KR0125137Y1 - Grounding apparatus - Google Patents

Grounding apparatus

Info

Publication number
KR0125137Y1
KR0125137Y1 KR2019950022629U KR19950022629U KR0125137Y1 KR 0125137 Y1 KR0125137 Y1 KR 0125137Y1 KR 2019950022629 U KR2019950022629 U KR 2019950022629U KR 19950022629 U KR19950022629 U KR 19950022629U KR 0125137 Y1 KR0125137 Y1 KR 0125137Y1
Authority
KR
South Korea
Prior art keywords
piece
circuit board
grounding
static electricity
ground
Prior art date
Application number
KR2019950022629U
Other languages
Korean (ko)
Other versions
KR970011290U (en
Inventor
박종일
Original Assignee
배순훈
대우전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배순훈, 대우전자주식회사 filed Critical 배순훈
Priority to KR2019950022629U priority Critical patent/KR0125137Y1/en
Publication of KR970011290U publication Critical patent/KR970011290U/en
Application granted granted Critical
Publication of KR0125137Y1 publication Critical patent/KR0125137Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/38Clamped connections, spring connections utilising a clamping member acted on by screw or nut

Abstract

본 고안은 정전기 제거용 접지장치를 개시한다. 개시된 본 고안 정전기 제거용 접지장치는, 그 일측에는 톱커버와 탄력적으로 접지되는 탄성접지편이 형성되고 그 타측에는 상기 탄성접지편으로부터 밴딩되어 패널의 걸림보스에 지지되는 지지편이 형성된 지지부와; 지지편의 일단부로부터 절곡 연장형성되며, 그 단부에 마이크 회로기판의 브래킷에 나사고정하기 위한 나사가 삽입되는 나사삽입홈이 형성된 제 1 접지편과; 지지편의 타단부에 절곡 연장형성되며 그 단부에 볼륨 회로기판에 나사고정하기 위한 나사가 삽입되는 나사삽입홈이 형성된 제 2 접지편을 포함하여 구성된다.The present invention discloses a grounding device for removing static electricity. The disclosed device for removing static electricity includes a support part having a support piece on one side thereof formed with an elastic grounding piece which is elastically grounded with a top cover, and a support piece supported on a latching boss of the panel by bending from the elastic grounding piece on the other side thereof; A first grounding piece extending from one end of the support piece and having a screw insertion groove formed at the end thereof for inserting a screw for screwing into a bracket of a microphone circuit board; And a second ground piece having a screw insertion groove formed at the other end of the support piece, the blade extending groove being bent and inserted into the volume circuit board.

따라서, 접지면적이 넓어서 접지효율이 향상될 뿐만 아니라 접지구조가 간단하다. 또한, 접지경로가 메인회로기판을 통과하지 않고 톱커버에서 버텀커버로 전달되므로 메인회로기판에 손상을 주지 않게 되는 이점이 있다.Therefore, the ground area is wide, so that the grounding efficiency is improved and the grounding structure is simple. In addition, since the ground path is transmitted from the top cover to the bottom cover without passing through the main circuit board, there is an advantage of not damaging the main circuit board.

Description

정전기 제거용 접지장치Static eliminator grounding device

제 1 도는 종래 정전기 제거용 접지장치를 도시한 사시도1 is a perspective view showing a conventional grounding device for removing static electricity

제 2 도는 본 고안에 따른정전기 제거용 접지장치를 도시한 분리 사시도2 is an exploded perspective view showing a grounding device for eliminating static electricity according to the present invention

제 3 도는 본 고안에 따른 정전기 제거용 접지장치를 도시한 평면도3 is a plan view showing a grounding device for removing static electricity according to the present invention

제 4 도는 본 고안에 따른 정전기 제거용 접지장치에서 접지편을 도시한 종단면도Figure 4 is a longitudinal cross-sectional view showing a grounding piece in the grounding device for removing static electricity according to the present invention

