KR100241967B1 - Frame structure of saw - Google Patents
Frame structure of saw Download PDFInfo
- Publication number
- KR100241967B1 KR100241967B1 KR1019920001445A KR920001445A KR100241967B1 KR 100241967 B1 KR100241967 B1 KR 100241967B1 KR 1019920001445 A KR1019920001445 A KR 1019920001445A KR 920001445 A KR920001445 A KR 920001445A KR 100241967 B1 KR100241967 B1 KR 100241967B1
- Authority
- KR
- South Korea
- Prior art keywords
- bottom plate
- printed
- metal wire
- surface acoustic
- assembling
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/30—Time-delay networks
Abstract
본 발명은 탄성표면파소자를 조립하는 방법에 관한 것으로, 금속선(9)이 스크린인쇄된 알루미나패키지의 밑판(8)상에 IDT전극이 인쇄된 압전칩(11)을 접착제를 사용하여 부착시키는 단계와, 압전칩(11)의 접속패드와 밑판(8)상에 인쇄된 상기 금속선(9)을 연결선으로 연결하는 단계와, 금속선(9)과 리드핀(10)을 접속하는 단계 및, 접착제를 사용하여 상기 알루미나패키지의 밑판(8)과 덮개(12)를 접착시킨 후 큐어링하는 공정을 포함하는 방법으로 소자를 조립함으로써 재료비를 절감하고 생산성을 향상시킬 수 있다.The present invention relates to a method for assembling a surface acoustic wave device, comprising: attaching a piezoelectric chip (11) having an IDT electrode printed thereon onto an underplate (8) of an alumina package on which a metal wire (9) is screen printed; Connecting the metal wire 9 printed on the connection pad of the piezoelectric chip 11 and the bottom plate 8 with a connection line, connecting the metal wire 9 and the lead pins 10, and using an adhesive By assembling the device by a method comprising the step of bonding the bottom plate 8 and the cover 12 of the alumina package and then curing, it is possible to reduce material costs and improve productivity.
Description
제1도는 종래의 탄성표면파소자의 조립구조를 나타낸 도면.1 is a view showing an assembly structure of a conventional surface acoustic wave device.
제2도는 본 발명에 의한 소자의 조립구조를 나타낸 평면도.2 is a plan view showing the assembly structure of the device according to the present invention.
제3도는 본 발명에 의한 소자의 조립구조를 나타낸 단면도.3 is a cross-sectional view showing the assembly structure of the device according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 밑판(stem) 2 : 절연체1: base 2: insulator
3 : 리드(lead) 4 : 덮개(shell)3: lead 4: shell
5,11 : 압전칩 6,13 : 접속도선(bonding wire)5,11 piezoelectric chip 6,13 bonding wire
7 : 에폭시(epox) 8 : 알루미나 패키지의 밑판7: epoxy 8 bottom plate of alumina package
9 : 인쇄된 금속 10 : 리드핀9: printed metal 10: lead pin
12 : 알루미나 패키지의 덮개12: cover of alumina package
본 발명은 탄성표면파를 이용한 압전소자(piezoelectric device)의 조립방법에 관한 것으로, 특히 SAW(surface acoustic wave)를 발생시키는 압전기판으로 니오브산리듐(LiNbO3), 탄탈산리튬(LiTaO3) 또는 수정(quartz)과 같은 압전단결정을 사용한 탄성표면파소자의 조립방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for assembling a piezoelectric device using surface acoustic waves. Particularly, a piezoelectric plate for generating a surface acoustic wave (SAW) is lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), or quartz crystal. A method of assembling a surface acoustic wave device using piezoelectric single crystals such as quartz.
통상적으로 사용되는 종래의 탄성표면파소자는 밑판(stem)과 덮개(shell)로 구성되는 금속캔(metal can)에 LiTaO3또는 수정과 같은 압전단결정 칩을 부착하여 조립한다.Conventionally used surface acoustic wave devices are assembled by attaching a piezoelectric single crystal chip such as LiTaO 3 or quartz to a metal can composed of a stem and a shell.
종래의 압전소자의 조리방법에 대하여 첨부된 제1도에 따라 보다 상세히 설명하면 다음과 같다.The method of cooking a conventional piezoelectric element will be described in more detail with reference to FIG. 1 as follows.
먼저, 금속으로 만들어진 밑판(1)에 리드(2)를 부착한다.First, the lid 2 is attached to the base plate 1 made of metal.
이때, 각 리드(3)와 밑판(1) 상호간의 절연을 위하여 절연체(2)를 삽입하여 부착시킨다.At this time, the insulator 2 is inserted and attached to insulate the leads 3 and the bottom plate 1 from each other.
상기 금속캔의 밑판(1)상에 탄성표면파를 여기(excitation) 또는 검출하는 IDT(interdigital transducor) 전극이 인쇄되어 있는 압전칩(5)을 부착시킨 후 상기 칩(5)을 알루미늄 도선(Al wire)으로 각 리드(3)에 연결한다.After attaching a piezoelectric chip 5 having an IDT (interdigital transducor) electrode to excite or detect surface acoustic waves on the bottom plate 1 of the metal can, the chip 5 is connected to an aluminum wire. ) To each lead (3).
마지막으로 금속캔의 덮개(4)와 밑판(1)을 결합시켜 탄성표면파소자를 조립한다.Finally, the cover 4 and the bottom plate 1 of the metal can are combined to assemble the surface acoustic wave device.
