KR0129716Y1 - Pin type shipping tube of semiconductor - Google Patents
Pin type shipping tube of semiconductor Download PDFInfo
- Publication number
- KR0129716Y1 KR0129716Y1 KR2019950024570U KR19950024570U KR0129716Y1 KR 0129716 Y1 KR0129716 Y1 KR 0129716Y1 KR 2019950024570 U KR2019950024570 U KR 2019950024570U KR 19950024570 U KR19950024570 U KR 19950024570U KR 0129716 Y1 KR0129716 Y1 KR 0129716Y1
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- South Korea
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- tube
- pin
- semiconductor device
- hole
- horizontal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
본 고안에 의한 반도체 소자의 핀형 적재형 튜브는 직육면체 형태이되, 하면은 요철모양으로 형성되고, 일단 또는 양단에는 양측면을 수평관통하는 수평관통홀이 형성되는 튜브와, 원판형태로 형성된 핀머리와, 핀머리의 일면에 형성된 수평관통홀에 삽탈하게 되는 삽입기둥을 구비하는 핀으로 이루어진다.The pin-shaped stacked tube of the semiconductor device according to the present invention has a rectangular parallelepiped shape, the lower surface is formed in an uneven shape, one end or both ends of the tube is formed with a horizontal through hole horizontally through both sides, a pin head formed in the shape of a disc, It consists of a pin having an insertion column to be inserted into the horizontal through-hole formed on one surface of the pin head.
Description
제1도는 종래의 반도체 소자의 핀형 적재튜브의 분해 사시도.1 is an exploded perspective view of a fin type loading tube of a conventional semiconductor device.
제2도는 본 고안에 의한 반도체 소자의 핀형 적재튜브를 도시한 도면.2 is a view showing a fin-shaped loading tube of a semiconductor device according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10,20 : 튜브 11 : 수직관통홀10,20: tube 11: vertical through hole
12,22 : 핀머리 13,23 : 삽입기둥12,22: Pin head 13,23: Insertion pillar
14,24 : 핀 21-1 : 오목홈14,24: pin 21-1: concave groove
21 : 수평관통홀21: horizontal through hole
본 고안은 반도체 소자의 핀형 적재튜브(pin type shipping tube)에 관한 것으로, 특히 튜브(tube)에 반도체 소자를 용이하게 로딩(loading) 또는 언로딩(unloading)시키는 것에 적당하도록 한 반도체 소자의 핀형 적재튜브에 관한 것이다. 반도체 제조에서 제조가 완료된 반도체 소자는 어셈블리 트림 폼(Assembly Trim Form)공정을 거치게 되는데, 반도체 소자는 적재튜브에 차례로 적재되어 보관되거나 이송된다. 이때, 적재튜브는 반도체 소자가 적재되는 튜브와, 튜브를 개폐시키기 위한 플러그(flug) 또는 핀(pin)으로 이루어지고, 따라서 적재튜브는 플러그형과 핀형으로 구분될 수 있다.The present invention relates to a pin type shipping tube of a semiconductor device, and in particular, a pin type loading of a semiconductor device suitable for easily loading or unloading a semiconductor device into a tube. It is about a tube. In the semiconductor manufacturing, the semiconductor device, which has been manufactured, is subjected to an assembly trim form process. The semiconductor device is sequentially loaded and stored or transported in a loading tube. At this time, the loading tube is composed of a tube on which the semiconductor element is loaded, and a plug or pin for opening and closing the tube, and thus the loading tube may be divided into a plug type and a pin type.
제1도는 종래의 반도체 소자의 핀형 적재튜브의 분해 사시도이다. 이하 첨부된 도면을 참고로 종래의 반도체 소자의 핀형 적재튜브의 구성 및 동작을 설명하면 다음과 같다.1 is an exploded perspective view of a fin type mounting tube of a conventional semiconductor device. Hereinafter, with reference to the accompanying drawings, the configuration and operation of the conventional pin-shaped loading tube of a semiconductor device are as follows.
