KR0126456Y1 - Grounding device of a modulator - Google Patents
Grounding device of a modulatorInfo
- Publication number
- KR0126456Y1 KR0126456Y1 KR2019950022628U KR19950022628U KR0126456Y1 KR 0126456 Y1 KR0126456 Y1 KR 0126456Y1 KR 2019950022628 U KR2019950022628 U KR 2019950022628U KR 19950022628 U KR19950022628 U KR 19950022628U KR 0126456 Y1 KR0126456 Y1 KR 0126456Y1
- Authority
- KR
- South Korea
- Prior art keywords
- modulator
- grounding device
- circuit board
- bottom cover
- static electricity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/655—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth brace
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
본 고안은 모듈레이터의 접지장치를 개시한다. 개시된 본 고안 모듈레이터의 접지장치는, 판부재의 상측면에는 모듈레이터가 설치된 회로기판의 일측에 형성된 걸림돌기에 걸림 고정되도록 걸림공을 갖는 걸림부가 절곡형성되고, 그 하측에는 버텀커버에 접지되도록 소정 각도 절곡형성된 접지부가 형성되어, 판부재에 의해 모듈레이터에 발생되는 정전기가 버텀커버로 접지된다.The present invention discloses a grounding device of a modulator. In the disclosed grounding device of the modulator, the upper side of the plate member is bent to form a locking portion having a locking hole to be fixed to the locking projection formed on one side of the circuit board on which the modulator is installed, the lower side is bent a predetermined angle to ground to the bottom cover The ground portion formed is formed, and the static electricity generated in the modulator by the plate member is grounded to the bottom cover.
따라서, 모듈레이터에 발생되는 정전기가 회로기판을 경유하지 않고 직접 버텀커버로 전달되는 구조로 제거되므로써 회로기판을 보호할 수 있게 된다. 또한. 구조가 단순화되어 작업성이 향상될 뿐만 아니라 생산성이 향상되는 이점이 있다.Therefore, the static electricity generated in the modulator is removed by the structure that is directly transferred to the bottom cover without passing through the circuit board, thereby protecting the circuit board. Also. The structure is simplified to improve workability as well as increase productivity.
Description
제1도는 종래 모듈레이터의 접지장치를 도시한 분리 사시도.1 is an exploded perspective view showing a grounding apparatus of a conventional modulator.
제2도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 분리 사시도.Figure 2 is an exploded perspective view showing a grounding device of the modulator according to the present invention.
제3도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 일부 종단면도.Figure 3 is a partial longitudinal cross-sectional view showing a grounding device of the modulator according to the present invention.
제4도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 정면도.Figure 4 is a front view showing a grounding device of the modulator according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
50 : 판부재 51 : 걸림부50: plate member 51: locking part
51a : 나사공 51b : 삽입공51a: screw hole 51b: insertion hole
51c : 걸림공 52 : 접지부51c: engaging hole 52: grounding portion
60 : 모듈레이터 70 : 회로기판60: modulator 70: circuit board
80 : 버텀커버 90 : 메인새시80: bottom cover 90: main chassis
본 고안은 모듈레이터(modulator)의 접지장치에 관한 것으로, 더욱 상세하게는 모듈레 이터에 발생되는 정전기를 제거할 수 있는 모듈레이터의 접지장치에 관한 것이다.The present invention relates to a grounding device of the modulator (modulator), and more particularly to a grounding device of the modulator that can remove the static electricity generated in the modulator.
종래 모듈레이터의 접지장치(10)는, 제1도에 도시된 바와 같이. 모듈레이터(30)의 상측을 소정폭으로 감싸는 홀더부(12)와, 이 홀더부(12)를 데크(미도시)에 지지시키는 지지부(14)로 대별된다.Grounding device 10 of the conventional modulator, as shown in FIG. The holder part 12 which wraps the upper side of the modulator 30 by predetermined width, and the support part 14 which support this holder part 12 to a deck (not shown) are divided roughly.
