KR100214882B1 - Glass lead carrying-type plastic package and its fabrication method - Google Patents

Glass lead carrying-type plastic package and its fabrication method Download PDF

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Publication number
KR100214882B1
KR100214882B1 KR1019910023979A KR910023979A KR100214882B1 KR 100214882 B1 KR100214882 B1 KR 100214882B1 KR 1019910023979 A KR1019910023979 A KR 1019910023979A KR 910023979 A KR910023979 A KR 910023979A KR 100214882 B1 KR100214882 B1 KR 100214882B1
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South Korea
Prior art keywords
plastic package
glass lead
glass
package
lead
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KR1019910023979A
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Korean (ko)
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이병덕
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구본준
엘지반도체주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

글래스 리드 탑재형 플라스틱 팩키지 및 그 제조방법에 관한 것으로, CCD 칩이 1차 몰드 플라스틱 팩키지와 2차 몰드 플라스틱 팩키지로 이중으로 몰딩되며, 글래스 리드가 1차 몰드 플라스틱 팩키지에 시일링되고 2차 몰드 플라스틱 팩키지로 몰딩된 팩키지와 그 제조방법을 제공하고 있으며, 이러한 본 발명은 CCD 팩키지 제조원가를 절감할 수 있고, 이중 몰드를 함으로써 글래스 리드의 접착력 약화를 방지할 수 있으며, 글래스 리드를 탑재함으로써 CCD의 신뢰성을 향상할 수 있다.The present invention relates to a glass lead-mounted plastic package and a method of manufacturing the same, wherein the CCD chip is double molded into a primary mold plastic package and a secondary mold plastic package, and the glass lead is sealed in the primary mold plastic package and the secondary mold plastic Provided is a package molded with a package and a method of manufacturing the same, and the present invention can reduce the manufacturing cost of the CCD package, can prevent the weakening of the adhesion of the glass lead by the double mold, the reliability of the CCD by mounting the glass lead Can improve.

Description

글래스 리드 탑재형 플라스틱 팩키지 및 그 제조방법Glass lead-mounted plastic package and its manufacturing method

제1a, b, c도는 종래 CCD가 실장된 팩키지를 보인 단면도로서,1a, b, and c are cross-sectional views showing a package in which a conventional CCD is mounted.

a도는 멀티 레이어 세라믹 팩키지의 단면도.a is a cross-sectional view of a multi-layer ceramic package.

b도는 플라스틱 팩키지의 단면도.b is a cross-sectional view of the plastic package.

c도는 투명 몰드 플라스틱 팩키지.c is a transparent mold plastic package.

제2도는 본 발명에 의한 글래스 리드 탑재형 플라스틱 팩키지의 단면도.2 is a cross-sectional view of the glass lead-mounted plastic package according to the present invention.

제3도는 제2도의 팩키지에 정렬홈이 형성된 실시예를 보인 단면도.3 is a cross-sectional view showing an embodiment in which the alignment groove is formed in the package of FIG.

제4도 및 제5도는 본 발명에 의한 팩키지 제조방법 공정 설명도로서,4 and 5 are explanatory diagrams of a method for manufacturing a package according to the present invention.

제4도는 글래스 리드 시일링 단계 설명도.4 is an explanatory diagram of a glass lead sealing step.

제5a, b도는 2차 몰딩 단계 설명도.5a and b are explanatory views of the secondary molding step.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

21 : 1차 몰드 플라스틱 팩키지 25 : CCD 칩21: primary mold plastic package 25: CCD chip

27 : 글래스 리드 29 : 2차 몰드 플라스틱 팩키지27: glass lead 29: secondary mold plastic package

본 발명은 글래스 리드(glass lid)를 탑재한 이중몰드(mold) 플라스틱 팩키지(plastic package)에 관한 것으로, 특히 원가 절감 및 신뢰성 향상에 적합하도록 한 글래스 리드 탑재형 팩키지 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double mold plastic package equipped with a glass lid, and more particularly, to a glass lead mounted package and a method for manufacturing the same, which are suitable for cost reduction and reliability improvement.

종래 CCD 멀티 레이어(multi layer) 세라믹 팩키지(ceramic package)는 멀티 레이어 세라믹 팩키지 제작공정에 의해 제작된 세라믹 팩키지에 소우잉(sawing) 공정에 의해 분리된 각각의 칩(chip)을 어태치(attach)한 다음, 와이어 본딩, 그래스 탑재와 시일링(sealing)을 하여 완성하였다.Conventional CCD multi-layer ceramic packages attach each chip separated by a sawing process to a ceramic package produced by a multi-layer ceramic package manufacturing process. Then, wire bonding, grass mounting and sealing were completed.

