KR100214533B1 - Column-type package and its fabrication method - Google Patents

Column-type package and its fabrication method Download PDF

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Publication number
KR100214533B1
KR100214533B1 KR1019960066626A KR19960066626A KR100214533B1 KR 100214533 B1 KR100214533 B1 KR 100214533B1 KR 1019960066626 A KR1019960066626 A KR 1019960066626A KR 19960066626 A KR19960066626 A KR 19960066626A KR 100214533 B1 KR100214533 B1 KR 100214533B1
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KR
South Korea
Prior art keywords
chip
package
leads
lead
molding
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KR1019960066626A
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Korean (ko)
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KR19980048085A (en
Inventor
이종현
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구본준
엘지반도체주식회사
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Priority to KR1019960066626A priority Critical patent/KR100214533B1/en
Publication of KR19980048085A publication Critical patent/KR19980048085A/en
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Publication of KR100214533B1 publication Critical patent/KR100214533B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

본 발명의 컬럼형 패키지 및 그 제조방법에 관한 것으로, 종래에는 금속와이어로 칩패드와 리드의 전기적인 연결을 이루도록 함으로서, 와이어 루푸 높이만큼 패키지의 두께가 두꺼워지게 되어 경박단소화에 한계가 있는 문제점에 있었다. 본 발명 컬럼형 피키지 및 그 제조방법은 금속와이어를 이용하여 와이어본딩을 실시하지 않고 리드와 칩패드를 직접 연결하므로, 종래의 금속와이어를 사용하는 경우보다 경박 단소화되는 효과가 있고, 또한, 종래에 필수적으로 수행하던 그라인딩공정과 와이어본딩공정을 배제함으로서 공수절감에 따른 생산성이 향상되는 효과가 있다.The present invention relates to a column-type package and a method of manufacturing the same. In the related art, the chip pad and the lead are electrically connected to each other by metal wires, so that the thickness of the package is increased by the height of the wire loops, thereby limiting light and short reduction. Was in. In the present invention, the column type package and the method of manufacturing the same are directly connected to the lead and the chip pads without wire bonding using metal wires, and thus have a lighter and thinner effect than conventional metal wires. By excluding the grinding process and the wire bonding process, which have been performed inevitably in the prior art, there is an effect of improving productivity due to airborne savings.

Description

컬럼형 패키지 및 그 제조방법Column type package and its manufacturing method

본 발명은 컬럼형 패키지(COLUMN TYPE PACKAGE) 및 그 제조방법에 관한 것으로, 특히 경박단소화가 가능하고, 제조가 용이한 컬럼형 패키지 및 그 제조방법에 관한 것이다.The present invention relates to a column type package (COLUMN TYPE PACKAGE) and a method for manufacturing the same, and more particularly to a column type package and a method for manufacturing the same, which can be light and short and small.

도1은 종래 컬럼형 패키지의 구성을 보인 종단면도로서, 도시된 바와 같이, 상면에 일정 깊이의 단차부(1a)가 형성된 몸체부(1)와, 그 몸체부(1)의 외주변에 상, 하 방향으로 내설되며 내측에 단턱부(2a)가 형성된 리드(LEAD)(2)와, 상기 단차부(1a)의 내측 저면에 접착제(3)로 부착고정되는 반도체 칩(CHIP)(4)과, 그 칩(4)의 상면에 형성된 다수개의 칩패드(CHIP PAD)(4a)와 상기 리드(2)의 단턱부(2a)를 전기적으로 각각 연결하는 금속와이어(5)와, 상기 칩(4), 금속와이어(5)를 감싸도록 단차부(1a)의 내측에 애폭시로 몰딩되는 몰딩부(6)로 구성되어 있다.1 is a longitudinal cross-sectional view showing a configuration of a conventional columnar package, as shown, the body portion 1 is formed with a stepped portion 1a of a predetermined depth on the upper surface, and the image on the outer periphery of the body portion 1 , A lead (LEAD) 2 which is built in a downward direction and has a stepped portion 2a formed therein, and a semiconductor chip 4 attached to and fixed to the inner bottom surface of the stepped portion 1a with an adhesive 3. And a metal wire 5 electrically connecting a plurality of chip pads 4a formed on the upper surface of the chip 4 and the stepped portions 2a of the lead 2, respectively, and the chip ( 4) It is comprised by the molding part 6 epoxy-molded inside the step part 1a so that the metal wire 5 may be wrapped.

상기와 같이 구성되는 본 발명 컬럼형 패키지의 제조방법을 설명하면 다음과 같다.Referring to the method of manufacturing the columnar package of the present invention configured as described above are as follows.

