KR100244280B1 - 바이폴라 정전척의 척킹방법 - Google Patents
바이폴라 정전척의 척킹방법 Download PDFInfo
- Publication number
- KR100244280B1 KR100244280B1 KR1019960073480A KR19960073480A KR100244280B1 KR 100244280 B1 KR100244280 B1 KR 100244280B1 KR 1019960073480 A KR1019960073480 A KR 1019960073480A KR 19960073480 A KR19960073480 A KR 19960073480A KR 100244280 B1 KR100244280 B1 KR 100244280B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- electrostatic chuck
- wafer
- bipolar electrostatic
- chucking method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000007599 discharging Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 31
- 238000009825 accumulation Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
Claims (1)
- 하부전극으로 제 1전극 및 제 1전극 양측에 제2, 제 3전극을 구비한 바이폴라 정전척을 사용하는 식각장비에 있어서, 상기 제 1전극에는 양의 전압을 공급하고, 상기 제 2, 제 3전극에는 음의 전압을 공급함을 특징으로 하는 바이폴라 정전척의 척킹방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960073480A KR100244280B1 (ko) | 1996-12-27 | 1996-12-27 | 바이폴라 정전척의 척킹방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960073480A KR100244280B1 (ko) | 1996-12-27 | 1996-12-27 | 바이폴라 정전척의 척킹방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980054332A KR19980054332A (ko) | 1998-09-25 |
KR100244280B1 true KR100244280B1 (ko) | 2000-02-01 |
Family
ID=19491353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960073480A Expired - Fee Related KR100244280B1 (ko) | 1996-12-27 | 1996-12-27 | 바이폴라 정전척의 척킹방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100244280B1 (ko) |
-
1996
- 1996-12-27 KR KR1019960073480A patent/KR100244280B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR19980054332A (ko) | 1998-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6243251B1 (en) | Electrostatic chuck, and method of and apparatus for processing sample using the chuck | |
JP3911787B2 (ja) | 試料処理装置及び試料処理方法 | |
US6760213B2 (en) | Electrostatic chuck and method of treating substrate using electrostatic chuck | |
US5221450A (en) | Electrostatic chucking method | |
EP1376682A1 (en) | Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system | |
KR20120004190A (ko) | 반도체 제조장치의 세정방법 | |
JP3847363B2 (ja) | 半導体ウェハ処理装置及び半導体ウェハ処理方法 | |
US6628500B1 (en) | Method and apparatus for dechucking a substrate from an electrostatic chuck | |
KR100545169B1 (ko) | 반도체 제조 설비의 정전척 및 이를 이용한 웨이퍼 척킹방법 | |
KR100244280B1 (ko) | 바이폴라 정전척의 척킹방법 | |
US6432727B1 (en) | Method for eliminating a static electricity on a semiconductor wafer | |
KR20110069490A (ko) | 반도체 기판의 척킹/디척킹 방법, 이를 이용한 반도체 소자의 제조 장치 및 제조 방법 | |
KR100304981B1 (ko) | 웨이퍼 표면의 잔류 전하 제거 방법 | |
KR970003611A (ko) | 플라즈마 처리 방법 | |
KR100282421B1 (ko) | 이에스씨(esc:electrostaicchuck)장치 | |
KR0179156B1 (ko) | 웨이퍼 고정장치 | |
JPS61264174A (ja) | 直流バイアススパツタリング法 | |
KR100698863B1 (ko) | 플라즈마 처리장치의 피처리물 정전기 고정장치 및 방법 | |
KR100541540B1 (ko) | 반도체 웨이퍼의 정전 척 | |
JPH09129716A (ja) | 静電吸着装置とその製造方法、ウエハ処理方法 | |
KR100226775B1 (ko) | 정전기 제거방법 | |
KR200205176Y1 (ko) | 반도체 웨이퍼 식각장비의 정전척 | |
KR20020017366A (ko) | 반도체장치 제조설비의 정전척 | |
KR100637602B1 (ko) | 기판의 디척킹이 신속한 플라즈마 처리장치 및 기판 디척킹방법 | |
KR20070091734A (ko) | 반도체 제조설비 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19961227 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19961227 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19990731 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19991027 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19991122 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 19991123 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20021018 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20031017 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20041018 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20051019 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20061026 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20071025 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20081027 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20091028 Start annual number: 11 End annual number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20101025 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20101025 Start annual number: 12 End annual number: 12 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20121009 |