제1도 (a)는 이러한 종래 멀티 레이어 세라믹 팩키지의 구성을 보인 단면도로서 이에 도시한 바와 같이, 세라믹 보디(body)(1)의 양외측에 아웃리드(out lead)(2)가 브레이징(grazing) 되고, 세라믹 보디(1) 위에 Ag 에폭시(3)를 제거하여 CCD칩(4)이 부착되며, Al 와이어(5)가 본딩되고, 그래스 리드(6)가 에폭시(7)를 개재하여 부착된 구성으로 되어 있다.FIG. 1 (a) is a cross-sectional view showing the structure of such a conventional multilayer ceramic package. As shown therein, out leads 2 are brazed on both sides of the ceramic body 1. The Ag epoxy 3 is removed on the ceramic body 1, the CCD chip 4 is attached, the Al wire 5 is bonded, and the grass lead 6 is attached via the epoxy 7. It is composed.

또한, 종래 CCD용 플라스틱 팩키지는 세라믹 팩키지와 같은 모양으로 플라스틱 몰드를 하여 개별 플라스틱 팩키지를 제작한다.In addition, the conventional plastic package for CCD is made of a plastic mold in the same shape as a ceramic package to produce individual plastic packages.

제1도 (b)는 이러한 종래 플라스틱 팩키지의 구성을 보인 단면도로서 이에 도시한 바와 같이, 플라스틱 몰드 보디(11) 위에 리드 프레임 패들(12)이 있고, 리드 프레임 아웃리드(13)가 양외측으로 노출되어 있으며, 리드 프레임 패들(12) 위에 Ag에폭시(14)를 개재하여 CCD 칩(15)이 부착되고, Al 또는 Au 와이어(16)가 본딩되며, 글래스 리드(17)가 에폭시(18)를 개재하여 부착된 구성으로 되어 있다.FIG. 1 (b) is a cross-sectional view showing the structure of the conventional plastic package. As shown therein, the lead frame paddle 12 is disposed on the plastic mold body 11, and the lead frame outlead 13 is moved outwardly. Exposed, the CCD chip 15 is attached to the lead frame paddle 12 through the Ag epoxy 14, Al or Au wire 16 is bonded, the glass lead 17 is epoxy (18) It has a structure attached to it.

그리고, CCD가 실장된 종래 투명 몰드 팩키지는 종래의 플라스틱 팩키지와 조립공정 전체가 유사하며, 다만 제1도(c)와 같이 EMC(epoxy molding compound)(19)를 투명하게 만들어 몰딩하고 있다.In addition, the conventional transparent mold package in which the CCD is mounted is similar to the conventional plastic package and the entire assembly process, except that the epoxy molding compound (EMC) 19 is transparently molded as shown in FIG.

종래 세라믹 팩키지는 팩키지 자체가 가지는 재료 원가가 커서 플라스틱화가 추진되고 있는데 전체를 투명 몰드로할 경우에는 칩이 손상을 입어 특성이 저하되는 문제점이 있으며, 최근에 개발된 몰드 팩키지는 세라믹 팩키지 보다 가격은 싸지만 글래스 리드와 열팽창 계수 차이로 팩키지와 글래스 리드간에 박리가 생기는 결함이 있었다.Conventional ceramic packages have been promoted to be plasticized due to the large material cost of the package itself. However, when the entire mold is made of a transparent mold, there is a problem that the chip is damaged and the characteristics thereof are deteriorated. The recently developed mold package is more expensive than the ceramic package. Although inexpensive, there was a defect in the peel between the package and the glass lead due to the difference between the glass lead and the coefficient of thermal expansion.

본 발명은 상기한 바와 같은 종래의 결함을 해소하기 위하여 창안한 것이다.The present invention has been made to solve the above-mentioned conventional defects.