먼저, 도2a와 같이 다수개의 리드(2)가 외주변에 상, 하 방향으로 내설되도록 사각 봉상의 바(B)를 형성한다. 그런 다음, 도2b와 같이 절단톱(7)을 이용하여 상기 사각봉상의 바(B)를 일정길이로 절단하여 낱개로 분리한다. 이와 같은 상태에서 도2C와 상기 상면에 그라인딩(GRINDING)하여 일정 깊이의 단차부(1a)를 형성한다. 그런 다음, 도 2d와 같이 그 단차부(1a)의 내측 저면에 접착제(3)로 반도체 칩(4)을 고정부착한다. 그런 다음, 도2e와 같이 상기 칩(4)의 상면에 형성된 다수개의 칩패드(4a)와 상기 리드(2)의 내측에 형성된 단턱부(2a)를 금속와이어(5)로 연결하는 와이어본딩(WIRE BONDING)을 실시한다. 그런 다음, 마지막으로 상기 칩(4), 금속와이어(5)를 감싸도록 단차부(1a)의 내측에 애폭시(EPOXY)로 몰딩(MOLDING)하여 몰딩부(6)를 형성함으로서 패키지가 완성된다.First, as shown in FIG. 2A, a plurality of leads 2 are formed in a rectangular bar-shaped bar B so as to be inclined in the up and down directions on the outer periphery. Then, using the cutting saw (7) as shown in Figure 2b by cutting the bar (B) of a rectangular bar in a predetermined length to separate. In such a state, grinding is performed on the upper surface of FIG. 2C and the upper surface to form a stepped portion 1a having a predetermined depth. Then, as shown in FIG. 2D, the semiconductor chip 4 is fixedly attached to the inner bottom surface of the stepped portion 1a with the adhesive 3. Then, as illustrated in FIG. 2E, a plurality of chip pads 4a formed on the upper surface of the chip 4 and the stepped portion 2a formed inside the lead 2 are connected by metal wires 5 ( WIRE BONDING). Then, finally, the package is completed by forming the molding part 6 by molding with EPOXY inside the step portion 1a to surround the chip 4 and the metal wire 5. .

그러나, 상기와 같은 종래 컬럼형 패키지는 반도체 칩(4)의 상면에 형성된 다수개의 칩패드(4a)와 리드(2)를 금속와이어(5)로 연결하는 와이어본딩을 필수적으로 수행하기 때문에 와이어 루프 높이(WIRE LOOP HEIGHT) 만큼 패키지가 커지게 되고, 또한 칩(4)을 안착시키기 위한 단차부(1a)를 형성하는 그라인딩공정을 필수적으로 수행하여야 하고, 와이어 본딩시 다수개의 칩패드(4a)와 리드(2)를 각각 연결하기 때문에 시간이 많이 소요되는 시간의 절감에 따른 생산성을 향상시키는데 한계가 있는 문제점이 있었다.However, the above-described conventional columnar package is a wire loop because it essentially performs wire bonding connecting the plurality of chip pads 4a and the leads 2 formed on the upper surface of the semiconductor chip 4 with the metal wires 5. The package becomes larger by the height of the wire loop height, and a grinding process for forming the stepped portion 1a for seating the chip 4 is essentially performed, and a plurality of chip pads 4a and Since the leads 2 are connected to each other, there is a problem in that there is a limit in improving productivity according to the time-consuming reduction of time.

본 발명의 주목적은 상기와 같은 여러 문제점을 갖지 않는 컬럼현 패키지를 제공함에 있다.An object of the present invention is to provide a column string package that does not have various problems as described above.

본 발명은 다른 목적은 패키지를 경박단소화 시키도록 하는데 적합한 컬럼형 패키지를 제공함에 있다.Another object of the present invention is to provide a columnar package suitable for making the package light and small.

본 발명의 또다른 목적은 그라인딩공정과 와이어본딩공정을 배제하여 공수절감에 따른 생산성을 향상시키도록 하는데 적합한 컬럼형 패키지의 제조방법을 제공함에 있다.Still another object of the present invention is to provide a method of manufacturing a columnar package suitable for improving productivity according to airborne savings by eliminating the grinding process and the wire bonding process.

제1도는 종래 컬럼형 패키지의 구조를 보인 종단면도.1 is a longitudinal sectional view showing the structure of a conventional columnar package.

제2a,2b,2c,2d,2f도는 종래 컬럼형 패키지의 제조방법을 순차적으로 보인 사시도.2a, 2b, 2c, 2d, and 2f are perspective views sequentially showing a method of manufacturing a conventional columnar package.

제3도는 본 발명 컬럼형 패키지의 구조를 보인 종단면도.Figure 3 is a longitudinal sectional view showing the structure of the columnar package of the present invention.

제4a,4b,4c,4d도는 본 발명 컬럼형 패키지의 제조방법을 순차적으로 보인 사시도.Figures 4a, 4b, 4c, 4d is a perspective view sequentially showing the manufacturing method of the columnar package of the present invention.

