KR100239687B1 - Ultra-thin memory module - Google Patents

Abstract

The present invention relates to a structure of an ultra-thin memory module mounted on the motherboard of various computers and devices to increase the expansion capacity of the motherboard, the memory having a plurality of conductive pads for connecting to an external terminal on one side After forming several device mounting grooves at a predetermined depth in the middle of the small board for the module, a plurality of metal lines are formed at the edge thereof, and the semiconductor device 14 is inserted into each of the device mounting grooves. By extending the lead of the semiconductor device and the contact portion of the metal line formed at the edge of the device mounting groove, the thickness t 'of the memory module can be made thinner, and thus the expansion slot into which the memory module is inserted and mounted. Reduces the gaps between the motherboards, increasing the expansion capacity of the motherboard and leading to neighboring devices There is also capable of preventing the short circuit between the bad effects.

Description

Ultra Thin Memory Modules

1 and 2 are views showing the structure of a conventional memory module.

1 is a partially cutaway plan view of a conventional memory module.

2 is a cross-sectional view taken along the line AA ′ of FIG. 1.

3 and 4 are views showing the structure of the ultra-thin memory module according to the present invention,

3 is a partially cutaway plan view of an ultra-thin memory module according to the present invention.

4 is a cross-sectional view taken along the line B-B 'of FIG.

* Explanation of symbols for main parts of the drawings

11: Small board for memory module 11a: Conductive pad

12: device mounting groove 13: metal line

14 semiconductor device 14a outlead

15 contact

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a memory module mounted on a mother board of various computers and devices to increase an expansion capacity of the motherboard, and in particular, a plurality of semiconductor device mounting grooves on a small board for a memory module. To form a semiconductor device and insert and mount the semiconductor device therein, to reduce the thickness of the memory module, to prevent shorting of neighboring devices, and to increase the expansion capacity of the motherboard. will be.

A memory module generally used has a structure in which a plurality of semiconductor devices 2 are mounted on a small substrate 1 for a memory module as shown in FIGS. 1 and 2.

The small substrate 1 is formed with a plurality of metal lines 1a for electrical conduction with the device 2 mounted in the middle portion, and a plurality of conductive pads 1b for connection connection with external terminals at one side portion. ) Is formed.

In addition, the semiconductor device 2 may use a small outline J-lead (SOJ) type semiconductor device whose outlead 2a is a J-form, or a small outline package (SOP) type semiconductor device which is a gull form. Can be.

Such a memory module generally matches the outleads 2a of the semiconductor device 2 with the metal lines 1a of the small substrate 1, and then the contact portions 3 of the metalines 1a and the leads 2a. ) Is produced by soldering and fixing.

The memory modules thus manufactured are mounted in several memory expansion slots (not shown) arranged at regular intervals on the motherboards of various computers and devices to expand the capacity of the motherboard or perform any other complex functions. It will do the work.

However, the memory module having the conventional structure as described above is soldered and fixed in the state where the semiconductor device 2 is placed on the surface of the small substrate 1 so that the thickness t becomes thick, and thus one side mounted on the motherboard. The gap between expansion slots and neighboring expansion slots can no longer be reduced, which causes a limitation in the manufacture of the motherboard.

In addition, in the conventional memory module, when the plurality of devices 2 are mounted on the small substrate 1, the distance between the metal lines 1a formed on the small substrate 1 is narrow, making it difficult to arrange the devices 2. In addition, there was a risk that the lead 2a and the lead of the neighboring device 2 were shorted due to misalignment, thereby deteriorating the entire memory module.

In view of the above, an object of the present invention is to make an ultra-thin memory module that can increase the memory expansion capacity of a motherboard by reducing the thickness of the memory module by making the memory module thinner, thereby reducing the interval between expansion slots in which the memory module is inserted and mounted. In providing.