먼저. 홀더부(12)의 상측면에는 탄성력을 갖도록, 이를 소정크기로 절개한 후 하방으로 절곡형성한 탄성편(12a)이 형성된다. 이 탄성편(12a)은 회로기판(20)에 설치된 모듈레이터(30)를 하방으로 가압하여 접지장치(10)가 모듈레이터(30)의 일측에 견고하게 위치된다. 그리고, 홀더부(12)에는 그 일단이 모듈레이터(30)에 접지되고. 타단이 홀더부(12)에 점용접(spot welding)되는 접지플레이트(12b)가 형성된다.first. On the upper side of the holder portion 12, the elastic piece 12a is formed by cutting it down to a predetermined size so as to have an elastic force and then bending it downward. The elastic piece 12a presses down the modulator 30 provided on the circuit board 20 so that the grounding device 10 is firmly positioned on one side of the modulator 30. One end of the holder portion 12 is grounded to the modulator 30. The ground plate 12b is spot welded at the other end to the holder 12.
또한. 지지부(14)의 일측에는 도면에 도시되지 않았으나 데크의 나사공에 나사(31)를 통해 나사 고정되도록 나사홈(14a)이 형성된다.Also. Although not shown in the drawing on one side of the support 14, a screw groove 14a is formed to be screwed through the screw 31 in the threaded hole of the deck.
그러나, 이와 같이 구성된 모듈레이터의 접지장치는, 모듈레이터에 발생되는 정전기를 제거하기 위하여 접지장치에 점용접으로 접지 플레이트를 형성하여야 하므로 작업성이 저하될 뿐만 아니라 이로 인하여 생산성이 저하되는 문제점이 있었다.However, since the grounding device of the modulator configured as described above has to form a ground plate by spot welding on the grounding device in order to remove the static electricity generated in the modulator, there is a problem in that workability is lowered and productivity is lowered.
본 고안은 상술한 바와 같은 문제점을 해결하기 위하여 안출된 것으로서, 모듈레이터에 발생되는 정전기가 버텀커버(bottom cover)로 직접 전달되므로써 구조가 단순화되어 작업성이 향상될 뿐만 아니라 메인회로기판의 손상을 방지할 수 있는 모듈레이터의 접지장치를 제공하는데 있다.The present invention is devised to solve the above problems, the static electricity generated in the modulator is transferred directly to the bottom cover (simplified structure), thereby improving workability and preventing damage to the main circuit board. It is to provide a grounding device of a modulator capable of doing so.
이와 같은 목적은, 모듈레이터에 발생되는 정전기를 제거하기 위한 접지편에 있어서. 판부재의 상측면에는 상기 모듈레이터가 설치된 회로기판의 일측에 형성된 걸림돌기에 걸림고정되도록 걸림공을 갖는 걸림홈이 절곡형성되고, 그 하측에는 버텀커버에 접지되도록 소정각도 절곡형성된 접지부가 형성되어. 상기 판부재에 의해 상기 모듈레이터에 발생되는 정전기가 상기 버텀커버로 접지되도록 된 모듈레이터의 접지장치를 제공함으로써 달성될 수 있다.This purpose is to provide a grounding piece for removing static electricity generated in the modulator. The upper surface of the plate member is bent to form a locking groove having a locking hole to be fixed to the locking projection formed on one side of the circuit board, the modulator is installed, the lower portion is formed with a grounding portion bent at a predetermined angle to ground to the bottom cover. The static electricity generated in the modulator by the plate member can be achieved by providing a grounding device of the modulator to be grounded to the bottom cover.
본 고안 모듈레이터의 접지장치에 의하면, 접지구조가 단순화되어 작업성이 향상될 뿐만 아니라 이로 인하여 생산성이 향상되어 단가가 절감되는 효과를 얻을 수 있다.According to the grounding device of the modulator of the present invention, the grounding structure is simplified to improve the workability, and as a result, the productivity can be improved to reduce the unit cost.
