in the determination as to whether the determination target section is in communication with the above-described supply source in STEP1. That is, the determination is made based on two pieces of information: the open / closed state of the downstream electromagnetic valve belonging to the determination target section and the communication state of the downstream section adjacent to the determination target section with the process chamber 1.

【0037】例えば、電磁バルブ27が開で区分dの連
通状態の判断が、プロセスチャンバ1と連通と確定して
いれば、区分cの判断は、電磁バルブ26が開で区分d
に連通することで、区分cはプロセスチャンバ1と連通
と判断され、前記電磁バルブ26が閉で非連通と判断さ
れる。而して、下流側の区分の確定した判断に基づき上
流側の区分についても判断し、区分dから区分a迄順
次、プロセスチャンバ1と連通しているかどうかが判断
される。
For example, if the electromagnetic valve 27 is open and the communication state of the section d is determined to be in communication with the process chamber 1, the determination of the section c is made when the electromagnetic valve 26 is open and the section d
, The section c is determined to be in communication with the process chamber 1, and the electromagnetic valve 26 is determined to be closed and not in communication. Thus, the upstream section is also determined based on the determined determination of the downstream section, and it is determined whether or not the sections d to a are sequentially communicated with the process chamber 1.

【0038】STEP4:次に、ガス充満状態の判断
が、全ての区分について行われる。
STEP 4: Next, the judgment of the gas full state is made for all the sections.

【0039】STEP1、STEP2、STEP3の電
磁バルブのチェックによる判断対象区分のガス供給元、
プロセスチャンバ1への連通状態と前記記憶部31に記
憶された電磁バルブの開閉状態に変化がある前の状態と
に基づき判断対象区分のガスの充満、ガス溜り状態が判
断される。
The gas supply sources of the target categories determined by checking the electromagnetic valves in STEP1, STEP2, and STEP3,
Based on the state of communication with the process chamber 1 and the state of the solenoid valve stored in the storage unit 31 before the open / close state of the electromagnetic valve changes, the gas filling state and the gas pool state of the determination target section are determined.

【0040】即ち、判断対象区分についてガス供給元に
対する前記連通判断に基づき、判断対象区分にガスが供
給されているかどうかが判断され、連通している場合は
ガスが供給されていることであり、ガスが供給されてい
る場合は充満の判断がされる。
That is, it is determined whether or not gas is supplied to the determination target section based on the communication determination with respect to the gas supply source for the determination target section, and if the communication is performed, the gas is supplied. If gas is being supplied, it is determined that the gas is full.

【0041】判断対象区分にガスが供給されていない場
合、即ち判断対象区分がガス供給元と非連通と判断され
た場合は、前記記憶部31に記憶された前回の状態と比
較され、判断対象区分の前回の状態が空であった場合
は、判断対象区分は空と判断される。
If gas is not supplied to the judgment target section, that is, if it is determined that the judgment target section is not in communication with the gas supply source, the judgment is made to compare with the previous state stored in the storage unit 31 and If the previous state of the section is empty, the determination target section is determined to be empty.

【0042】判断対象区分にガスが供給されていなく、
前回の状態チェックで充満と判断されていた場合、更
に、判断対象区分がプロセスチャンバ1に通じているか
どうかが、前記STEP3の連通状態の判断に基づきな
され、判断対象区分がプロセスチャンバ1に通じていな
い場合は、判断対象区分はガスを充満したままの閉塞状
態であり、ガス溜りと判断される。
If no gas is supplied to the judgment target section,
If it is determined in the previous state check that the state is full, it is further determined whether or not the determination target section communicates with the process chamber 1 based on the determination of the communication state in STEP 3 described above. When there is no gas, the determination target section is in a closed state in which the gas is filled, and it is determined that the gas pool is present.

【0043】ガス配管にガスが供給されていなく、前回
の状態チェックで充満と判断され、更に、判断対象区分
が前記連通判断でプロセスチャンバ1に通じている場
合、判断対象区分は空と判断される。
If the gas is not supplied to the gas pipe, it is determined that the gas is full in the previous state check, and if the determination target is connected to the process chamber 1 in the communication determination, the determination target is determined to be empty. You.

【0044】全ての配管について、全ての区分ついての
ガスの状態が判断される。
For all pipes, the state of the gas in all sections is determined.

【0045】STEP5:各ラインの各判断対象区分に
ついてのガス充満判断の結果は、制御プログラム16を
介して前記表示装置12に送出され、前記データ送受信
プログラム17、表示プログラム18に従って、前記デ
ィスプレイ20に表示される。
STEP 5: The result of the gas filling judgment for each judgment target section of each line is sent to the display device 12 via the control program 16 and is sent to the display 20 according to the data transmission / reception program 17 and the display program 18. Is displayed.