Another object of the present invention is to provide an ultra-thin memory module which reduces defects of a memory module by preventing a lead and a lead of neighboring semiconductor devices mounted on a small substrate for a memory module from shorting.

The object of the present invention is to form a plurality of device mounting grooves at a predetermined depth in the middle of the small substrate for a memory module, and inserting a semiconductor device into the lead of the device and the metal line formed at the edge of the mounting groove. It is achieved by providing an ultra-thin memory module, characterized in that the solder portion is configured by soldering.

Since the ultra-thin memory module according to the present invention configured as described above can be made thinner, the gap between the expansion slots in which the memory module is mounted can be reduced, and accordingly, the memory expansion capacity of the motherboard can be further increased. Since a short defect between the lead and the lead of the semiconductor device can be prevented, there is an effect of reducing the defect of the memory module.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 are partial cutaway plan views showing the structure of the ultra-thin memory module according to the present invention and a cross-sectional view taken along line B-B 'of FIG. 3, as shown therein. A plurality of device mounting grooves 12 are formed at a predetermined depth H in an intermediate portion of the small substrate 11 for a memory module having a plurality of conductive pads 11a for connecting to external terminals. In addition, a plurality of metal lines 13 are formed at the edge of the device mounting groove 12, and the semiconductor device 14 is inserted into each of the device mounting grooves 12, and then the outlead of the semiconductor device 14 is formed. 14a and the contact portion 15 of the metal line 13 formed at the edge of the device mounting groove 12 are soldered and fixed to achieve electrical conduction.

The semiconductor device 14 may use an SOJ type semiconductor device whose outlead 14a is a J form, or an SOP type semiconductor device which is a gull form, and the like. In the arrangement on the small substrate 11 may be arranged in the horizontal or vertical direction, but is not necessarily limited to this.

The ultra-thin memory module according to the present invention configured as described above is inserted and mounted in several module expansion slots (not shown) fixed to the motherboards of various computers and devices as in the prior art, thereby increasing the memory expansion capacity of the motherboard. Or to perform any other complex function is similar to the conventional operation, but the ultra-thin memory module according to the present invention forms a device mounting groove 12 in the small substrate 11 and the semiconductor device 14 The insertion and mounting allows the thickness t 'to be made thinner, the semiconductor devices 14 can be easily arranged, and short defects between the outleads 14a of the neighboring semiconductor devices 14 can be eliminated. It can be prevented.

As described in detail above, the ultra-thin memory module according to the present invention forms a plurality of device mounting grooves in an intermediate portion of a small substrate for a memory module and inserts and mounts a semiconductor device therein, whereby the thickness t 'of the memory module is increased. It can be made thinner, and accordingly, the gap between the module expansion slots in which the memory modules are mounted can be reduced, thereby further increasing the memory expansion capacity of the motherboard, and the arrangement of the semiconductor devices into the device mounting grooves of the small boards. It is easy and can eliminate the possibility of a short circuit between the outleads of neighboring devices has an effect that can prevent a memory module failure due to a short failure of a conventional neighboring device.

Claims (4)

Several device mounting grooves 12 are formed at a predetermined depth H in the middle portion of the small substrate 11 for a memory module having a plurality of conductive pads 11a for connecting to external terminals at one side thereof. In addition, a plurality of metal lines 13 are formed at the edge thereof, the semiconductor device 14 is inserted into each device mounting groove 12, and the outlead 14a of the semiconductor device 14 and the Ultra-thin memory module, characterized in that configured by soldering and fixing the contact portion 15 of the metal line (13) formed on the edge of the device mounting groove (12). 2. The ultra-thin memory module according to claim 1, wherein the semiconductor device (14) is an SOJ type semiconductor device. 2. The ultra-thin memory module according to claim 1, wherein the semiconductor device (14) is an SOP type semiconductor device. The ultra-thin memory module according to any one of claims 1 to 3, wherein the semiconductor device (14) is arranged horizontally or vertically on the small substrate (11).