제5도는 본 발명의 제조방법 중 칩본딩공정을 상세하게 보인 단면도.Figure 5 is a cross-sectional view showing in detail the chip bonding process of the manufacturing method of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

11 : 칩 11a : 칩패드11: chip 11a: chip pad

12 : 몸체 13 : 리드12 body 13 lead

14 : 몰딩부 20 : 프레싱 핀14: molding 20: pressing pin

상기와 같은 본 발명의 목적을 달성하기 위하여 반도체 칩과, 그 칩의 하면에 형성되는 다수개의 칩패드와, 상기 칩의 하부에 설치되는 몸체와, 그 몸체에 내설되며 상기 칩의 칩패드에 각각 연결되는 다수개의 리드와, 상기 칩을 감싸도록 몸체의 상면에 애폭시로 몰딩되는 몰딩부를 구비하여서 구성된 것을 특징으로 하는 컬럼형 패키지가 제공된다.In order to achieve the object of the present invention as described above, a semiconductor chip, a plurality of chip pads formed on the lower surface of the chip, the body is installed in the lower portion of the chip, and are embedded in the body of the chip pad of the chip, respectively A columnar package is provided, comprising a plurality of leads connected to each other, and a molding part formed on the upper surface of the body to wrap the chip with an epoxy.

또한, 다수개의 리드가 내설된 사각봉상의 바 상태에서 절단톱으로 절단하여 낟개로 분리하는 절단공정을 수행하는 단계와, 그 낟개로 분리된 몸체에 내설된 다수개의 리드와 칩의 칩패드가 접속되도록 부착하는 부착공정을 수행하는 단계와, 상기 칩을 감싸도록 애폭시로 몸체의 상면을 몰딩부를 형성하는 몰딩공정을 수행하는 단계의 순서로 제조되는 것을 특징으로 하는 컬럼형 패키지의 제조방법이 제공된다.In addition, a step of performing a cutting process of cutting with a saw saw and separating into four pieces in a bar state of a rectangular bar in which a plurality of leads are installed, and a plurality of leads and chip pads of chips embedded in the four separated bodies are connected. There is provided a method of manufacturing a columnar package, characterized in that the manufacturing step of performing the attaching step of attaching, and the molding step of forming a molding portion on the upper surface of the body with an epoxy so as to surround the chip. do.

이하, 상기와 같이 구성되는 본 발명 컬럼형 패키지 및 그 제조방법을 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to the embodiment of the present invention, the column-type package and the method of the accompanying drawings configured as described above.

도3은 발명 컬럼형 패키지의 구조를 보인 종단면도로서, 도시된 바와 같이, 본 발명 컬럼형 패키지는 반도체 칩(11)과, 그 칩(11)의 하면에 형성되며 칩(11)의 외부로의 연결단자가 되는 다수개의 칩패드(11a)와, 상기 칩(11)의 하부에 설치되며 플라스틱등의 절연제로 된 몸체(12)와, 그 몸체(12)에 내설되며 상기 칩패드(11a)에 연결되는 다수개의 리드(13)와, 상기 칩(11)을 감싸도록 몸체(12)의 상면에 애폭시로 몰딩되는 몰딩부(14)로 구성된다.3 is a longitudinal cross-sectional view showing the structure of the inventive columnar package, as shown, the columnar package of the present invention is formed on the semiconductor chip 11 and the lower surface of the chip 11 and is moved out of the chip 11. A plurality of chip pads 11a serving as connection terminals of the chip pads, a body 12 installed under the chip 11 and made of an insulating material such as plastic, and embedded in the body 12. It is composed of a plurality of leads (13) connected to, and a molding portion 14 that is epoxy molded on the upper surface of the body 12 to surround the chip (11).

상기와 같이 구성되는 본 발명 컬럼형 패키지의 제조방법을 설명하면 다음과 같다.Referring to the method of manufacturing the columnar package of the present invention configured as described above are as follows.

먼저, 도4a와 같이, 일정 길이를 갖는 다수개의 리드(13)가 내설된 사각봉상의 바(B) 상태에서 절단톱(21)으로 절단하여 일정 높이의 낟개로 분리한다. 그런 다음, 도4b와 같이 낟개로 분리된 몸체(12)에 내설된 다수개의 리드(13)와 칩(11)의 칩 패드(11a)가 접속되도록 도4c와 같이 부착한다.First, as shown in Figure 4a, a plurality of leads 13 having a predetermined length is cut with a cutting saw 21 in the bar B-shaped state in which it is built, and separated into nine pieces of a predetermined height. Thereafter, as shown in FIG. 4C, the plurality of leads 13 and the chip pads 11a of the chip 11 inherently connected to the four body 12 are attached as shown in FIG. 4B.

