KR0155204B1 - Zetting type of plating solution for plating equipment - Google Patents

Abstract

The present invention relates to a plating treatment apparatus for performing a pretreatment, plating, and post-treatment process in a uniform process by using a plurality of block-shaped jig (generally, a large plated object) as one jig group. In particular, the electroplating treatment is performed while spraying the plating liquid onto the plated object from a plurality of plating liquid injection nozzles, and the plating liquid spraying plating apparatus which makes uniform plating be performed by swinging the plated object or the nozzle up and down. will be.

Conventional plating liquid jet plating apparatuses use a plurality of block-like plated materials (usually bulky) as one to-be-plated object group to deposit the plating liquid at a plating liquid nozzle which has a fixed angle and position. It is a fact that relatively high-speed plating is possible by electroplating by spraying the object to be plated, but there is a problem in that the thickness of the plated layer is difficult to be managed when plating the plate-shaped object.

In the present invention, a plurality of block-like plated objects are arranged in one jig group in a plating treatment tank, and the jig group is swinged up and down to position the relationship between the plated object and the nozzle. The plating liquid stream is uniformly sprayed on the plated object by changing the thickness of the plating layer so that even the part where the plating layer is difficult to be easily contacted with the plating solution so that the thickness of the plating layer is uniformly formed.

Description

Plating solution spray plating device

1 is a longitudinal cross-sectional schematic diagram of a conventional device.

FIG. 2 is a schematic cross sectional view taken along line II ′ of FIG. 1.

3 is a longitudinal cross-sectional schematic diagram of the present invention.

4 is a side action diagram of the present invention, (a) shows a state in which the vertical bar is raised, (b) shows a state in which the vertical bar is lowered.

* Explanation of symbols for main parts of the drawings

1: foundation 2: plating treatment tank

2 ': bottom wall 2: main wall

3: recovery container 4: communication tube

5: pump 6a, 6b: pipe

7a, 7b: Riser pipe

8: Nozzle 9: Jig

10,10 ', 10: plated material 11a, 11b: anode

12a, 12b: Vertical bar 13a, 13b: Roller

14a, 14b: eccentric cam 15: motor

16: axis 17: lifting frame

PS: Plating solution T: Jig mounting area

In the present invention, a plurality of block-shaped jig (usually a massive plated object) is used as one jig group to perform a pretreatment, plating, and post-treatment process in an integrated process. The present invention relates to a plating treatment apparatus to be carried out by a plurality of plating liquids. In particular, in the electroplating process while spraying a plating liquid onto a plated object from a plurality of plating liquid injection nozzles, uniform plating is achieved by swinging the plated object or the nozzle up and down. The present invention relates to a plating liquid jet plating apparatus.

What is known as a plating liquid injection plating apparatus so far is as follows. In some of these apparatuses, a plurality of plating liquid injection nozzles are arranged on both sides of a sheet-like plated object suspended in a plating treatment tank, and plating is performed while spraying the plating liquid toward the plating object from these nozzles.

In another spray processing apparatus, a plating solution is supplied to a nozzle by a pump from a separate storage tank provided below the plating processing tank so that the plating liquid injected in the plating processing flow flows down into the storage tank. (See Japanese Patent Application Laid-Open No. 59-166697.) In addition, an apparatus using the above-described plating liquid jet processing apparatus, which is used only for plating treatment of a plate-like plated object, for a block-shaped plated object is already known. (See Japan Patent Publication No. 4-59400)

However, such conventional plating liquid jet plating apparatus has a plurality of plated objects 10, 10 ', 10 as one group of plated objects as shown in FIGS. 1 and 2 of the drawings. In the plating liquid spray nozzle 8 having a fixed position, electroplating is performed by spraying the plating liquid PS onto the plating targets 10, 10 'and 10, so that relatively high speed plating is possible. In fact, there is a problem that the thickness management of the plating layer is difficult when plating the plated object of concave-convex shape.

That is, the management of the plating time with respect to the plating thickness is the completion of the plating time at the time when the minimum plating thickness portion reaches the management standard among the entire surfaces (front surface of the plated objects 10, 10 ', 10). This minimum plating thickness portion is determined by the positional relationship between the contact of the plating liquid PS and the anodes 11a and 11b of the plating treatment tank 2, so that the metal constituting the plating layer is difficult to deposit. In another easy-to-precipitate portion during the plating time until the plated layer thickness of this portion is reached to the management standard, a plating thickness of as much as 2 to 5 times the minimum plating thickness is formed, so that plating is completed. There was a problem in that ') 10 had a very non-uniform plating thickness as a whole.

In the present invention, a plurality of massive plated objects are arranged in one jig group within the plating treatment tank, and the jig group is swinged up and down so that the positional relationship between the plated object and the nozzle is changed so as to change the plating liquid. The flow is uniformly sprayed on the plated object so that even the difficult part of the plating layer is easily contacted with the plating solution so that the thickness of the plating layer is uniformly formed. This will be described in detail with reference to the accompanying drawings.

