KR100239378B1 - Onloader unit of auto molding press for manufacturing semiconductor package - Google Patents

Onloader unit of auto molding press for manufacturing semiconductor package Download PDF

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Publication number
KR100239378B1
KR100239378B1 KR1019970038950A KR19970038950A KR100239378B1 KR 100239378 B1 KR100239378 B1 KR 100239378B1 KR 1019970038950 A KR1019970038950 A KR 1019970038950A KR 19970038950 A KR19970038950 A KR 19970038950A KR 100239378 B1 KR100239378 B1 KR 100239378B1
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South Korea
Prior art keywords
elevator
magazine
lead frame
molding press
semiconductor package
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KR1019970038950A
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Korean (ko)
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KR19990016420A (en
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박경환
이택근
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김규현
아남반도체주식회사
정헌태
주식회사아남인스트루먼트
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Priority to KR1019970038950A priority Critical patent/KR100239378B1/en
Publication of KR19990016420A publication Critical patent/KR19990016420A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패키지 제조용 자동몰딩프레스에서 와이어본딩된 리드프레임 자재를 몰딩하기 위하여 리드프레임 자재를 순착적으로 공급하는 온로더 장치에 관한 것으로, 엘리베이터의 상부에 설치된 회전실린더와, 이 회전실린더의 로드 끝단에 결합되어 90°회전되면서 하강하여 매거진의 상면을 고정시키는 고정블럭과, 상기한 엘리베이터의 하부로 연장되도록 형성되어 상기한 엘리베이터가 최상단으로 완전히 상승되었을 때 대기하고 있는 매거진의 이송을 정지시키는 판스톱퍼로 이루어져 리드프레임 자재가 적층되어 있는 매거진이 엘리베이터로 이송되면 이를 회전실린더에 의해 작동하는 고정블럭으로 견고하게 고정하고, 상기한 엘리베이터의 상하 이송시에 대기하고 있던 매거진이 엘리베이터 측으로 계속해서 이송되는 것을 방지하여 불량을 없애도록 된 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an on-loader device for supplying lead frame materials in order to mold wire-bonded lead frame materials in an automatic molding press for manufacturing a semiconductor package. A fixed block coupled to the end and rotated by 90 ° to fix the upper surface of the magazine, and a plate which extends to the lower part of the elevator to stop the conveying of the magazine waiting when the elevator is fully raised to the top. When a magazine consisting of a stopper and stacked lead frame materials is transferred to an elevator, the magazine is firmly fixed to a fixed block operated by a rotating cylinder, and the magazines waiting at the time of vertical movement of the elevator are continuously transferred to the elevator side. Preventing things It is to eliminate the defect.

Description

반도체 패키지 제조용 자동몰딩프레스의 온로더 장치On-loader device of automatic molding press for manufacturing semiconductor package

본 발명은 반도체 패키지 제조용 자동몰딩프레스에서 와이어본딩된 리드프레임 자재를 몰딩하기 위하여 리드프레임 자재를 순착적으로 공급하는 온로더 장치에 관한 것으로, 더욱 상세하게는 리드프레임 자재가 적층되어 있는 매거진이 엘리베이터로 이송되면 이를 회전실린더에 의해 작동하는 고정블럭으로 견고하게 고정하고, 상기한 엘리베이터의 상하 이송시에 대기하고 있던 매거진이 엘리베이터 측으로 계속해서 이송되는 것을 방지하여 불량을 없애도록 된 것이다.The present invention relates to an on-loader device for supplying lead frame materials in order to mold wire-bonded lead frame materials in an automatic molding press for manufacturing a semiconductor package. More specifically, a magazine in which lead frame materials are stacked is an elevator. When it is transported to a fixed block that is operated by a rotary cylinder is firmly fixed, and the magazine waiting to be transported to the elevator at the time of the up and down of the elevator to prevent the transfer to the elevator side to eliminate the defects.