상기와 같은 부착공정은 도5와 같이 주로 열압착방법이 사용되는데 칩(11)의 상면에 형성된 다수개의 칩패드(11a)의 상기 몸체(12)에 내설된 다수개의 리드(13)를 얼라인(ALIGN)한 다음, 상기 리드(13)의 상면에서 프레싱 핀(PRESSING)(20)을 이용하여 초음파를 인가하며 압착한다. 이때 상기 칩패드(11a)와 리드(13)의 접착력을 향상시키기 위하여 접촉부에 열을 가하는 것이 바람직하다.In the attaching process as described above, a thermocompression method is mainly used as shown in FIG. 5 to align the plurality of leads 13 installed in the body 12 of the plurality of chip pads 11a formed on the upper surface of the chip 11. After ALIGN, ultrasonic pressure is applied to the upper surface of the lead 13 by using a pressing pin 20. At this time, it is preferable to apply heat to the contact portion in order to improve the adhesion between the chip pad (11a) and the lead (13).

상기와 같이 부착공정을 수행한 다음, 도4d와 같이 상기 칩(11)을 감싸도록 애폭시로 몸체(12)의 상면을 몰딩부(14)를 형성하는 몰딩공정을 실시하여 패키지를 완성한다.After the attaching process as described above, as shown in FIG. 4d, the molding process is performed to form the molding unit 14 on the upper surface of the body 12 by epoxy so as to surround the chip 11 to complete the package.

이상에서 상세히 설명한 바와 같이 본 발명 컬럼형 패키지 및 그 제조방법은 금속와이어를 이용하여 와이어본딩을 실시하지 않고 리드와 칩패드를 직접 연결하므로, 종래의 금속와이어를 사용하는 경우보다 경박단소화되는 효과가 있고, 또한, 종래에 필수적으로 수행하던 그라인딩공정과 와이어본딩공정을 배제함으로서 공수절감에 따른 생산성이 향상되는 효과가 있다.As described in detail above, the column-type package and a manufacturing method of the present invention are directly connected to the lead and the chip pad without wire bonding using metal wires, and thus are lighter and shorter than those of conventional metal wires. In addition, by excluding the grinding process and the wire bonding process, which is essentially performed in the related art, there is an effect of improving productivity due to airborne savings.

Claims (4)

반도체 칩과, 그 칩의 하면에 형성되는 다수개의 칩패드와, 상기 칩의 하부에 설치되는 몸체와, 그 몸체에 내설되며 상기 칩의 칩패드에 각각 연결되는 다수개의 리드와, 상기 칩을 감싸도록 몸체의 상면에 애폭시로 몰딩되는 몰딩부를 구비하여서 구성된 것을 특징으로 하는 컬럼형 패키지.A semiconductor chip, a plurality of chip pads formed on a lower surface of the chip, a body installed under the chip, a plurality of leads embedded in the body and respectively connected to the chip pads of the chip, and surrounding the chip A columnar package, characterized in that comprising a molding portion that is epoxy molded on the upper surface of the body. 다수개의 리드가 내설된 사각봉상의 바 상태에서 절단톱으로 절단하여 낟개로 분리하는 절단공정을 수행하는 단계와, 그 낟개로 분리된 몸체에 내설된 다수개의 리드와 칩의 칩패드가 접속되도록 부착하는 부착공정을 수행하는 단계와, 상기 칩을 감싸도록 애폭시로 몸체의 상면을 몰딩하여 몰딩부를 형성하는 몰딩공정을 수행하는 단계의 순서로 제조되는 것을 특징으로 하는 컬럼형 패키지의 제조방법.Performing a cutting process of cutting with a saw saw and separating into four pieces in a bar state of a rectangular bar in which a plurality of leads are installed, and attaching the plurality of leads and chip pads of the chips connected to the four separated bodies to be connected. And performing a molding process of forming an molding part by molding an upper surface of the body with an epoxy so as to surround the chip. 제2항에 있어서, 상기 부착공정은 칩의 상면에 형성된 다수개의 칩패드에 상기 몸체에 내설된 다수개의 리드를 얼라인한 다음, 리드의 상면에서 프레싱 핀을 이용하여 초음파를 인가하며 압착하는 것을 특징으로 하는 컬럼형 패키지의 제조방법.The method of claim 2, wherein the attaching process aligns a plurality of leads in the body to a plurality of chip pads formed on an upper surface of the chip, and then compresses the ultrasonic waves using a pressing pin on the upper surface of the lead. Method of producing a columnar package. 제3항에 있어서, 상기 칩패드와 리드의 접착력을 향상시키기 위하여 접촉부에 열을 가하는 것을 특징으로 하는 패키지의 제조방법.The method of claim 3, wherein heat is applied to a contact portion to improve adhesion between the chip pad and the lead.
KR1019960066626A 1996-12-17 1996-12-17 Column-type package and its fabrication method KR100214533B1 (en)

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