【0046】尚、上記実施の形態で、電磁バルブの開閉
データは現状のデータも含み全て前記記憶部31に記憶
させたが、現状のデータについては前記デジタル入出力
用ポート13を介し各電磁バルブから直接収集する様に
してもよい。
In the above-described embodiment, the opening / closing data of the electromagnetic valves, including the current data, are all stored in the storage unit 31, but the current data is stored in each of the electromagnetic valves via the digital input / output port 13. It may be collected directly from.

【0047】各判断対象区分のガスの存在の有無につい
ては、空、ガスの供給がある場合(ガス供給源と連通し
ている場合)は充満、ガスの供給がなく封入されている
状態はガス溜りの3通で表示される。
The presence / absence of gas in each of the judgment target categories is determined as empty if there is a gas supply (if it is in communication with a gas supply source), and filled if there is no gas supply. It is displayed in three letters.

【0048】図3(A)、(B)、(C)により前記デ
ィスプレイ20の表示例を説明する。
A display example of the display 20 will be described with reference to FIGS. 3 (A), 3 (B) and 3 (C).

【0049】図3はガス配管23に電磁バルブ24,2
5,26,27が設けられ、これら電磁バルブにより前
記ガス配管23が区分a,b,c,d,eに区分けされ
た状態を示しており、前記各電磁バルブ24,25,2
6,27は開いている状態が緑色、閉じている状態が白
色等で色分け表示され、又前記各区分a,b,c,d,
eについて、空の状態は白色、充満の状態は橙色、ガス
溜りの状態は赤等に色分け表示される。
FIG. 3 shows that the electromagnetic valves 24 and 2 are connected to the gas pipe 23.
5, 26, 27 are provided, and the gas pipe 23 is divided into sections a, b, c, d, and e by these electromagnetic valves, and the electromagnetic valves 24, 25, and 2 are shown.
6 and 27, the open state is displayed in green and the closed state is displayed in white and the like, and each of the sections a, b, c, d, and
As for e, the empty state is displayed in white, the filled state is displayed in orange, and the state of the gas reservoir is displayed in red.

【0050】図3(A)は電磁バルブ26が閉、残りの
電磁バルブ24,25,27が開の状態を示している。
この状態では、区分a,b,cがガス充満状態で、区分
d,eが空の状態である。図3(B)は、図3(A)の
状態から電磁バルブ24が閉と状態が変更した場合であ
り、前記電磁バルブ24と電磁バルブ26との間の区分
b,cにガスが封入される。この状態で、区分b,cが
ガス溜りと表示される。又図3(C)は、図3(B)の
状態から前記電磁バルブ25が閉、電磁バルブ26が開
と状態が変更した場合であり、前記電磁バルブ24と電
磁バルブ25との間の区分bはガス溜りのまま、区分c
が空の状態に変更となる。
FIG. 3A shows a state where the electromagnetic valve 26 is closed and the remaining electromagnetic valves 24, 25 and 27 are open.
In this state, the sections a, b, and c are gas-filled, and the sections d and e are empty. FIG. 3B shows a case where the state of the electromagnetic valve 24 is changed from the state of FIG. 3A to the closed state, and gas is sealed in the sections b and c between the electromagnetic valve 24 and the electromagnetic valve 26. You. In this state, the sections b and c are displayed as gas pools. FIG. 3C shows a case where the electromagnetic valve 25 is closed and the electromagnetic valve 26 is opened from the state shown in FIG. 3B, and the state between the electromagnetic valve 24 and the electromagnetic valve 25 is changed. b is a gas reservoir, category c
Is changed to an empty state.

【0051】尚、上記した判断の対象となる区分につい
て、ガス供給元、プロセスチャンバとの連通状態の判断
は、一例であり、判断の方法としては種々考えられ、他
の方法としては、例えば以下の如く行う。
It should be noted that the determination of the state of communication with the gas supply source and the process chamber is only an example for the above-described determination target categories, and various determination methods are conceivable. Perform as follows.

【0052】判断対象区分のガス供給元との連通状態の
判断は、上流側から順番に電磁バルブの開閉状態のチェ
ックを行い、閉状態の電磁バルブを検出した時点で、非
連通と判断し、全て開状態の時に連通と判断する。又、
プロセスチャンバとの連通状態の判断についても、下流
側から順番に電磁バルブの開閉状態のチェックを行い、
閉状態の電磁バルブを検出した時点で、非連通と判断
し、全ての電磁バルブが開状態である場合に連通と判断
する。
In order to determine the communication state with the gas supply source of the determination target section, the open / close state of the electromagnetic valve is checked in order from the upstream side, and when the closed electromagnetic valve is detected, it is determined that there is no communication. It is determined that the communication is established when all of them are in the open state. or,
Regarding the determination of the communication state with the process chamber, the open / close state of the electromagnetic valve is checked sequentially from the downstream side,
When a closed electromagnetic valve is detected, it is determined that communication is not established, and when all electromagnetic valves are open, communication is determined.