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

50 : 지지부 51 : 탄성접지편50 support 51 elastic ground piece

52 : 지지편 53 : 제 1 접지편52 support piece 53 first ground piece

53a : 나사삽입홈 53b : 정렬공53a: screw insertion groove 53b: alignment hole

54a : 나사삽입홈 54b : 정렬편54a: screw insertion groove 54b: alignment piece

54 : 제 2 접지편 60 : 마이크로회로기판54. Second grounding piece 60: Microcircuit board

62 : 브래킷 62 : 나사공62: bracket 62: screw hole

70 : 볼륨회로기판 72 : 나사공70: volume circuit board 72: screw hole

80 : 톱커버 90 : 패널80: top cover 90: panel

91 : 걸림보스 92 : 포스트91: jam boss 92: post

본 고안은 정전기 제거용 접지장치에 관한 것으로, 더욱 상세하게는 볼륨 회로기판 및 마이크 회로기판에 발생되는 정전기를 제거할 수 있는 정전기 제거용 접지장치에 관한 것이다.The present invention relates to a grounding device for removing static electricity, and more particularly to a grounding device for removing static electricity that can remove the static electricity generated in the volume circuit board and the microphone circuit board.

일반적인 각종 전자기기에서는 정전기실험을 하기 위하여 기기에 전기적충격을 주게 되는데, 정전기실험시 회로기판에 발생된 정전기를 접지장치를 통해 제거하게 된다.In general, various electronic devices give an electric shock to the device for the electrostatic test, and the static electricity generated in the circuit board during the electrostatic test is removed through the grounding device.

종래 정전기 제거용 접지장치는, 제 1 도에 도시된 바와같이, 그 일단이 회로기판(1)에 납땜에 의해 고정설치되고, 그 타단이 브래킷(bracket)(2)에 나사(3)를 통해 고정설치되는 러그(lug)(4)를 사용하여 회로기판(1)에 가해지는 정전기를 제거하였다. 따라서, 회로기판(1)에 발생되는 정전기가 러그(4)에 전달되고, 이 러그(4)에 전달된 정전기는 브래킷(2)으로 이동되며, 그다음 도면에 도시되지 않았으나 데크 및 메인회로기판과 버텀커버(bottom cover)로 순차적으로 전달됨에 따라 정전기가 제거되게 된다.In the conventional static eliminating grounding device, as shown in FIG. 1, one end of the grounding device is fixed to the circuit board 1 by soldering, and the other end thereof is connected to the bracket 2 through the screw 3. The lugs 4 fixedly installed were used to remove the static electricity applied to the circuit board 1. Accordingly, the static electricity generated in the circuit board 1 is transferred to the lug 4, and the static electricity transferred to the lug 4 is transferred to the bracket 2, and then the deck and the main circuit board are not shown. Static electricity is removed as it is sequentially delivered to the bottom cover.

그러나, 이와 같이 구성된 정전기 제거용 접지장치는, 고압의 정전기가 통과할 경우에는 러그의 견고성이 취약하여, 러그의 접지기능이 원만하게 수행되지 못하게 되며, 러그와 회로기판과의 접촉면적이 작어서 접지효율이 저하되는 문제점이 있었다. 또한, 접지경로가 메인회로기판을 통과하게 되므로 이에 손상을 줄 염려가 있으며, 쇼트(short circuit)가 발생되어 기기에 손상을 주게 된다.However, the static elimination grounding device configured as described above has a weak lug when the high-pressure static electricity passes, preventing the lug from being grounded smoothly, and the contact area between the lug and the circuit board is small. There was a problem that the grounding efficiency is lowered. In addition, since the ground path passes through the main circuit board, there is a risk of damaging it, and a short circuit occurs to damage the device.

본 고안은 상술한 바와같이 문제점을 해결하기 위하여 안출된 것으로서, 접지구조가 간단할 뿐만 아니라 접지면적이 넓어 접지효율이 향상될 수 있는 정전기 제거용 접지장치를 제공하는데 있다.The present invention has been made to solve the problem as described above, and to provide a grounding device for removing static electricity can be improved not only the grounding structure is simple but also the grounding area is wide.