종래의 반도체 소자의 핀형 적재튜브는 제 1 도에 도시된 바와 같이, 직육면체 형태이되, 하면은 요철모양으로 형성되고, 일단 또는 양단에는 상면과, 하면의 요철모양에서 돌출부에 수직관통되어 형성된 수직관통홀(11)이 형성되어 있는 튜브(10)와, 튜브의 수직관통홀에 대응되어 튜브를 개폐시키기 위하여 원판형태로 형성된 핀머리(12)와, 핀머리의 일면에 형성된 삽입기둥(13)을 구비하는 핀(14)으로 이루어진다.As shown in FIG. 1, the fin-shaped loading tube of the conventional semiconductor device has a rectangular parallelepiped shape, the lower surface of which is formed in an uneven shape, and the vertical through-hole formed at one end or both ends by vertically penetrating the protrusion at the upper surface and the unevenness of the lower surface. A tube 10 having a hole 11 formed therein, a pin head 12 formed in a disc shape to open and close the tube corresponding to a vertical through hole of the tube, and an insertion column 13 formed on one surface of the pin head. It consists of the pin 14 provided.
즉, 종래의 반도체 소자의 핀형 적재튜브는 핀의 삽입기둥을 튜브의 수직관통홀에 삽탈시켜서 튜브를 개폐하였으며, 핀을 튜브에서 탈착시킬때에는 핀제거용 치구를 이용한다.That is, in the conventional pin-shaped loading tube of the semiconductor device, the insertion and insertion of the pin into the vertical through-hole of the tube to open and close the tube, when the pin is removed from the tube using a pin jig for removal.
그러나 종래의 반도체 소자의 핀형 적재튜브에서는 핀을 튜브의 상면에서 하면으로, 즉 위에서 아래로 삽입하기 때문에 튜브의 상면에는 핀의 핀머리가 돌출하게 되며, 이로 인하여 반도체 소자를 적재튜브에 로딩 또는 언로딩시키는 장비에서 튜브 상면에 돌출된 핀머리가 장비에 걸리게 되며, 이는 적재튜브에 반도체 소자에 로딩 또는 언로딩의 작업시간이 지연되는 원인이 되었다.However, in the conventional fin-shaped loading tube of the semiconductor device, the pin is inserted from the upper surface of the tube to the lower surface, that is, from the top to the bottom, so that the pin head of the pin protrudes from the upper surface of the tube, thereby loading or unloading the semiconductor element into the loading tube. In the loading equipment, the pin head protruding from the upper surface of the tube is caught by the equipment, which causes a delay in the loading or unloading time of the semiconductor element in the loading tube.
본 고안은 이러한 문제를 해결하기 위하여 안출된 것으로서, 반도체 소자의 핀형 적재형 튜브의 구조를 개선하여 용이하게 반도체 소자의 로딩 또는 언로딩 작업이 실시되도록 하는 것이 그 목적이다. 본 고안에 의한 반도체 소자의 핀형 적재형 튜브는 직육면체 형태이되, 하면은 요철모양으로 형성되고, 일단 또는 양단에는 양측면을 수평관통하는 수평관통홀이 형성되는 튜브와, 원판형태로 형성된 핀머리와, 핀머리의 일면에 형성되어 수평관통홀에 삽탈하게 되는 삽입기둥을 구비하는 핀으로 이루어진다. 제2도는 본 고안에 의한 반도체 소자의 핀형 적재튜브를 도시한 도면으로, 제2도의 (가)는 본 고안에 의한 반도체 소자의 핀형 적재튜브의 동작사시도이고, 제2도의 (2)는 본 고안에 의한 반도체 소자의 핀형 적재튜브의 정면도이다. 이하 첨부된 도면을 참고로 본 고안에 의한 반도체 소자의 핀형 적재튜브의 구성 및 동작을 설명하면 다음과 같다.The present invention has been made to solve such a problem, and its object is to improve the structure of the fin-shaped stacked tube of the semiconductor device so that the loading or unloading operation of the semiconductor device can be easily performed. The pin-shaped stacked tube of the semiconductor device according to the present invention has a rectangular parallelepiped shape, the lower surface is formed in an uneven shape, one end or both ends of the tube is formed with a horizontal through hole horizontally through both sides, a pin head formed in the shape of a disc, It is formed of a pin having an insertion column formed on one surface of the pin head to be inserted into the horizontal through-hole. 2 is a view showing the fin-shaped loading tube of the semiconductor device according to the present invention, Figure 2 (a) is an operation perspective view of the fin-shaped loading tube of the semiconductor device according to the present invention, Figure 2 (2) is the present invention It is a front view of the fin-shaped loading tube of the semiconductor element by FIG. Referring to the configuration and operation of the pin-shaped loading tube of the semiconductor device according to the present invention with reference to the accompanying drawings as follows.