이러한 본 발명에 의한 그래스 리드 탑재형 이중몰드 플라스틱 CCD 팩키지의 제조방법은 1차로 몰딩된 플라스틱 팩키지에(3)에 다이 어래치(die attach) 및 와이어 본딩을 행하고, 글래스 리드를 탑재하여 시일링한 후 2차 몰딩을 하고, 트림/포밍을 행하여 팩키지를 완성하는 것으로 되어 있다.In the method of manufacturing a glass lead-mounted double mold plastic CCD package according to the present invention, die attach and wire bonding are performed on a first molded plastic package (3), and a glass lead is mounted and sealed. After that, secondary molding is performed and trim / forming is performed to complete the package.

제2도는 본 발명에 의한 글래스 리드 탑재형 이중 몰드 CCD 팩키지의 단면도로서, 이에 도시한 바와 같이, 1차 몰드 플라스틱 팩키지(21)에 리드 프레임 패들(22)이 있고 리드 프레임 아웃리드(23)가 노출되어 있으며, 리드 프레임 패들(22) 위에는 CCD 칩(25)이 Ag 에폭시(24)를 개재하여 부착되고, Al 또는 Au 와이어(26)가 연결되며, 글래스 리드(27)가 에폭시(28)를 개재하여 부착되고, 외곽부에 2차 몰드 플라스틱 팩키지(29)가 형성된 구성으로 되어 있다.2 is a cross-sectional view of the glass lead-mounted dual mold CCD package according to the present invention. As shown therein, the primary mold plastic package 21 has a lead frame paddle 22 and a lead frame outlead 23 is provided. Exposed, the CCD chip 25 is attached to the lead frame paddle 22 via the Ag epoxy 24, Al or Au wire 26 is connected, the glass lead 27 to the epoxy 28 It adheres through and forms the secondary mold plastic package 29 in the outer part.

상기 글래스 리드(27)의 양단부는 경사지게 형성하는 것이 좋으나, 라운드 또는 각지게 형성하여도 무방하다.Both ends of the glass lead 27 may be formed to be inclined, but may be formed round or angled.

제3도는 제2도에 도시한 팩키지의 2차 몰드 팩키지(29)의 저부에 정열(align)홈(29a)이 형성된 구성을 보인 것이다.FIG. 3 shows a configuration in which alignment grooves 29a are formed at the bottom of the secondary mold package 29 of the package shown in FIG.

도면 제2도 및 제3도에서 30은 본 발명에 의해 제조된 팩키지를 표시한 것이다.30 in FIGS. 2 and 3 show a package produced by the present invention.

제4도는 본 발명 제조공정의 글래스 리드 시일링 단계를 설명하기 위한 도면으로서, 이에 도시한 바와 같이, 1차 몰딩, 다이 어태치 및 와이어 본딩을 행한 후 금형(40)을 이용하여 글래스 리드(27)를 시일링하는 바, 금형(40)에는 글래스 리드(27)가 탑재될 수 있는 홈(41)이 형성되고, 글래스 리드(27) 보호용 요입 공간부(42)가 형성되어 있다.4 is a view for explaining the glass lead sealing step of the manufacturing process of the present invention, as shown in this, after the primary molding, die attach, and wire bonding, the glass lead 27 using the mold 40 ), The groove 40 in which the glass lead 27 can be mounted is formed in the mold 40, and the recessed space 42 for protecting the glass lead 27 is formed.

이러한 금형(40)에 글래스 리드(27)를 탑재하고, 팩키지 스트립(strip)(30')을 로케이션 핀(location pin)(43)에 로케이션 홀(hole)로 맞추어 정렬한 후 온도를 조정하면서 위에서 도시한 화살표 방향으로 압력을 가하여 시일링을 한다.The glass lid 27 is mounted on the mold 40, the package strip 30 ′ is aligned with the location pin 43 as a location hole, and the temperature is adjusted from above. Sealing is performed by applying pressure in the direction of the arrow shown.

제5a, b도는 본 발명 제조공정의 2차 팩키지 몰딩 단계를 설명하기 위한 도면으로서, 이에 도시한 바와 같이, 글래스 리드(27) 보호용 요입공간부(52)가 형성된 하부 금형(51)과, 정렬용 핀 홀(53)이 형성된 상부 금형(50) 사이에 글래스 리드(27)가 시일링된 팩키지 반제품(30)을 장착하고 세트 정렬용 홀을 형성하기 위한 누름공구(54)로 팩키지 반제품(30)을 누르면서 몰딩을 행하며, 이에 따라 몰딩 수지가 글래스 리드(27)쪽으로 미세하게 흘러 들어가는 것이 방지된다.5a and b are views for explaining the secondary package molding step of the manufacturing process of the present invention, as shown in this, aligned with the lower mold 51, the concave space portion 52 for protecting the glass lid 27 is formed, Package semifinished product 30 as a pressing tool 54 for mounting the package semifinished product 30 with the glass lid 27 sealed between the upper molds 50 in which the pin holes 53 are formed, and forming holes for set alignment. Molding is carried out while pressing), whereby the molding resin is prevented from minutely flowing into the glass lid 27.