이와 같은 목적은, 그 일측에는 톱커버와 탄력적으로 접지되는 탄성접지편이 형성되고, 그 타측에는 상기 탄성접지편으로부터 벤딩되어 패널의 걸림보스에 지지되는 지지편이 형성된 지지부와;This object, the support portion is formed on one side of the elastic grounding piece is elastically grounded with the top cover, the other side is bent from the elastic grounding piece and the support piece is supported on the latching boss of the panel;

상기 지지편의 일단부로부터 절곡 연장형성되며, 그 단부에 마이크 회로기판의 브래킷에 나사고정하기 위한 나사가 삽입되는 나사삽입홈이 형성된 제 1 접지편과; 상기 지지편의 타단부에 절곡 연장형성되며 볼륨 회로기판에 나사고정하기 위한 나사가 삽입되는 나사삽입홈이 형성된 제 2 접지편을 포함하여 구성된 정전기 제거용 접지장치를 제공함으로써 달성될 수 있다.A first ground piece which is bent and extends from one end of the support piece and has a screw insertion groove formed therein for inserting a screw for screwing into a bracket of a microphone circuit board; It can be achieved by providing an electrostatic removing grounding device including a second grounding piece which is bent and extended at the other end of the support piece and has a screw insertion groove into which a screw is inserted into the volume circuit board.

본 고안은 한 특징은, 상기 제 1 접지편의 일측에, 이에 형성된 나사 삽입홈과 마이크 회로기판의 브래킷에 형성된 나사공을 일치시키기 위한 정렬공이 형성되는 정전기 제거용 접지장치에 있다.One feature of the present invention lies in a grounding device for static electricity removal, wherein one side of the first ground piece is provided with an alignment hole for matching a screw insertion groove formed therein with a screw hole formed in a bracket of a microphone circuit board.

본 고안의 다른 특징은, 상기 제 2 접지편의 일측에, 이에 형성된 나사 삽입홈과 볼륨 회로기판에 형성된 나사공을 일치시키기 위한 정렬편이 형성되는 정전기 제거용 접지장치에 있다.Another feature of the present invention lies in a grounding device for removing static electricity, on which one side of the second ground piece is formed an alignment piece for matching a screw insertion groove formed therein with a screw hole formed in the volume circuit board.

본 고안 정전기 제거용 접지장치에 의하면, 접지구조가 간단하며, 접지면적이 넓어 접지효율이 향상될 뿐만 아니라 접지경로가 메인회로기판을 경유하지 않게 되므로 이에 손상을 주지않게 되는 이점이 있다.According to the inventive static elimination grounding device, the grounding structure is simple, and the grounding area is wide, so that the grounding efficiency is improved and the grounding path does not pass through the main circuit board.

이하 본 고안에 따른 정전기 제거용 접지장치의 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings a preferred embodiment of a grounding device for removing static electricity according to the present invention will be described in detail.

제 2 도는 본 고안에 따른 정전기 제거용 접지장치를 도시한 분리 사시도이고, 제 3 도는 본 고안에 따른 정전기 제거용 접지장치를 도시한 평면도이며, 제 4 도는 본 고안에 따른 정전기 제거용 접지장치를 도시한 종단면도이다.2 is an exploded perspective view showing a grounding device for removing static electricity according to the present invention, Figure 3 is a plan view showing a grounding device for removing static electricity according to the present invention, Figure 4 is a grounding device for removing static electricity according to the present invention It is a longitudinal cross-sectional view which is shown.

이에 도시된 바와같이, 정전기 제거용 접지장치는 탄성접지편(51)과 지지편(52)으로 이루어진 지지부(50)와, 마이크 회로기판(70)의 브래킷(71)에 나사고정되는 제 1 접지편(53)과 볼륨 회로기판(60)에 나사고정되는 제 2 접지편(54)으로 대별된다.As shown therein, the grounding device for removing static electricity includes a support part 50 including an elastic ground piece 51 and a support piece 52, and a first ground screwed to the bracket 71 of the microphone circuit board 70. The second ground piece 54 is screwed to the piece 53 and the volume circuit board 60.