【0053】更に他の例として、全ての電磁バルブの開
閉状態は、前記記憶部31に記憶されているので、所定
の判断対象区分のガス供給元、プロセスチャンバとの連
通状態を、記憶されているデータから直ちに判断するこ
とも可能である。即ち、判断対象区分の上流側に位置す
る電磁バルブが、全て開か、そうでないかの判断でガス
供給元との連通状態を判断し、又判断対象区分の下流側
に位置する電磁バルブが、全て開か、そうでないかの判
断でプロセスチャンバとの連通状態を判断する。この場
合、チェックする電磁バルブの順序、判断対象区分の順
序は問題とならず、任意の位置の区分について直ちに連
通、非連通の判断が行える。
As yet another example, since the open / close states of all the electromagnetic valves are stored in the storage section 31, the communication state with the gas supply source and the process chamber of the predetermined judgment target section is stored. It is also possible to make an immediate judgment from the existing data. That is, all the electromagnetic valves located on the upstream side of the determination target section are opened, and the communication state with the gas supply source is determined by determining whether or not it is not. The state of communication with the process chamber is determined by determining whether it is open or not. In this case, the order of the electromagnetic valves to be checked and the order of the sections to be determined do not matter, and it is possible to immediately determine the communication or non-communication at an arbitrary position.

【0054】更に、上記実施の形態では、判断対象区分
のガス供給元への連通状態、プロセスチャンバへの連通
状態、更に前回の判断対象区分のガスの状態の3つの判
断要素により、現在の判断対象区分のガスの状態を判断
したが、電磁バルブの開閉の経時的変化を基に判断対象
区分のガスの状態を判断することも勿論可能である。
Further, in the above-described embodiment, the current judgment is made by three judgment factors of the communication state of the judgment target section with the gas supply source, the communication state with the process chamber, and the gas state of the previous judgment target section. Although the state of the gas in the target section has been determined, it is of course possible to determine the state of the gas in the target section based on the change over time of the opening and closing of the electromagnetic valve.

【0055】電磁バルブの開閉の経時的変化を基に判断
対象区分のガスの状態を判断する方法もある。ガス溜り
が生じる原因は、電磁バルブの開閉の順序に原因があ
る。従って、電磁バルブがどういう順序で開閉された場
合にガス溜りが生じるかのガス溜り発生データを予め判
断材料として作成し、電磁バルブの開閉のデータを経時
的に記録し、ガス溜り発生データと電磁バルブの開閉の
経時的データを比較することでも、現在の配管のガスの
状態を判断できる
There is also a method of judging the state of gas in the judgment target section based on the change over time of the opening and closing of the electromagnetic valve. The cause of the gas accumulation is caused by the opening and closing sequence of the electromagnetic valve. Therefore, gas pool generation data indicating in what order the solenoid valve is opened and closed to generate gas pools is created as a judgment material in advance, and the opening and closing data of the electromagnetic valve is recorded over time, and the gas pool generation data and the electromagnetic By comparing the time-lapse data of valve opening and closing, it is also possible to judge the current gas state of piping

【0056】図4は第2の実施の形態を示している。上
記第1の実施の形態では、バルブの開閉状態を監視し、
バルブの開閉状態、開閉に伴う前回の状態のデータから
ガス配管の各区分のガス充満状態を検知したが、第2の
実施の形態では、各区分毎にガスの有無を直接検出する
ガスセンサ33,34,35を設けたものである。
FIG. 4 shows a second embodiment. In the first embodiment, the open / close state of the valve is monitored,
Although the gas filling state of each section of the gas pipe is detected from the data of the open / close state of the valve and the previous state accompanying the open / close, in the second embodiment, the gas sensor 33, which directly detects the presence or absence of gas for each section, 34 and 35 are provided.

【0057】該ガスセンサ33,34,35からの信号
に基づき、図3で示したガスの充満状態についての表示
を行う。
Based on the signals from the gas sensors 33, 34 and 35, the display of the gas filling state shown in FIG. 3 is performed.