일반적으로 몰딩프레스 장치에서 와이어본딩된 리드프레임 자재를 순차적으로 공급하기 위한 온로더 장치는 와이어본딩된 리드프레임 자재가 적층된 매거진을 장착할 수 있는 장착부가 설치되어 있다. 이러한 매거진 장착부는 하부에 모터에 의해 구동하는 이송벨트가 설치되고, 이 이송벨트의 상부에 리드프레임이 적층되어 있는 매거진을 안착시켜 엘리베이터로 이송시키는 것이다.In general, the on-loader device for sequentially supplying the wire-bonded leadframe material in the molding press apparatus is provided with a mounting portion for mounting a magazine laminated with wire-bonded leadframe material. The magazine mounting portion is provided with a conveying belt driven by a motor at the lower part, and seats a magazine in which a lead frame is stacked on the upper portion of the conveying belt and transfers the result to an elevator.

이와같이 엘리베이터로 이송된 매거진은 엘리베이터가 승하강되면서 상기한 매거진에 적층되어 있는 리드프레임의 후단부를 푸셔가 밀어서 리드프레임을 순차적으로 공급하는 것이다.As such, the magazine transferred to the elevator is to push the rear end of the lead frame stacked on the magazine as the elevator is raised and lowered to supply the lead frame sequentially.

그러나, 종래에는 상기한 엘리베이터로 이송된 리드프레임이 적층되어 있는 매거진을 고정시키는 구조가 없거나, 가이드레일만으로 매거진을 잡아주어 불량 발생의 원인이 되었던 것이다.However, in the related art, there is no structure to fix the magazines in which the lead frames transferred to the elevator are stacked, or the magazines are held only by the guide rails, which causes the failure.

또한, 상기한 엘리베이터가 승하강 되면서 리드프레임을 공급할 때, 상기한 엘리베이터로 이송되기 위하여 대기하고 있는 매거진은 스톱퍼 등에 의하여 정지되어 있는데, 상기한 엘리베이터가 상승한 후, 하강시는 스톱퍼가 제거되어야 하며 이때, 엘리베이터 하부로 대기하고 있던 매거진이 밀려 들어가는 경우가 종종 발생되어 엘리베이터 하강시 출돌하는 문제점이 있었다.In addition, when supplying the lead frame while the elevator is raised and lowered, the magazine waiting to be transferred to the elevator is stopped by a stopper, etc. After the elevator rises, the stopper must be removed when the elevator descends. In some cases, magazines waiting in the lower part of the elevator are often pushed in, resulting in a problem when the elevator descends.

본 발명의 목적은 이와같은 문제점을 해소하기 위하여 발명된 것으로서, 리드프레임 자재가 적층되어 있는 매거진이 엘리베이터로 이송되면 이를 회전실린더에 의해 작동하는 고정블럭으로 견고하게 고장하고, 상기한 엘리베이터가 완전히 상승되어 그 하부에 공간부가 형성되어도 이 공간부로 대기하고 있는 매거진이 이송되는 것을 방지하여 불량을 없애도록 된 반도체 패키지 제조용 자동몰딩프레스의 온로더 장치를 제공함에 있다.The object of the present invention is to invent such a problem, and when a magazine in which lead frame materials are stacked is transferred to an elevator, it is firmly broken by a fixed block operated by a rotating cylinder, and the elevator is completely raised. The present invention provides an on-loader device for an automatic molding press for manufacturing a semiconductor package which prevents a magazine waiting to be transferred to the space even if a space is formed at the bottom thereof, thereby eliminating defects.

도 1은 본 발명에 따른 자동몰딩프레스의 온로더 장치를 나타낸 정면도1 is a front view showing an on-loader device of an automatic molding press according to the present invention.

도 2는 본 발명에 따른 자동몰딩프레스의 온로더 장치의 측면도Figure 2 is a side view of the on-loader device of the automatic molding press according to the present invention

도 3은 본 발명의 요부인 매거진을 고정하기 위한 회전실린더 및 고정블럭을 나타낸 사시도3 is a perspective view showing a rotating cylinder and a fixing block for fixing a magazine which is a main part of the present invention;

- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-

1 - 매거진 2 - 엘리베이터1-Magazine 2-Elevator

3 - 회전실린더 3a - 로드3-rotating cylinder 3a-rod

4 - 고정블럭 5 - 판스톱퍼4-fixed block 5-plate stopper

6 - 이송벨트 7 - 모터6-conveyor belt 7-motor

8 - 볼스크류 9 - 스텝모터8-Ball Screw 9-Step Motor

10 - 푸셔10-pusher

이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 1과 도 2는 본 발명에 따른 자동몰딩프레스의 온로더 장치를 나타낸 정면도와 측면도를 도시한 것이다. 도시된 바와같이 본 발명에 따른 자동몰딩프레스의 온로더 장치는 리드프레임이 적층된 매거진(1)을 안착시켜 이송시키는 이송벨트(6)가 모터(7)의 구동에 의해 동작되도록 안착되는 매거진(1)의 양측 하부에 위치하도록 설치되어 있다. 상기한 이송벨트(6)의 일측단에는 스텝모터(9)와 볼스크류(8)에 의해 승하강되는 엘리베이터(2)가 설치되어 상기한 이송벨트(6)에 의해 이송된 매거진(1)을 승하강 시키면서 푸셔(10)에 의해 매거진(1)에 적층된 리드프레임의 후단부를 밀어서 순차적으로 공급하는 것이다.1 and 2 are a front view and a side view showing the on-loader device of the automatic molding press according to the present invention. As shown, the on-loader device of the automatic molding press according to the present invention is a magazine in which the transport belt 6 for seating and transporting the magazine 1 on which the lead frame is stacked is operated to be driven by the driving of the motor 7. It is installed to be located at the lower side of both sides of One side end of the conveying belt 6 is provided with an elevator 2 which is lifted and lowered by a step motor 9 and a ball screw 8 so as to convey the magazine 1 conveyed by the conveying belt 6. While pushing up and down, the rear end of the lead frame laminated to the magazine 1 by the pusher 10 is pushed and supplied sequentially.

도 3은 본 발명의 요부인 매거진을 고정하기 위한 회전실린더 및 고정블럭을 나타낸 사시도이다. 도시된 바와같이 상기한 엘리베이터(2)의 상부에는 회전실린더(3)가 설치되고, 이 회전실린더(3)의 로드(3a) 끝단에는 고정블럭(4)이 설치되어 엘리베이터(2)에 매거진(1)이 이송되면 상기한 회전실린더(3)가 작동되어 매거진(1)의 상부를 고정시키는 것이다. 여기서, 상기한 회전실린더(3)의 로드(3a)는 90°회전됨과 동시에 하부로 동작되는 것이다.3 is a perspective view illustrating a rotating cylinder and a fixing block for fixing a magazine, which is a main part of the present invention. As shown in the upper portion of the elevator 2, the rotary cylinder 3 is installed, the fixed block 4 is installed at the end of the rod (3a) of the rotary cylinder 3, the magazine (2) When 1) is conveyed, the above-described rotary cylinder 3 is operated to fix the upper part of the magazine 1. Here, the rod (3a) of the rotary cylinder (3) is rotated 90 degrees and is operated downward.

또한, 상기한 엘리베이터(2)의 하부에는 상기한 매거진(1)이 이송되는 측에 판스톱퍼(5)를 연장되도록 형성하여 상기한 엘리베이터(2)가 상부로 상승되어 엘리베이터(2)의 하부에 공간부가 형성되어도 상기한 판스톱퍼(5)에 의해 공간부로 대기하고 있는 엘리베이터(2)가 이송되는 것을 방지하는 것이다.In addition, the lower part of the elevator (2) is formed so that the plate stopper (5) is extended to the side on which the magazine (1) is transported so that the elevator (2) is raised to the upper to the lower part of the elevator (2) Even if the space portion is formed, the above-mentioned plate stopper 5 prevents the elevator 2 waiting for the space portion from being transferred.

이와같이 구성된 본 발명은 자동몰딩프레스에 와이어본딩된 리드프레임 자재를 공급하기 위하여 상기한 리드프레임이 적층되어 있는 매거진(1)을 이송벨트(6)에 안착시켜 엘리베이터(2)로 이송되면 상기한 회전실린더(3)가 작동되어 고정블럭(4)이 90°회전되면서 하부로 작동되어 매거진(1)의 상면을 견고하게 고정시키는 것이다.The present invention configured as described above rotates the magazine 1 on which the lead frame is stacked on the transfer belt 6 so as to feed the lead frame material wire-bonded to the automatic molding press and is transferred to the elevator 2. The cylinder 3 is operated so that the fixing block 4 is rotated by 90 ° to operate downward to firmly fix the upper surface of the magazine 1.