제5b도에서 31은 세트 정렬용 핀홀을 보인 것이다.31 in FIG. 5B shows pinholes for set alignment.

CCD 팩키지 제조원가를 절감할 수 있고, 이중 몰드를 함으로써 글래스 리드의 접착력 약화를 방지할 수 있으며, 글래스 리드를 탑재함으로써 CCD의 신뢰성을 향상할 수 있다.The manufacturing cost of the CCD package can be reduced, the double mold can prevent the weakening of the adhesion of the glass lead, and the reliability of the CCD can be improved by mounting the glass lead.

Claims (9)

CCD 칩(25)이 1차 몰드 플라스틱 팩키지(21)와 2차 몰드 플라스틱 팩키지(29)로 이중으로 몰딩되며, 글래스 리드(27)가 1차 몰드 플라스틱 팩키지(21)에 시일링되고 2차 몰드 플라스틱 팩키지(29)로 몰딩된 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지.The CCD chip 25 is double molded into the primary mold plastic package 21 and the secondary mold plastic package 29, and the glass lid 27 is sealed to the primary mold plastic package 21 and the secondary mold Glass lead-mounted plastic package, characterized in that molded in a plastic package (29). 제1항에 있어서, 상기 글래스 리드(27)의 양단부가 경사지게 형성된 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지.The glass lead-mounted plastic package according to claim 1, wherein both ends of the glass lead are formed to be inclined. 제1항에 있어서, 상기 글래스 리드(27)의 양단부가 라운드로 형성된 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지.The glass lead-mounted plastic package according to claim 1, wherein both ends of the glass lead are formed in a round shape. CCD 칩을 1차 몰딩하고, 1차로 몰딩된 플라스틱 팩키지에 다이 어태치 및 와이어 본딩을 행하며, 글래스 리드를 탑재하여 시일링한 후 2차 몰딩하고, 트림 및 포밍을 행함을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조방법.Glass lead mounting characterized by primary molding of CCD chip, die attach and wire bonding to primary molded plastic package, mounting with glass lead, sealing after secondary molding, trim and forming Method for producing a type plastic package. 제4항에 있어서, 글래스 리드 시일링 및 2차 몰딩공정에서 사용하는 금형에 글래스 리드 보호용 요입공간부가 형성된 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조방법.The method of manufacturing a glass lead-mounted plastic package according to claim 4, wherein the glass lead-sealing recess is formed in the mold used in the glass lead sealing and the secondary molding process. 제4항에 있어서, 글래스 시일링시 팩키지에 압력을 가하는 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조방법.The method of manufacturing a glass lead-mounted plastic package according to claim 4, wherein pressure is applied to the package during glass sealing. 제4항에 있어서, 제2차 몰딩시 홀 형성용 누름공구로 팩키지 반제품을 누르면서 몰딩을 행하여 세트 정렬용 핀홀을 형성하고, 글래스 리드로 몰딩 수지가 유입되는 것을 방지함을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조방법.5. The glass lead mounting according to claim 4, wherein the molding is performed while pressing the semi-packaged product with the hole-forming pressing tool during the second molding to form a pinhole for aligning the set, and preventing the molding resin from flowing into the glass lead. Method for producing a type plastic package. 제4항에 있어서, 팩키지의 하부에 세트 정렬용 홈을 형성하는 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조 방법.The method of manufacturing a glass lead-mounted plastic package according to claim 4, wherein a groove for setting the alignment is formed in the lower portion of the package. 제4항에 있어서, 2차 몰딩 공정까지 팩키지를 스트립 단위로 프로세싱하는 것을 특징으로 하는 글래스 리드 탑재형 플라스틱 팩키지의 제조방법.The method of manufacturing a glass lead-mounted plastic package according to claim 4, wherein the package is processed in strip units up to a secondary molding process.
KR1019910023979A 1991-12-23 1991-12-23 Glass lead carrying-type plastic package and its fabrication method KR100214882B1 (en)

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