또한. 접지 경로가 메인회로기판을 경유하지 않고 모듈레이터에 발생되는 정전기가 접지 장치를 통해 버텀커버로 전달되므로써 정전기로 인한 메인회로기판의 파손을 방지할 수 있는 이 점이 있다.Also. Since the static path generated in the modulator without the ground path passing through the main circuit board is transferred to the bottom cover through the grounding device, the main circuit board may be prevented from being damaged by the static electricity.
이하. 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명한다.Below. Preferred embodiments will be described in detail with reference to the accompanying drawings.
제2도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 분리 사시도이고, 제3도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 일부 종단면도이며. 제4도는 본 고안에 따른 모듈레이터의 접지장치를 도시한 정면도이다.Figure 2 is an exploded perspective view showing a grounding device of the modulator according to the present invention, Figure 3 is a partial longitudinal cross-sectional view showing the grounding device of the modulator according to the present invention. Figure 4 is a front view showing a grounding device of the modulator according to the present invention.
이에 도시된 바와 같이 모듈레이터의 접지장치는, 판부재(50)로 이루어지며, 이 판부재 (50)는 걸림부(51)와 접지부(52)로 대별된다.As shown in the figure, the grounding device of the modulator is composed of a plate member 50, and the plate member 50 is roughly divided into a catching part 51 and a grounding part 52.
우선. 걸림부(51)는 그 상측면에 단자(61)가 형성된 모듈레이터(60)의 일측면에 나사 고정되도록 나사공(51a)이 형성되며, 이와 인접되는 그 일측면에는 모듈레이터(60)의 단자(61)가 삽입되도록 삽입공(51b)이 형성된다. 그리고. 걸림부(51)의 하측에는 회로기판(70)의 일측에 형성된 걸림돌기(71)에 걸림 고정되도록 걸림공(51c)이 형성된다.first. The engaging portion 51 is formed with a screw hole 51a to be screwed to one side of the modulator 60 on which the terminal 61 is formed on the upper side thereof, and on one side thereof adjacent to the terminal 51 of the modulator 60. The insertion hole 51b is formed so that 61 is inserted. And. A locking hole 51c is formed at the lower side of the locking portion 51 so as to be locked to the locking protrusion 71 formed at one side of the circuit board 70.
또한, 접지부(52)는 전술한 걸림부(51)로 부터 하방으로 소정 각도 절곡형성되며, 그 끝단이 버텀커버(80)에 접지되도록 형성된다. 그리고. 미설명부호 40은 안테나보드를 도시한 것이다.In addition, the ground portion 52 is bent downward by a predetermined angle from the above-described locking portion 51, the end is formed to be grounded to the bottom cover (80). And. Reference numeral 40 shows an antenna board.
이와 같이 구성된 본 고안에 따른 모듈레이터의 접지장치는 제2도에 도시된 바와 같이, 걸림부(51)에 형성된 삽입공(51b)에 모듈레이터(60)의 단자(61)를 일치시킨 후. 모듈레이터(60)의 단자(61)를 삽입공(51b)에 삽입시키게 된다.The grounding device of the modulator according to the present invention configured as described above, as shown in Figure 2, after matching the terminal 61 of the modulator 60 with the insertion hole (51b) formed in the engaging portion (51). The terminal 61 of the modulator 60 is inserted into the insertion hole 51b.
이 때, 걸림부(51)의 상측면이 모듈레이터(60)의 일측면에 밀착되게 된다. 동시에, 걸림부(51)의 걸림공(51c)에 회로기판(70)의 걸림돌기(71)가 삽입되게 된다.At this time, the upper surface of the locking portion 51 is in close contact with one side of the modulator 60. At the same time, the engaging projection 71 of the circuit board 70 is inserted into the engaging hole 51c of the engaging portion 51.