본 고안에 의한 반도체 소자의 핀형 적재튜브에서 튜브(20)는 제2도의 (가)에 도시된 바와 같이, 직육면체 형태이되, 하면은 요철모양으로 형성되고, 일단 또는 양단에는 양측면을 수평관통하는 수평관통홀(21)이 형성되어 있다.In the fin-shaped loading tube of the semiconductor device according to the present invention, the tube 20 has a rectangular parallelepiped shape, as shown in (a) of FIG. 2, and the bottom surface is formed in an uneven shape, and horizontally penetrates both sides at one end or both ends. The through hole 21 is formed.
이때, 튜브(20)의 양측면 상단에 오목홈(20-1)을 대칭적으로 형성시키고, 일측의 오목홈의 저면에서, 반대측의 오목홈의 저면을 수평관통하여 수평관통홀(21)을 형성시키기도 한다.At this time, the concave grooves 20-1 are formed symmetrically on the upper ends of both sides of the tube 20, and the bottom surface of the concave grooves on one side, through the bottom surface of the concave grooves on the opposite side to form a horizontal through-hole 21 Sometimes.
그리고 본 고안에 의한 반도체 소자의 핀형 적재튜브는 제 2 도에 (나)에 도시된 바와 같이, 튜브(20)의 수평관통홀(21)에 대응되어 튜브를 개폐시키기 위해서는 원판형태로 형성된 핀머리(22)와, 핀머리의 일면에 형성되어 수평관통홀에 삽탈하게 되는 삽입기둥(23)을 구비하는 핀(24)의 삽입기둥을 튜브의 수평관통홀에 삽입시키거나 핀제거용 치구를 이용하여 탈착시킨다.And the fin-shaped loading tube of the semiconductor device according to the present invention is pin head formed in the shape of a disc to open and close the tube corresponding to the horizontal through-hole 21 of the tube 20, as shown in Figure 2 (b) (22) and the insertion column of the pin 24 having an insertion column 23 formed on one surface of the pin head to be inserted into the horizontal through hole to be inserted into the horizontal through hole of the tube or using a pin jig. To remove.
본 고안에 의한 반도체 소자의 핀형 적재튜브에서는 튜브에 핀을 측면에 삽입시키거나 탈착시키므로 반도체 소자를 적재튜브에 로딩 또는 언로딩시키는 장비에서 핀머리가 장비에 걸리는 일이 발생하지 않게 되며, 또한 튜브의 양측면 상단에 오목홈을 형성하고, 오목홈에 저면을 수평관통하는 수평관통홀을 형성시키면 이러한 효과 즉, 핀머리가 장비에 걸리지 않게 되는 효과가 더욱 향상된다.In the pin-shaped loading tube of the semiconductor device according to the present invention, the pin head is inserted into or detached from the side of the tube so that the pin head is not caught by the equipment in the device for loading or unloading the semiconductor element into the loading tube. Forming concave grooves on both sides of the upper side, and forming a horizontal through-hole through the bottom surface in the concave grooves such effects, that is, the effect that the pin head is not caught on the equipment is further improved.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950024570U KR0129716Y1 (en) | 1995-09-13 | 1995-09-13 | Pin type shipping tube of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950024570U KR0129716Y1 (en) | 1995-09-13 | 1995-09-13 | Pin type shipping tube of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970015318U KR970015318U (en) | 1997-04-28 |
| KR0129716Y1 true KR0129716Y1 (en) | 1999-02-01 |
Family
ID=19423164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950024570U KR0129716Y1 (en) | 1995-09-13 | 1995-09-13 | Pin type shipping tube of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0129716Y1 (en) |
-
1995
- 1995-09-13 KR KR2019950024570U patent/KR0129716Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970015318U (en) | 1997-04-28 |
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