이 상태에서 상기한 엘리베이터(2)는 스텝모터(9)와 볼스크류(8)에 의해 승하강되면서 푸셔(10)로 리드프레임의 후단부를 밀어서 공급하는 것으로, 상기한 엘리베이터(2)가 최상단 까지 상승되어 엘리베이터(2)의 하부에 공간부가 형성되어도, 상기한 엘리베이터(2)의 하부로 연장되도록 형성된 판스톱퍼(5)에 의해 대기하고 있는 매거진(1)이 이송되는 것을 방지함으로써 불량을 미연에 예방할 수 있는 것이다.In this state, the elevator 2 is lowered by the step motor 9 and the ball screw 8 and is supplied by pushing the rear end of the lead frame to the pusher 10 so that the elevator 2 is at the top. Even if a space portion is formed in the lower part of the elevator 2, the magazine 1 waiting to be held by the plate stopper 5 formed to extend to the lower part of the elevator 2 is prevented from being transferred. It can be prevented.

이상의 설명에서 알 수 있듯이 본 발명의 반도체 패키지 제조용 자동몰딩프레스의 온로더 장치에 의하면, 엘리베이터로 이송된 매거진을 회전실린더에 의해 작동하는 고정블럭으로 견고하게 고정하고, 상기한 엘리베이터의 하부로 연장 형성된 판스톱퍼에 의해 엘리베이터가 최상단으로 완전히 상승되어 그 하부에 공간부가 형성되어도 이 공간부로 대기하고 있는 매거진이 이송되지 않아 불량을 방지할 수 있는 효과가 있다.As can be seen from the above description, according to the on-loader device of the automatic molding press for manufacturing a semiconductor package of the present invention, the magazine transferred to the elevator is firmly fixed by a fixed block operated by a rotating cylinder, and is formed to extend below the elevator. Even if the elevator is fully raised to the top by the plate stopper and a space portion is formed at the bottom thereof, the magazines waiting in the space portion are not transferred, thereby preventing the defect.

Claims (1)

반도체 패키지 제조용 자동몰딩프레스의 온로더 장치에서 리드프레임이 적층된 매거진을 승하강시키면서 공급하도록 된 엘리베이터에 있어서, 상기한 엘리베이터(2)의 상부에 설치된 회전실린더(3)와, 이 회전실린더(3)의 로드 끝단에 결합되어 90°회전되면서 하강하여 매거진(1)의 상면을 고정시키는 고정블럭(4)과, 상기한 엘리베이터(2)의 하부로 연장되도록 형성되어 상기한 엘리베이터(2)가 최상단으로 완전히 상승되었을 때 대기하고 있는 매거진(1)의 이송을 정지시키는 판스톱퍼(5)로 이루어지는 것을 특징으로 하는 반도체 패키지 제조용 자동몰딩프레스의 온로더 장치.In an elevator configured to supply a magazine having a lead frame stacked up and down in an on-loader device of an automatic molding press for manufacturing a semiconductor package, a rotary cylinder 3 provided above the elevator 2 and the rotary cylinder 3 Fixed block (4) fixed to the upper surface of the magazine (1) by being lowered while being rotated by 90 ° rotated to the end of the rod), and is formed to extend to the lower portion of the elevator (2) above the elevator (2) The on-loader device of the automatic molding press for manufacturing a semiconductor package, characterized in that it comprises a plate stopper (5) which stops the transfer of the magazine (1) which is waiting when fully raised.
KR1019970038950A 1997-08-14 1997-08-14 Onloader unit of auto molding press for manufacturing semiconductor package KR100239378B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970038950A KR100239378B1 (en) 1997-08-14 1997-08-14 Onloader unit of auto molding press for manufacturing semiconductor package

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Application Number Priority Date Filing Date Title
KR1019970038950A KR100239378B1 (en) 1997-08-14 1997-08-14 Onloader unit of auto molding press for manufacturing semiconductor package

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KR19990016420A KR19990016420A (en) 1999-03-05
KR100239378B1 true KR100239378B1 (en) 2000-01-15

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