KR0125100B1 - 고주파용 전자부품의 신호선로 - Google Patents
고주파용 전자부품의 신호선로Info
- Publication number
- KR0125100B1 KR0125100B1 KR1019930009944A KR930009944A KR0125100B1 KR 0125100 B1 KR0125100 B1 KR 0125100B1 KR 1019930009944 A KR1019930009944 A KR 1019930009944A KR 930009944 A KR930009944 A KR 930009944A KR 0125100 B1 KR0125100 B1 KR 0125100B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- signal line
- dielectric layers
- structured
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (2)
- 유전체층을 복수적층하여 형성한 기판에 비어를 기판의 상하로 관통하여 설비하는 동시에 상기 복수의 유전체층간에 상기 비어를 둘러싸는 그라운드플레인을 비어와 소정 간격을 두고 설비하고, 상기 비어를 의사동축선로로 구조화하고, 또 상기 기판상면과 그 하면에 각각 역방향으로 구비한 신호선로를 기판상부와 그 하부의 상기 그라운드플레인에서 각각 마이크로스트립선로로 구조화하는 동시에 그들의 기판상하면의 신호선로의 각 내단을 상기 비어의 상단과 그 하단에 각각 접속하여 된 고주파용 전자부품의 신호선로에 있어서, 상기 그라운드플레인을 상기 비어 주위에 설비하되, 내주연부가 기판상부로부터 그 하부로 감에 따라서 상기 기판상면의 신호선로의 반내쪽으로부터 기판하면의 신호선로의 반대쪽으로 점차 계단상으로 편심되도록 상기 복수의 유전체층간에 각각 배치 설비한 것을 특징으로 하는 고주파용 전자부품의 신호선로.
- 유전체층을 복수적층하여 형성한 기판에 비어를 기판상면쪽으로부터 그 하면쪽으로 관통하여 설비하는 동시에 상기 복수의 유전체층간에 상기 비어를 둘러싸는 그라운드플레인을 비어와 소정간격을 두고 각각 설비하고 상기 비어를 의사동축선로로 구조화하고 또 상기 기판상면과 그 하면에 각각 서로 역방향으로 설비한 신호선로를 기판상부와 그 하부의 상기 그라운드플레인에서 각각 마이크로스트립선로로 구조화하는 동시에 그들의 기판상하면의 신호선로의 각 내단을 상기 비어상단과 그 하단에 각각 접속하여 된 고주파용 전자부품의 신호선로에 있어서, 상기 기판에 상기 비어를 기판상면의 신호선로쪽으로부터 기판하면의 신호선로쪽에 걸쳐서 경사지게 상하로 관통하여 구비하는 동시에 상기 비어 주위에 그라운드플레인을 설비하되, 상기 비어에 대향하여 내주연부가 각각 서로 상하로 경치도록 상기 복수의 유전체층간에 각각 배치 설비한 것을 특징으로 하는 고주파용 전자부품의 신호선로.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP92-196273 | 1992-06-29 | ||
JP04196273A JP3100232B2 (ja) | 1992-06-29 | 1992-06-29 | 高周波用電子部品の信号線路 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940001771A KR940001771A (ko) | 1994-01-11 |
KR0125100B1 true KR0125100B1 (ko) | 1997-12-04 |
Family
ID=16355065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930009944A Expired - Fee Related KR0125100B1 (ko) | 1992-06-29 | 1993-06-03 | 고주파용 전자부품의 신호선로 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3100232B2 (ko) |
KR (1) | KR0125100B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6181219B1 (en) * | 1998-12-02 | 2001-01-30 | Teradyne, Inc. | Printed circuit board and method for fabricating such board |
JP4004048B2 (ja) | 2003-04-11 | 2007-11-07 | Tdk株式会社 | 高周波伝送線路 |
KR100601715B1 (ko) * | 2004-12-22 | 2006-07-18 | 삼성전자주식회사 | 인쇄회로기판 |
US7999192B2 (en) | 2007-03-14 | 2011-08-16 | Amphenol Corporation | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards |
JP5902825B2 (ja) * | 2012-10-29 | 2016-04-13 | 京セラ株式会社 | 素子収納用パッケージおよび実装構造体 |
JP6734750B2 (ja) * | 2016-10-11 | 2020-08-05 | 日本特殊陶業株式会社 | 高周波パッケージ |
JP7134803B2 (ja) * | 2018-09-19 | 2022-09-12 | 株式会社東芝 | プリント基板 |
-
1992
- 1992-06-29 JP JP04196273A patent/JP3100232B2/ja not_active Expired - Fee Related
-
1993
- 1993-06-03 KR KR1019930009944A patent/KR0125100B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0621253A (ja) | 1994-01-28 |
JP3100232B2 (ja) | 2000-10-16 |
KR940001771A (ko) | 1994-01-11 |
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