우선, 지지부(50)는 그 일측에 톱커버(80)와 탄력적으로 접지되는 탄성접지편(51)이 형성되고, 그 타측에는 전술한 탄성접지편(51)으로부터 소정각도 밴딩(bending)되어 패널(90)의 걸림보스(91)에 지지되는 지지편(52)이 형성된다. 여기에서, 탄성지지편(51)은 지지편(52)에 대해 톱커버(80)와의 접촉이 원활하도록 소정 각도로 경사지게 형성함이 바람직하다.First, the support part 50 is formed with an elastic ground piece 51 elastically grounded with the top cover 80 on one side thereof, and the other side is bent at a predetermined angle from the elastic ground piece 51 described above. The support piece 52 supported by the latching boss 91 of 90 is formed. Here, the elastic support piece 51 is preferably formed to be inclined at a predetermined angle to facilitate contact with the top cover 80 with respect to the support piece 52.

또한, 지지편(52)의 상측면은 조립시 터치되는 현상을 방지할 수 있도록 라운딩 또는 쳄퍼링(chamfering)되는 것이 바람직하다.In addition, the upper side surface of the support piece 52 is preferably rounded or chamfered to prevent the phenomenon of touch during assembly.

그리고, 제 1 접지편(53)은 전술한 지지편(52)의 일단부에 이로부터 수평방향으로 절곡 연장형성되며, 그 단부에 마이크 회로기판(60)의 브래킷(61)에 나사고정하기 위한 나사가 삽입되는 일측이 개구된 나사 삽입홈(53a)이 형성된다.Then, the first ground piece 53 is formed to be bent in the horizontal direction from one end of the above-described support piece 52, and to screw the bracket 61 of the microphone circuit board 60 at the end thereof. A screw insertion groove 53a is formed in which one side into which the screw is inserted is opened.

또한, 제 2 접지편(54)은 전술한 지지편(52)의 타단부에 절곡 연장형성되며, 그 단부에 볼륨 회로기판(70)에 나사고정하기 위한 나사가 삽입되는 일측이 개구된 나사 삽입홈(54a)이 형성된다.In addition, the second ground piece 54 is bent and extended to the other end of the above-described support piece 52, the screw insertion is open at one end of the screw thread for fixing to the volume circuit board 70 is inserted at the end Grooves 54a are formed.

한편, 제 1 접지편(53)의 일측에는 이에 형성된 나사 삽입홈(53a)과 마이크 회로기판(60)의 나사공(62)에 일치시키기 위하여 정렬공(53b)이 형성된다.Meanwhile, an alignment hole 53b is formed at one side of the first ground piece 53 so as to coincide with the screw insertion groove 53a formed therein and the screw hole 62 of the microphone circuit board 60.

그리고, 제 2 접지편(54)의 일측에는 이에 형성된 나사 삽입홈(54a)과 볼륨 회로기판(70)에 형성된 나사공(72)을 일치시키기 위한 정렬편(54b)이 형성된다.In addition, an alignment piece 54b is formed at one side of the second ground piece 54 to match the screw insertion groove 54a formed therein with the screw hole 72 formed in the volume circuit board 70.