상기한 종래의 금속캔으로 조립된 소자는 특성은 우수하나 압전소자의 원가에 비해 금속캔의 가격이 차지하는 비율이 너무 크다는 결점이 있다.The device assembled with the conventional metal cans has excellent characteristics, but has a drawback that the price of the metal cans is too large compared to the cost of the piezoelectric element.
따라서, 본 발명의 목적은 종래의 금속캔형 SAW필터용 압전소자 조립방법의 결점을 해결하고, 종래와 같은 소자특성을 갖게 하면서도 제작비용을 절감할 수 있는 탄성표면파소자의 조립방법을 제공하는 것이다.Accordingly, an object of the present invention is to solve the drawbacks of the conventional piezoelectric element assembly method for a metal can SAW filter, and to provide a method of assembling a surface acoustic wave element which can reduce manufacturing costs while having device characteristics as in the prior art.
상기한 목적을 달성하기 위한 본 발명의 특징에 의하면, 본 발명의 방법은 금속선이 스크린인쇄된 알루미나패키지의 밑판상에 IDT전극이 인쇄된 압전칩을 접착제를 사용하여 부착시키는 단계와, 상기 압전칩의 접속패드와 상기 밑판상에 인쇄된 상기 금속선을 연결선으로 연결하는 단계와, 상기 금속선과 리드핀을 접속하는 단계 및, 접착제를 사용하여 상기 알루미나패키지의 밑판과 덮개를 접착시킨 후 큐어링하는 단계로 이루어진다.According to a feature of the present invention for achieving the above object, the method of the present invention comprises the step of attaching a piezoelectric chip with IDT electrode printed on the bottom plate of the alumina package screen printed metal wire using an adhesive, the piezoelectric chip Connecting the metal wires printed on the connection pads and the bottom plate of the connection pads, connecting the metal wires and the lead pins, and bonding the bottom plate and the cover of the alumina package using an adhesive, followed by curing. Is made of.
이하 첨부된 제2도 및 제3도를 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to FIGS. 2 and 3.
제2도 및 제3도는 각각 본 발명에 의한 장치의 조립구조를 나타낸 평면도 및 단면도로서, 참조번호 8은 알루미나패키지(alumina package)의 밑판, 9는 인쇄된 금속선, 10은 리드핀(lead pin), 11은 압전칩, 12는 알루미나패키지의 덮개를 각각 나타낸 것이다.2 and 3 are a plan view and a cross-sectional view showing the assembly structure of the device according to the present invention, respectively, wherein reference numeral 8 is a bottom plate of an alumina package, 9 is a printed metal wire, and 10 is a lead pin. , 11 is a piezoelectric chip, and 12 is a cover of the alumina package.
먼저, 탄성표면파를 여기시키거나 검출하는 IDT전극이 인쇄되어 있는 압전칩(11)을 금속으로 이루어진 선(line)이 스크린 인쇄(screen printing)된 알루미나패키지의 밑판(8) 위에 Ag에폭시(epoxy)를 사용하여 부착시킨다.First, an Ag epoxy is formed on the bottom plate 8 of an alumina package on which a line of metal is screen printed on a piezoelectric chip 11 on which an IDT electrode for exciting or detecting surface acoustic waves is printed. Attach using.
이와같이 압전칩(11)을 밑판(8)에 부착시킨후 압전칩(11)의 접속패드(bonding pad)와 밑판(8)상에 인쇄된 금속선(9)을 Al등으로 이루어진 연결선(bonding wire)을 사용하여 상호 연결시킨다.After attaching the piezoelectric chip 11 to the bottom plate 8, the bonding pad of the piezoelectric chip 11 and the metal wire 9 printed on the bottom plate 8 are made of Al or the like. To interconnect.
이어, 밑판(8)상의 금속선(9)과 리드핀(10)을 접속한다.Next, the metal wire 9 and the lead pin 10 on the bottom plate 8 are connected.
마지막으로, 에폭시계열이나 페놀(phenol)계열의 접착제를 사용하여 알루미나패키지의 밑판(8) 및 덮개(12)를 접착시킨 후 100℃~300℃의 온도에서 큐어링(curing)하여 탄성표면파소자의 조립을 완료한다.Finally, the bottom plate 8 and the cover 12 of the alumina package are bonded using an epoxy or phenol adhesive and then cured at a temperature of 100 ° C. to 300 ° C. Complete the assembly.
상기한 바와같이 본 발명에 의한 방법은 압전기판에서 발생하는 표면파(SAW)를 억제시키지 않고 본래 설계된 바와같은 특성을 갖게 하면서 값비싼 금속캔 대신 알루미나 패키지를 사용하여 조립함으로써 재료비를 절감할 수 있으며 생산성 향상에도 기여할 수 있는 효과가 있다.As described above, the method according to the present invention can reduce material costs by assembling using an alumina package instead of expensive metal cans while maintaining the characteristics as originally designed without suppressing surface wave (SAW) generated in the piezoelectric plate. It can also contribute to improvement.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920001445A KR100241967B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920001445A KR100241967B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930017474A KR930017474A (en) | 1993-08-30 |
| KR100241967B1 true KR100241967B1 (en) | 2000-02-01 |
Family
ID=19328514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920001445A KR100241967B1 (en) | 1992-01-31 | 1992-01-31 | Frame structure of saw |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100241967B1 (en) |
-
1992
- 1992-01-31 KR KR1019920001445A patent/KR100241967B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930017474A (en) | 1993-08-30 |
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