그리고. 접지부(52)는 제3도에 도시된 바와 같이, 메인 새시(90)를 관통해 버텀커버 (80)에 접지되게 되고, 걸림부(51)의 나사공(51a)에 나사고정을 시킴으로써 모듈레이터(60)에 발생되는 정전기가 회로기판(70)을 경유하지 않고 판부재(50)를 통해서 버텀커버(80)로 접지되므로써 정전기가 제거되게 된다.And. As shown in FIG. 3, the grounding portion 52 penetrates through the main chassis 90 and is grounded to the bottom cover 80, and is modulated by screwing the screw hole 51a of the locking portion 51. The static electricity generated at 60 is grounded to the bottom cover 80 through the plate member 50 without passing through the circuit board 70, thereby removing static electricity.
이상에서와 같이, 본 고안에 따른 모듈레이터의 접지장치에 의하면, 모듈레이터에 발생되는 정전기가 회로기판을 경유하지 않고 직접 버텀커버로 전달되는 구조로 제거되므로써 회로기판을 보호할 수 있게 된다. 또한, 구조가 단순화되어 작업성이 향상될 뿐만 아니라 생산성이 향상되는 이점이 있다.As described above, according to the grounding device of the modulator according to the present invention, it is possible to protect the circuit board by removing the static electricity generated in the modulator in a structure that is directly transmitted to the bottom cover without passing through the circuit board. In addition, the structure is simplified, the workability is improved, as well as the productivity is improved.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950022628U KR0126456Y1 (en) | 1995-08-29 | 1995-08-29 | Grounding device of a modulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950022628U KR0126456Y1 (en) | 1995-08-29 | 1995-08-29 | Grounding device of a modulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970011317U KR970011317U (en) | 1997-03-29 |
| KR0126456Y1 true KR0126456Y1 (en) | 1998-10-15 |
Family
ID=19421887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950022628U KR0126456Y1 (en) | 1995-08-29 | 1995-08-29 | Grounding device of a modulator |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0126456Y1 (en) |
-
1995
- 1995-08-29 KR KR2019950022628U patent/KR0126456Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970011317U (en) | 1997-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY115573A (en) | Cardbus bridge | |
| US5872333A (en) | Connector fixing construction | |
| KR0126456Y1 (en) | Grounding device of a modulator | |
| GB2301944A (en) | Shield case having protrusions supporting a circuit board | |
| US6339535B1 (en) | Device for fastening a protective coverplate | |
| JP4380749B2 (en) | Tuner grounding structure | |
| KR100738348B1 (en) | Electromagnetic wave shield cover for display apparatus | |
| KR0117567Y1 (en) | Device for treating image data | |
| KR19980049146U (en) | Main PCB Grounding Device to Bottom Cover | |
| KR200191801Y1 (en) | Ground apparatus of signal cable | |
| KR200231878Y1 (en) | An electronic device | |
| KR970004660Y1 (en) | Shield case | |
| KR880002863Y1 (en) | Shield cover supporting means for rf modulator | |
| KR200296379Y1 (en) | PCB grounding device using ground spring | |
| KR970009502A (en) | Shield cover and shielding method using the same | |
| KR0121332Y1 (en) | Earth structure | |
| KR200159328Y1 (en) | Grounding device for tmi module | |
| KR0137166Y1 (en) | Earth device for electronic equipment | |
| KR200151882Y1 (en) | Structure for recuring a ground plate of a power source to a tape recorder | |
| KR0138105Y1 (en) | Apparatus for grounding a free amplifier shield case of vtr | |
| KR930001271Y1 (en) | Shield plate fixing structure for circuit board | |
| KR19990012819U (en) | Bracket for front PC grounding of car audio | |
| KR19980023354U (en) | Main circuit board grounding structure of electronic equipment | |
| KR200309632Y1 (en) | Electromagnetic shielding device of communication equipment shelf | |
| KR0120857Y1 (en) | Qrounding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20010629 Year of fee payment: 4 |
|
| LAPS | Lapse due to unpaid annual fee |