이와 같이 구성된 본 고안에 따른 정전기 제거용 접지장치는, 우선 제 2 도에 도시된 상태에서, 패널(90)의 걸림보스(91)에 지지부(50)를 끼우게 된다. 이때, 지지부(50)의 지지편(52)은 걸림보스(91)에 지지되게 되고, 지지부(50)의 탄성접지편(51)은 톱커버(80)에 탄력적으로 접지되게 된다. 그리고, 제 1 접지편(53)의 일측에 형성된 정렬공(53b)을 패널(90)의 일측에 형성된 포스트(92)에 일치시키고, 제 2 접지편(54)의 일측에 형성된 정렬편(54b)을 볼륨 회로기판(70)의 일측면에 밀착시킨다. 그 다음, 제 1 접지편(53)과 제 2 접지편(54)에 형성된 나사 삽입홈들(53a,54a)과 마이크 회로기판(60)의 브래킷(61) 및 볼륨회로기판(70)에 형성된 나사공(62,72)을 일치시킨다. 그리고, 이상태에서, 제 3 도에 도시된 바와같이 나사조립을 하여 제 1 접지편(53)과 제 2 접지편(54)에 마이크 회로기판(60)과 볼륨회로기판(70)을 나사 고정시키게 된다.In the grounding device for eliminating static electricity according to the present invention configured as described above, first, in the state shown in FIG. 2, the support part 50 is fitted to the catching boss 91 of the panel 90. At this time, the support piece 52 of the support 50 is supported by the engaging boss 91, the elastic ground piece 51 of the support 50 is elastically grounded to the top cover (80). Then, the alignment hole 53b formed on one side of the first ground piece 53 matches the post 92 formed on one side of the panel 90, and the alignment piece 54b formed on one side of the second ground piece 54. ) Is closely attached to one side of the volume circuit board 70. Next, the screw insertion grooves 53a and 54a formed in the first ground piece 53 and the second ground piece 54 and the bracket 61 and the volume circuit board 70 of the microphone circuit board 60 are formed. Match the screw holes 62 and 72. In this state, as shown in FIG. 3, screw assembly is performed to fix the microphone circuit board 60 and the volume circuit board 70 to the first ground piece 53 and the second ground piece 54. do.

따라서, 제 4 도에 도시된 바와같이, 마이크 회로기판(60)과 볼륨 회로기판(70)에 발생되는 정전기가 제 1 접지편(53)및 제 2 접지편(54)을 통해 전달되고, 그 다음 지지편(52)과 탄성접지편(51)으로 순차적으로 이동된다. 그리고, 탄성접지편(51)에 접지되어 있는 톱커버(80)로 이동되므로써 정전기가 제거되게 된다.Thus, as shown in FIG. 4, the static electricity generated in the microphone circuit board 60 and the volume circuit board 70 is transmitted through the first ground piece 53 and the second ground piece 54, and Next, the support piece 52 and the elastic ground piece 51 are sequentially moved. Then, the static electricity is removed by being moved to the top cover 80 which is grounded to the elastic ground piece (51).

이상에서와 같이 본 고안에 따른 정전기 제거용 접지장치에 의하면, 접지면적이 넓어서 접지효율이 향상될 뿐만 아니라 접지구조가 간단하다. 또한, 접지경로가 메인회로기판을 통과하지 않고 톱커버에서 버텀커버로 전달되므로 메인회로기판에 손상을 주지 않게 되는 이점이 있다.As described above, according to the grounding device for eliminating static electricity according to the present invention, the grounding area is wide and the grounding efficiency is improved, and the grounding structure is simple. In addition, since the ground path is transmitted from the top cover to the bottom cover without passing through the main circuit board, there is an advantage of not damaging the main circuit board.

Claims (3)