3 is a longitudinal cross-sectional schematic diagram of the present invention, and FIG. 4 is a side action diagram of the present invention, wherein the plating treatment tank 2 is composed of a bottom wall 2 'and a main wall 2 having an open top, and the foundation 1 A plating solution recovery container 3 (overflow tank) is formed outside the upper part of the circumferential wall 2, and the plating solution PS is accommodated in the plating treatment tank 2 and the recovery container 3. have. The recovery container 3 is communicated with a pair of pipes 6a and 6b and the communication tube 4 provided in the plating treatment tank 2, and a pump 5 is provided in the middle of the communication tube 4.

Each of the pipes 6a and 6b is provided with a plurality of riser pipes 7a and 7b communicating in the vertical direction at regular intervals, and a jig mounting area T in the vertical center of both riser pipes 7a and 7b. ) To be plated 10, 10 'and 10 to be installed in a frame-shaped jig 9 to which a negative electrode is connected, and an anode 11a (outside the riser pipes 7a and 7b). 11b) is arrange | positioned, and each riser pipe 7a and 7b is provided with the some nozzle 8 so that the injection direction may face the jig | tool mounting area T. As shown in FIG.

A pair of vertical bars 12a and 12b are provided on the outside of the plating treatment tank 2, and rollers 13a and 13b are rotated at the lower end of the plating treatment tank 2 to the shaft 16 of the motor 15. A pair of eccentrically installed eccentric cams 14a and 14b are installed to rotate in contact with the rollers 13a and 13b, and a lifting frame 17 is fixedly installed on the upper ends of the vertical bars 12a and 12b. The jig 9 is fixed to the lifting frame 17.

In the figure, reference numeral 18 is a bracket for guiding the lifting and lowering of the vertical bars 12a and 12b.

In the present invention, when the pump 5 and the motor 15 are driven by using a separate power source, the plating liquid PS in the recovery container 3 is pumped through the pipe 4 by the operation of the pump 5. By spraying the nozzles 8 through the pipes 6a and 6b and the riser pipes 7a and 7b so as to collide with the surface of the plated objects 10, 10 'and 10 in the fixture mounting region T. It is sprayed around the to-be-plated object 10, 10 ', 10, and it stirs the plating liquid PS in the plating process tank 2, and a pair of pairs provided in the shaft 16 by operation of the motor 15 are carried out. As the eccentric cams 14a and 14b are rotated, the vertical bars 12a and 12b are raised and lowered by the rollers 13a and 13b contacted and rotated, and the lifting frame 17 installed at the upper side is raised and lowered. Since the jig 9 fixed to the lifting frame 17 is lifted up and down, the plated objects 10, 10 'and 10 fixed to the jig 9 also perform the same lifting operation so that the nozzle 8 The plating liquid PS ejected from It collides evenly with the surface of the iron shape to minimize the plating thickness variation between the minimum plating layer and the maximum plating layer, as well as to reduce the time to reach the plating thickness management standard by 20 to 50% compared to the conventional plating apparatus. In addition, by suppressing excessive plating layer formation of the maximum plating layer, the uniformity of plating deposition can be improved by at least 50% or more, thereby reducing the overall plating treatment time by 15 to 20%.

Here, the plating liquid PS in the recovery container 3 is continuously supplied to the plating treatment tank 2 by the pump 5 until the plating treatment is completed. Since the PS) is buffered in the initial state, it overflows to the upper portion of the plating vessel 2 and is recovered into the recovery vessel 3 again, and this is repeatedly performed to be supplied into the plating vessel 2. You lose.

On the other hand, on the drawing, the jig 9 is fixed to the elevating frame 17, so that the plated objects 10, 10 ', 10 are lifted, but the plated objects 10, 10' ( When the elevating is difficult due to the structural characteristics of 10), the nozzle 8 may be lifted by fixing the jig 9 in the plating treatment tank 2 and fixing the riser pipes 7a and 7b to the lifting frame 17. have.

As described above, the present invention minimizes the plating thickness variation between the minimum plating layer and the maximum plating layer by uniformly contacting the plating liquid regardless of the uneven shape of the plated material, thereby uniformly forming the plating layer, and plating thickness management. By shortening the plating time required to reach the standard, it saves manpower and work time, and can provide high quality plating products.

Claims (1)

The plated object 10, 10 ′, 10 is fixed to the inner center of the plating treatment tank 2 in which the recovery container 3 is installed outside the upper portion and the plating solution PS is filled therein with the jig 9. In the plating liquid spraying plating apparatus in which the nozzles 8 provided on both sides of the sprayer spray the plating liquid PS, the plating liquid spraying plating apparatus for plating the object to be plated 10, 10 ', 10 is provided. A pair of eccentric cams (14a) and (14b) provided on the shaft (16) of the (15) is provided, and vertical bars (Sliding by rollers (13a) (13b) on top of the eccentric cams (14a) (14b) ( 12a) 12b and a lifting frame 17 on which the jig 9 is fixed to the upper ends of the vertical bars 12a and 12b are installed to provide the eccentric cams 14a and 14b according to the operation of the motor 15. Plating liquid injection plating apparatus in which the plated object (10, 10 ', 10) is swinging up and down by a rotational movement.