【0058】[0058]

【発明の効果】以上述べた如く本発明によれば、ガス配
管の現状のガス充満状態を表示するので、ガス配管のメ
ンテナンス時、或は混合により危険な化学反応を起すガ
スを流す場合等、作業者に情報の提供ができ、安全性が
向上する。又、空のガス配管と、ガス溜りのあるガス配
管とが明確に判断できるので、ガス溜りの排気作業は全
てのガス配管に対して行う必要がなく、作業は必要最小
限となり、作業性が向上する。更に、ガス配管のガス状
態検知手段が、ガス配管に設けられた開閉バルブの開閉
状態を監視し、開閉状態に基づきガス溜りを検知する様
にすると検知にガスセンサが必要なく、製作コストの低
減が図れる等の優れた効果を発揮する。
As described above, according to the present invention, the current gas-filled state of the gas pipe is displayed, so that the gas pipe can be maintained, or a gas causing a dangerous chemical reaction due to mixing can be supplied. Information can be provided to workers, and safety is improved. In addition, since an empty gas pipe and a gas pipe having a gas reservoir can be clearly determined, it is not necessary to exhaust the gas reservoir to all the gas pipes. improves. Furthermore, if the gas state detecting means of the gas pipe monitors the open / closed state of the open / close valve provided in the gas pipe and detects the gas pool based on the open / closed state, no gas sensor is required for the detection, and the manufacturing cost can be reduced. It has excellent effects such as being able to be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態の要部を示す制御ブ
ロック図である。
FIG. 1 is a control block diagram illustrating a main part of a first embodiment of the present invention.

【図2】同前第1の実施の形態の作用を示すフローチャ
ートである。
FIG. 2 is a flowchart showing the operation of the first embodiment.

【図3】(A)(B)(C)は同前第1の実施の形態の
表示例を示す説明図である。
FIGS. 3A, 3B, and 3C are explanatory diagrams showing display examples according to the first embodiment.

【図4】本発明の第2の実施の形態を示す説明図であ
る。
FIG. 4 is an explanatory diagram showing a second embodiment of the present invention.

【図5】半導体製造装置の構成を示す概略説明図であ
る。
FIG. 5 is a schematic explanatory view showing a configuration of a semiconductor manufacturing apparatus.

【図6】従来例の制御ブロック図である。FIG. 6 is a control block diagram of a conventional example.

【図7】従来例に於いてガス溜りが発生しない場合の説
明図である。
FIG. 7 is an explanatory diagram in a case where gas accumulation does not occur in a conventional example.

【図8】従来例に於いてガス溜りが発生する場合の説明
図である。
FIG. 8 is an explanatory diagram of a case where gas accumulation occurs in a conventional example.

【符号の説明】[Explanation of symbols]

1 プロセスチャンバ 2 ガス供給ライン 3 排気系 4 圧力計 5 ガス供給用電磁バルブ 6 流量制御器 7 インタロック用電磁バルブ 11 制御装置 12 表示装置 15 CPU 16 制御プログラム 17 データ送受信プログラム 20 ディスプレイ 30 判断プログラム 31 記憶部 Reference Signs List 1 process chamber 2 gas supply line 3 exhaust system 4 pressure gauge 5 gas supply electromagnetic valve 6 flow controller 7 interlock electromagnetic valve 11 control device 12 display device 15 CPU 16 control program 17 data transmission / reception program 20 display 30 judgment program 31 Memory

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4K029 BD01 DA04 EA00 4K030 EA01 KA39 LA15 5F004 AA16 BC03 BC08 5F045 BB20 EE01 GB06 GB07  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K029 BD01 DA04 EA00 4K030 EA01 KA39 LA15 5F004 AA16 BC03 BC08 5F045 BB20 EE01 GB06 GB07

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ガス配管に設けられた開閉バルブの開閉
状態と、前回検知されたガス配管中のガスの状態とに基
づき配管のガスの状態を検知するガス状態検知手段と、
表示手段とを有し、前記ガス状態検知手段により検知さ
れたガス配管中のガスの状態を前記表示手段に表示する
様にしたことを特徴とする半導体製造装置。
1. A gas state detecting means for detecting a state of a gas in a pipe based on an open / close state of an on-off valve provided in the gas pipe and a state of a gas in the gas pipe detected last time;
And a display means for displaying the state of the gas in the gas pipe detected by the gas state detection means on the display means.
JP2000211224A 2000-07-12 2000-07-12 Semiconductor manufacturing apparatus, display method of semiconductor manufacturing apparatus, and manufacturing method of semiconductor device Expired - Lifetime JP4794031B2 (en)

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JP2010102693A (en) * 2008-09-29 2010-05-06 Hitachi Kokusai Electric Inc Substrate processing apparatus
WO2013132939A1 (en) * 2012-03-07 2013-09-12 東京エレクトロン株式会社 Evaluation device and computer program
KR101386063B1 (en) 2012-07-19 2014-04-17 최상식 Direction aligning apparatus for conveyor
KR20220144852A (en) 2020-03-27 2022-10-27 가부시키가이샤 코쿠사이 엘렉트릭 Semiconductor device manufacturing method, substrate processing apparatus and program

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