그 일측에는 톱커버(80)와 탄력적으로 접지되는 탄성접지편(51)이 형성되고 그 타측에는 상기 탄성접지편(51)으로부터 밴딩되어 패널(90)의 걸림보스(91)에 지지되는 지지편(52)이 형성된 지지부(50)와; 상기 지지편(52)의 일단부로부터 절곡 연장형성되며, 그 단부에 마이크 회로기판(60)의 브래킷(61)에 나사고정하기 위한 나사가 삽입되는 나사삽입홈(53a)이 형성된 제 1 접지편(53)과; 상기 지지편(52)의 타단부에 절곡 연장형성되며, 그 단부에 볼륨 회로기판(70)에 나사고정하기 위한 나사가 삽입되는 나사삽입홈(54a)이 형성된 제 2 접지편(54)을 포함하여 구성되는 것을 특징으로 하는 정전기 제거용 접지장치.An elastic ground piece 51 which is elastically grounded with the top cover 80 is formed at one side thereof, and a support piece which is bent from the elastic ground piece 51 at the other side thereof and supported by the catching boss 91 of the panel 90. A support part 50 in which 52 is formed; The first ground piece is bent extending from one end of the support piece 52, the screw insertion groove 53a is formed at the end of the screw insertion groove 53a is inserted into the bracket 61 of the microphone circuit board 60 53; The second ground piece 54 is formed to be bent extending to the other end of the support piece 52, the screw insertion groove 54a is formed at the end is inserted into the screw for fixing to the volume circuit board 70 Electrostatic removing grounding device, characterized in that configured to. 제 1 항에 있어서, 상기 제 1 접지편(53)의 일측에, 이에 형성된 나사삽입홈(53a)와 마이크 회로기판(60)의 브래킷(61)에 형성된 나사공(62)을 일치시키기 위한 정렬공(53b)이 형성되는 것을 특징으로 하는 정전기 제거용 접지장치.According to claim 1, Alignment for matching the screw insertion groove (53a) formed in the one side of the first ground piece (53) and the screw hole 62 formed in the bracket 61 of the microphone circuit board (60) Electrostatic removing grounding device, characterized in that the ball (53b) is formed. 제 1 항에 있어서, 상기 제 2 접지편(54)의 일측에, 이에 형성된 나사삽입홈(54a)과 볼륨 회로기판(70)에 형성된 나사공(72)을 일치시키기 위한 정렬편(54b)이 형성되는 것을 특징으로 하는 정전기 제거용 접지장치.According to claim 1, On one side of the second ground piece 54, an alignment piece 54b for matching the screw insertion groove 54a formed therein and the screw hole 72 formed in the volume circuit board 70 is provided. Electrostatic removing grounding device, characterized in that formed.
KR2019950022629U 1995-08-29 1995-08-29 Grounding apparatus KR0125137Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950022629U KR0125137Y1 (en) 1995-08-29 1995-08-29 Grounding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950022629U KR0125137Y1 (en) 1995-08-29 1995-08-29 Grounding apparatus

Publications (2)

Publication Number Publication Date
KR970011290U KR970011290U (en) 1997-03-29
KR0125137Y1 true KR0125137Y1 (en) 1998-09-15

Family

ID=19421888

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950022629U KR0125137Y1 (en) 1995-08-29 1995-08-29 Grounding apparatus

Country Status (1)

Country Link
KR (1) KR0125137Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100949985B1 (en) * 2009-04-17 2010-03-26 주식회사 시무텍 Ic card reader socket having ground connection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100949985B1 (en) * 2009-04-17 2010-03-26 주식회사 시무텍 Ic card reader socket having ground connection apparatus

Also Published As

Publication number Publication date
KR970011290U (en) 1997-03-29

Similar Documents

Publication Publication Date Title
US5138529A (en) Supportive ground clip for computer system board
US6130817A (en) Holding system for electronic modules
US5508889A (en) Shield cover and shielding method using the same
US6775151B2 (en) Structure for mounting an electronic circuit unit
US6288330B1 (en) Cover device adapted to provide electromagnetic interference shielding to an electronic component that is received in a housing of an electrical appliance
US6501030B1 (en) Grounding plug for printed circuit board
KR970032333A (en) Printed Circuit Board Guide Rail System with Anti-Static Function
JP3091857B2 (en) Electrical connection structure of electronic circuit board
KR0125137Y1 (en) Grounding apparatus
US7094072B2 (en) Connector holding structure
US6129569A (en) Electrostatic discharge protection device for coaxial systems
EP0755177B1 (en) Shield cover and shielding method using the same
US6120325A (en) Device for mounting a shielded connector on a circuit board
KR0123566Y1 (en) Circuit board supporting structure
KR0137166Y1 (en) Earth device for electronic equipment
KR940000742Y1 (en) Grounding connector
KR200296379Y1 (en) PCB grounding device using ground spring
KR0126456Y1 (en) Grounding device of a modulator
JPH11135969A (en) Card puller device of electronic apparatus
CN2874817Y (en) Electric connector module and tray used for said electric connector module
KR910006461Y1 (en) Combinating apparatus of shield case and circuit board of monitor
JPH066552Y2 (en) Storage structure for printed wiring boards
JPH0513030Y2 (en)
KR970009502A (en) Shield cover and shielding method using the same
JPS6333508Y2 (en)

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010529

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee