KR0122739B1 - Method and measuring device for classification of chip-type component and checking of chip-type component's aspect by optical - Google Patents

Abstract

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Description

Method and apparatus for classifying chip-shaped parts and for optically checking the appearance of chip-shaped parts

1 (a) to (c) are perspective views each illustrating a conventional method of classifying and inspecting chipboard components.

2 is a schematic enlarged front view showing an example of a chip board configuration for implementing a method of classifying and inspecting chip board components according to embodiments of the present invention.

3 is a side view illustrating sorting and checking the device of the present invention.

4 is a plan view of FIG.

FIG. 5 is a schematic enlarged longitudinal cross-sectional view of a portion of the chip-path body and the first plate, with the plane indicated in FIG. 4 by the A-A line as the first cover plate.

6 (a)-(c) illustrate the operation of the pins of the chip sorting device, with the help of the chip-path body and the second part on the second cover plate arranged along the groove longitudinal direction of the chip-path body Each schematic partial side cross-sectional view of the cover.

FIG. 7 illustrates a method of moving chip components along the grooves of the chip-path body by the airflow, which is received along the tidal direction and the longitudinal direction of the chip-channel body grooves, and is one of the third cover plates arranged. Partial side view of part of body and one third cover plate.

8 is a schematic view of the assisting method of explaining the operation of the visual tissue of the first chip inspection device.

Figure 9 is a schematic diagram of the assistance to explain the operation of the visual tissue of the second chip inspection device.

FIG. 10 is a schematic enlarged partial plan view showing the lid of a first chip inspector or a second inspector. FIG.

11 is a block diagram showing a processing cross-sectional view of the first and second inspection equipment.

Figure 12 (a) is a schematic diagram of the assistance explaining a method for erasing the image of the chip plate component.

Figure 12 (b) is a schematic diagram of the assistance illustrating the inclination of the chip plate component on the chip-path body.

FIG. 13 is a schematic diagram of optical system adjustment in FIG. 9. FIG.

FIG. 14 is a vertical sectional view of the chip sorting device indicated in FIG. 4 by the B-B line among the six cover plates arranged in the fundamental principle of the chip sorting device.

15 (a) to 15 (c) are enlarged plan views illustrating a method of operating the chip sorter inlet plate shown in FIG.

16A to 16C are plan views showing the adjustment of the chip classifier shown in FIG.

The present invention relates to a method and apparatus for optically checking the appearance of chip-type electrical or electronic components (eg, chip-type capacitors, types of coils and core components, LC parallel parts and the same kind).

And the present invention relates to the practice of classifying chip-shaped components.

If the part of the model has any defects or defects externally, for example, strange appearance, dimensional error, breakage, cracks and the like, such defects may greatly affect the characteristics of the part and Any failure of the operating equipment of the part on the substrate may occur.

Therefore, the present invention is necessary to check not only the characteristics of the parts but also the appearance of the parts.

First, the appearance of the chip-like component is visually inspected by using a magnifying lens or the like or by visual observation.

Referring now to FIGS. 1 (a) to 1 (c), one of the conventional methods for checking the appearance of chip-shaped components will be described to facilitate understanding of the present invention.

In FIG. 1A, reference portion 10 refers to a chip storage box that receives the majority of chip-shaped components.

And reference 11 indicates the first glass pallet.

In FIG. 1 (b), the reference portion 12 points to a column extending upward from the support 13, and the reference portion 14 supports the horizontal end of the column 12 to support a portion of the upper end of the column 12. It points to the enlarged lens fixed by.

First, the chip-shaped component 20 is sprinkled on the first glass plate 11 in such a way that the one-spoons 16 are removed from the storage box and do not stick together as shown in FIG.

Secondly, the first glass plate 11 with the chip-shaped component 20 placed thereafter is placed on the support 13.

Then, each top surface side of the chip-shaped component 20 placed on the first glass plate 11 is subjected to visual inspection.

In contrast, each of the chip-shaped components 20 is enlarged by the magnifying lens 14.

When a chip-like part having an external defect is found through visual inspection, it is found that the defective part 20 'is collected in the waste box 17 as shown in FIG.

The defective part 20 'then moves completely to the first glass plate 11 and the second glass plate 18 is superimposed on the first glass plate 11.

Then, the overlap of the first and second glass plates 11 and 18 is reversed as shown in FIG.

Thereby, the remaining chip-like component that has been on the first glass plate 11 so far moves to the second glass plate 18 with the bottom side of the chip-shaped component facing upwards.

The first glass plate 11 is moved to the second glass plate 18 and the second glass plate 18 is placed on the support 13.

The above described procedure is then repeated in effect to visually check the side of the bottom of the chip-like component on the second glass plate 18.

Thus, acceptable chip-type components are classified from defective chip-type components.

Since this conventional method and the chip-shaped parts are visually inspected by the inspector through the magnifying lens as described earlier, the inspection operation may be performed sensibly by the inspector.

Thus, it is impossible to set a standard for inspecting the appearance of chip-shaped components.

In other words, standards for inspecting the appearance of chip-shaped components generally vary from inspector to inspector.

Thus, chip-shaped parts identified as parts that can be accepted through visual inspection by the inspector may differ from one another in quality.

In addition, in conventional methods, the placement of chip-shaped components on the first glass plate, the sorting of defective parts from acceptable parts, and the like are practically performed by hand.

Thus, the chenking accuracy may be reduced due to the examiner's fatigue, due to human error and the inspector's fundamentals.

There is a need for an increasing number of inspectors to handle the inspection of chip-shaped components.

This makes chip-like components expensive too.

The present invention is made in view of the above-mentioned disadvantages of sun sea art.

Therefore, it is desirable to classify chip-type components capable of automatically checking the appearance of chip-shaped components at high accuracy and speed, and to provide a method and apparatus for optically checking the appearance of chip-shaped components. It is an object of the present invention.

It is another object of the present invention to provide such a method and apparatus that is capable of automatically and efficiently performing the classification of chip-like parts after the chip-like parts have been inspected and handled.

It is another object of the present invention to provide such a method and apparatus with the ability of a chip-like component to be allowed to move smoothly one by one at predetermined chip inspection positions.

In one aspect of the invention, a method for scientifically checking and sorting chip-like components is equipped to include means for feeding back chip-like components that operate as chip-passing engines in a predetermined direction.

During the operation of the chip-type and the engine-type parts attached to the engine, the chip-type parts are separated one by one at each position of the two pre-determined pre-checks, and the chip as a video signal by the first TV camera. -Directly or indirectly illuminates the chip-shaped component at a pre-checked position to visualize one of the lower and upper surfaces of the shaped component.

In addition, light is directly and indirectly emitted from one location to take an optical image of the lower and upper surfaces of another chip-shaped component.

It sends an image signal to the image processing section, and each of the signals has an analog-to-digital conversion unit, an image storage device, and a central processing unit. This is to process the image signal of the image processing section and is attached to a predetermined position of the chip passage. To obtain data on the slope of the chip-shaped components and the appearance of the chip-shaped components.

Thus, whether the chip is acceptable or defective is a check of the underlying data.

As a result, the classification of the chip-shaped parts inspected is based on the inspection result.

Another aspect of the present invention shows that it is an apparatus for optically inspecting and classifying chip-shaped components.

The sorting device, which the chip-shaped component checks, consists of a single body. The chip passages are formed on the main body, and the elongated chip-path body consists of a U-shaped body in a vertical cross-sectional view.

The elongated chip body is formed at two inspection positions, where the chip-like components are inspected and made of transparent material.

A partial feedback device connected to one end of the body is above the body to feed back chip-like components.

As an example of a chipboard component to be checked by a check and sorting device according to the present invention, a chipboard capacitor will be mentioned in the following.

As mentioned in FIG. 2, the chip capacitor 20 (hereinafter referred to as chip) includes a main body 22 and two electrodes 24 are mounted at two ends of the main body 22. As shown in FIG.

As will be described below in the embodiment of the present invention, an item for checking to include the full length dimension of the chip 20 is generally indicated by the indicator L, and the butterfly dimension of the body 22 is generally indicated by the indicator W. The butterfly dimensions of the electrode 24 are generally indicated by the governors B ₁ , B ₂ , B ₃ and B ₄ .

Breakage of chips and the like are generally indicated.

What is now mentioned in FIGS. 3 and 4 will describe an apparatus for classifying chips and checking the appearance of chips in accordance with embodiments of the present invention.

In accordance with the embodiments of the present invention, the inspection and sorting apparatus generally includes a main body 100 having an inclined surface 101.

The feeder portion supported by the pillar 32 and for supplying chips extends upwardly from the body 100 in such a way that it was placed near the upper end of the slope 101 of the body 100.

The chip passage method 40 comprising a U-shaped enlarged chip passage body 42 in a longitudinal section is connected to the upper end of the feeder portion 30 and further extends upwards and downwards of the body 100. The slope 101 of the main body 100 is supplied by the stretched method.

A chip separator 50 for separating the chips individually was supplied from the feeder section 30.

Calculate the number of chips to be passed to the first inspection device 60 for checking the bottom of each chip, the second inspection device 70 for checking the upper side of each chip, and the chip passage body 100. The calculator 80, and the chip sorting device 90, the chip separating device 50, the first checking device 60, the second checking device 70 and the calculator 80 for sorting the chips are It was arranged in sequence along the enlarged chip-path body 42 of the chip passage method 40 in the downward direction.

The chip sorting device 90 is arranged at the end of the lower portion of the chip passage body 42. In the embodiment as illustrated, the feeder portion 30 has the form of a vibrator feed line.

The upper end of the chip-path body 42 is connected to the chip outlet of the vibrator supply line through the chips from the vibrator supply line that is adapted for delivery to the chip-path body 42.

The vibrator supply line is well known and will not be represented by technology. In the embodiment, whether in the figure, the slope 101 of the body 100 is inclined at an angle of about 45 degrees with respect to the horizontal plane.

Thus, the U-shaped chip-path body 42 on the slope 101 is also inclined at an angle of about 45 degrees with respect to the horizontal plane.

Since the U-shaped chip-path body 42 is inclined as described above, the chips will slide along the grooves 42 of the chip-path body 42 into the chip-path body 42. Supplied from portion 30.

However, as chips are made between the chip-path body 42 and the chips while they slide down the chip-path body 42, there is a possibility of unknown frictional resistance and static electricity.

The chips will be protected from slipping smoothly over the chip-path body 42.

In order to avoid this failure, the embodiment, illustrated or illustrated, includes methods to help the chips slip as described below.

The device according to the embodiment further comprises the majority of the air vent 44 to help the chip slip on the chip passage body 42.

As noted in FIG. 5, each of the air outlet portions 44 is connected (not shown) to any suitable air supply method.

And the air discharge hole 44 from it is applied to discharge. More specifically, the first enlarged cover plate 120 having the enlarged through hole 120 extending in the longitudinal direction is a region S of the chip passage body 42 between the chip separator 50 and the feeder portion 30. In Figure 4).

The air exhaust portion 44 (only one shown in FIG. 5) superimposed on the first cover plate 120 is placed in such a manner that they are arranged at equal intervals along the longitudinal direction of the cover plate 120.

Further, each of the air discharge portions 44 was arranged at an angle in such a manner that the end of the air discharge hole 44a was directed toward the downward direction of the cover plate 120 and toward the passage opening 120a of the cover plate 120.

Therefore, the air discharged from each of the air discharge holes 44a is transferred through the tube 120a of the first cover plate 120 to flow into the groove 42a of the U-shaped chip-path body 42. do.

A feeder portion 30 was provided which allows the chips to be smoothly fed down the chip-path body 42 along the grooves 42a of the chip-path body 42.

The chip separation device 50 briefly described above is located at a lower position than the air exhaust portion 44 is arranged (arranged).

Referring now to drafting (6), the chip separator consists of the first and second (52) and (54), which are located on the second cover plate 130 on which the chip separator part is arranged.

The first and second pins 52 and 54 are arranged slightly apart from T between the two along the length (vertical) direction of the chip passage body 42.

This fallen T lies somewhat longer than the length of one chip but no longer than the total length of the two chips.

It is through holes 130a and 130b that are formed in the part of the second cover plate 130 which lies directly below the first and second pins 52 and 54.

The first and second pins 52, 54 are connected to some suitable actuator 56 (draft 4) and are manipulated by the actuator 56 to move vertically with respect to the chip-path body. have.

When moved downward by the respective actuators 56 of the first and second pins 52, 54, each automatically inclines its inwards into the (42a) groove of the chip passage body 42. It passes through the through hole (130a), (130b) of the second cover plate 130 is to go to the end.

The pins 52 and 54 are means for separating the chips which are slid continuously from the top to the bottom of the chip-path body 42 along the grooves of the chip-path body 42a in the same manner as mentioned above. Play a role.

As shown in drafting 6a, when fed toward the feeder portion 30, which slides down from the chip-path body 42 of the chip 20, the first pin 52 is on the upper side, while the second The pin 54 is located in the lower portion where the tip enters into the groove 42a of the chip passage body 42.

Thus, the first of the chips 20 slides down on the chip-path body 42 which is stationary against the second pin 54, so that the first and subsequent chips are the chip-path body. Stay at (42).

At this time, the first pin 52 passes through its end and moves downward to include the next chip as opposed to the bottom surface of the (42a) groove of the chip passage body 42 as shown in the drawing 6b.

Then, the second pin 54 moves upwards to release the first chip from there, as shown in drafting 6c.

At this time, the next (side) chip may be attracted by the static electricity generated between the first chip and the next chip.

Or because of the wagon resistance that may occur between the first chip and the chip-path body 42, the first chip may still remain in the same portion as the chip-path body 42 (may be left).

Thus, even if the second pin 54 moves up to release the first chip therefrom, the first chip may not slide down on the chip-path body 42.

For this purpose, the chip-path, which coincides approximately (positionally), approximately in the intermediate position between the pin 52 and the pin 54 so as to be smoothly transported downward on the chip-path body 42 in the reflected phenomenon. What is formed in the bottom wall of the groove 42a of the main body 42 is an air gap additionally opened to the bottom surface of the groove 42a of the chip-path body 42 so as to communicate with the groove 42a of the chip-path body at its upper end. Furnace 58.

The air passage 58 is connected to its bottom end by any suitable air supply means which is operated to supply air in time as the pin 54 moves up.

As shown in drafting 6a, air passage 58 simultaneously releases air through the second pin 54 as it moves upwards.

In the end, the first chip is then smoothly moved down the chip-path body by airflow.

Thus the first chip is separated from the chips afterwards.

Thereafter, as shown in drafting 6a, the second pin 54 moves downward while the first pin 52 moves up.

In this way, the procedure described above transports the chips one by one (in turn) toward the first censor 60, which is located lower than the portion where each chip-separator 50 is arranged. To separate each chip is repeated.

Incidentally, when the first pin 52 and the second pin 54 move downward, they are folded to the bottom surface of the chip 42 and the chip-path body 42 groove 42a, respectively.

At this time, some shocks may be applied to the first and second pins 52 and 54.

So it is necessary to absorb such a shock.

For this purpose, the first and second pins 52 and 54 have some suitable shock absorbing method.

In addition, the air passage 58 is arranged in the projected portion of the chip separation device 50 and the first inspection device 60 in the projected shape, the first inspection device 60 and the second inspection device 70. ), The second inspection device 70 and the calculator 80 serves to facilitate the sliding of the chips on the chip-path body 42 in each of the portions arranged.

In particular, as shown in drafting (4), the third cover plate 140 is located between the separator 50 and the first inspector 60, the first inspector 60 and the second inspector 70, two. It is located in each part of the chip | path main body 42 between the 1st inspection apparatus 70 and the calculator 80 are arrange | positioned.

Referring now to drafting 7, each of the third cover plates 140 (although only one is shown in drafting 7) has a constant thickness.

The cover plate 140 is composed of an air discharge passage 140a.

The cover plate 140 is formed in such a manner that the air discharge passage 140a opens in an oblique direction in the direction of the cover plate 140 so as to communicate with the groove 42a and the bottom end of the chip passage body 42.

It is connected to its top end by any suitable air supply.

In this way, the air supplied from the invisible air supply method flows into the groove 42a of the chip passage body 42 and passes through the air discharge passage 140a.

The air discharge passage 140a is configured in the cover plate 140 in such a manner that the air discharge passage 140a is inclined at 15 degrees or less with respect to the bottom surface of the groove 42a of the chip passage body 42.

In the projected shape, the air passage 140a is inclined about 80 degrees with respect to the bottom surface of the groove 42a of the chip passage body 42.

The flow of air released from the air supply means, which is not visible in the scheme 7, is denoted by the Z of the nominee.

The air flow (GE-Z) flowing into the chip-path body groove 42a can generate suction force in the area of the cow (U) of the groove 42a of the chip-path body 42. 42) is higher than the position of the queue oil Q in the air discharge passage 140a communicating with the groove 42a (hereinafter referred to as the communication position).

As a result, the chips 20 in the feeder portion 30 are pulled down above the chip-path body in the U region of the groove 42 of the chip-path body 42.

In addition, in the area D of the chip-path body groove 42a, which is lower than the Q-Q communication position, the chips are pushed up from the chip-path body downward direction by the air flow (GE-Z). .

Thus, the chips supplied from the feeder portion 30 are transported downward above the chip-path body 42 in the dairying area U of the groove 42a due to the suction force generated by the air flow (GE-Z).

When the chips pass by the communication position (QU-Q), the chips are pushed downward by the air flow (X-X).

By doing so, the chips can be transported smoothly from the bottom onto the chip-path body.

In the projected phenomenon, incidentally, the air exhaust passage 140a may be formed in the cover plate 140 but may also be formed in the bottom wall of the groove 42a of the chip passage body 42.

Now back to drafting 3, the first censor 60, briefly described above, is located at a lower level than the portion where the television camera 62 is included and the chip separation device is arranged.

The television camera 62 is located at the bottom of the chip passage body 42, and the luminaire 64 is located at the top of the chip passage body 42 in such a way as to be centered with the television camera 62. You will find that it is located.

In particular, the television camera 62 and the illuminator 64 are arranged in such a way that they are sandwiched between the portions of the chip passage body 42 there.

The second censor 70 is located lower than the location where the first censor 60 is arranged, and also includes a television camera 72, and the illuminator 74 has a chip-path body therebetween. 42) They are arranged in such a way that they are located between the parts, so that they are centered on each other (standing in a straight line).

In contrast to the arrangement of the television camera 62 and the first inspection device 60, the television camera 72 of the second inspection device 70 is located above the chip-passage body 70 and the second inspection device. The luminaire of 70 is located below the chip-path body 42.

Referring to the drafting 8 already, the portion of the chip-path body 42 between the television camera 62 and the lighting system of the original inspection device 60 is made of glass or similar kind of transparent material.

Arranged above the portion 420 of the chip-path body 42 is a fourth cover plate made of metal 150.

The fourth cover plate 150 is composed of a central through hole 151 consisting of a large rounded portion at the bottom of the cover plate and a small rounded portion 151b at the top of the cover plate (150).

Suitable for the large rounded portion of the cover plate 150 through-hole 151 is a disc 152 made of glass or a transparent material of that kind combined.

And on the top surface of the transparent plate of the unglazed glass plate 153 smaller than the transparent plate 152.

In the illuminated shape, the agglomerating lens 160 is arranged between the luminaire 64 and the cover plate 150, and the pair of reflecting mirrors 170 are part of the television camera 62 and the chip-path body 42 ( 420 is arranged between.

In the luminaire 64 the light is manipulated by the condenser lens 160 to agglomerate in the manner shown by the drafting 8.

The light so condensed penetrates the transparent plate in its actual center region, which is intended to be illuminated directly on the matt glass plate 153 and the chip 20.

The transparent part 420 of the chip passage body 42 penetrates through the central region of the transparent plate 152 and the reflector 170 facing toward the chip 20.

Thus, the television camera 62 takes the underside image of the chip onto a beam that is straight and obliquely as mentioned above.

The chip-path body 42 actually takes the form of a yuu in a vertical section as mentioned above.

It is composed of bottom and left and right sides.

Referring now to drafting (9), unlike the first censor (60) optical system, the portion of the chip-path body between the television camera (72) and the luminaire (74) of the second censor (70). At 422 the underside 423 of the portion 422 of the chip passage body 42 is made of metal and the sides 424 of the portion of the chip passage body 422 are similar to glass. Made of combined transparent material.

As described above, the chip-path body 42 arranged on the chip-path body upper part 422 has a substantially 'U' shape in a vertical section, and is composed of a bottom side, a left side, and a right side. Referring to drafting (9), the optical system of the second checker 70 is described.

First, unlike the optical system of the inspection device 60, the TV-camera 72 and the second inspection device 70 in the part 422 of the chip passage body 42 between the luminaire 74 are the chip passage body. The lower part 423 of the part 422 of 42 is made of metal, and the side wall part 424 of the part 422 of the chip passage body 42 is, for example, a combination of glass or a similar material. Composed of transparent material.

The fifth cover plate 250, made of a transparent material (eg, combined with soft glass or similar), is mounted on the component 422 of the chip-path body 42, unlike the fourth cover plate 150. have.

The lower part 423 of the component 422 of the chip passage body 42 between the TV camera 72 and the luminaire 74 of the second inspection device 70 is formed as a central through hole 426. The central through hole 426 is composed of a large round part 426a when viewed from the top of the bottom 423 and a small round part 426b when viewed from the bottom of the bottom 423.

Suitable for the large, rounded part 426a of the central through hole 426 may be, for example, glass or its surface, such as on the lower surface of the matte glass 253, such as the transparent plate 252, which is less than the transparent plate 252 supplies. It is the transparent plate 252 combined with the similar transparent material.

Like the optical system of the first inspection device 60, the optical system of the inspection device 70 is a condenser lens 260 mounted between the luminaire 74 and the component 422 of the chip-path body 42. And a pair of reflectors 270 disposed between the TV camera 72 and the fifth cover plate 250.

As shown in the drawing 9, the light coming from the luminaire 74 is condensed by the condensing lens 260 to some extent.

The condensed light is then projected directly through the unglazed glass plate 253 and the transparent plate 252 to the center portion of the chip 20, and the light is transparent around the center portion of the chip 20. It is projected obliquely toward the chip 20 from the pair of reflectors 270 through 252 and the side wall 424 and the fifth cover plate.

Then, the TV camera 72 takes an image of the upper surface of the chip 20 in which light is directly or indirectly projected in the manner described above.

Incidentally, as is well known in the preliminary description of the above picture, there is a large difference in brightness between the central and surrounding regions of light from the source of light, i.e. the central region of light is brighter than the surroundings of light and There is a clear difference in brightness between the part of the article illuminated by the light's perimeter and the part of the article illuminated by the central area of light.

The brightness of the light emitted by the light's surroundings blurs the image of the item.

It is necessary to prevent such difficulties due to the light characteristics described above.

For this purpose, the glazed glass plate 153 (253) in the illuminated shape is mounted in the way of the central parts of the light coming from the luminaire 64 (74) or in the way of the light which is directly reflected on the chip. This makes the difference in brightness between the portion of the chip illuminated by the linear light M and the portion of the chip illuminated by the light N in the region around the linear light M equal.

Therefore, the TV camera 62 (72) can take a sharp image of the chip in the illuminated shape.

The first inspection device 60 is further comprised of a shutter 66 and a shutter confirmation sensor 68, which is shown in drafting 4, the luminaire 64 and the TV camera 62. To stop the chip 20 on the component 422 of the chip-path body 42 therebetween.

Similarly, the second inspection device 70 further consists of one shutter 76 and one shutter confirmation sensor 78, which comprises a chip-between the TV camera 72 and the luminaire 74. It serves to stop the chip 20 on the component 422 of the passage body 42.

Referring to drafting 10, shutters 66 and 76 have skylights 660 and 760, which are attached over chip-path body 42. At the same time as one chip slides down, it is arranged to move in a direction perpendicular to the chip passage body 42 by a suitable engine (not shown).

More particularly, one of each sidewall face of component 420 and 422 of chip-passage body 42 consists of a V-groove 450 extending transversely of the sidewall face.

Through the parts 420 of the chip passage body 42 and the V-groove 450 of the 422, the chip passage body 660 and 760 are operated by an unseen actuator. It is supposed to move inward and outward of the groove 42a of 42).

The skylight 660 760 is moved by the operator into the groove 42a of the chip passage body 42, while the chip 20 on the chip passage body 42 slides down and the chip passage. The chip 20 attached to the main body 42 of the light guide 660 (760) to stop the light guide 660 (760) on the component 420 (422) of the chip passage body 42. Stop on the opposite side of the end.

The chip 20 stuck on the component 420 (422) of the chip passage body 42 in the manner described above is controlled by the inspection method described later.

Incidentally, the skylights 660 and 770 are each made of a transparent material, for example, stainless steel, which is used to treat soft glass or mirror surface finishes.

Where the skylight is made of a transparent material, light from the luminaire 64 passes through the skylight to prevent the TV camera 62 (72) from taking an image of the skylight.

Also where the skylight is made of such stainless steel, the light from the luminaire 64 is reflected from the skylight.

As a result, when the TV camera 62 (72) takes an image of the chip, it takes a reflected image from the skylight.

However, when the image of the chip is revealed on the monitor's screen, which will be explained later, the image of the skylight is revealed as a shiny image.

As mentioned above, the skylight 660 (770) is positioned within the range of the TV camera 62 (72), but this will not affect the inspection function of the chip.

Looking at drafting (11), there are illuminated geometry cross-sectional views (600) and (700) of the first and second inspection devices (60) and (70).

Image processing cross-sectional views 600 and 700 are electronically connected to TV cameras 62 and 72, respectively.

Furthermore, the image processing cross-sectional view 600 of the first inspection device 60 is electronically connected to the TV camera 62 to include an analog-to-digital conversion unit 601 and is electronically connected to the analog-to-digital conversion unit 601. It includes an image storage device 602 and is electronically connected to the image storage device 602 and includes a central processing unit 603 for image processing.

Similarly, the image processing cross-sectional view 700 of the second inspection device 70 is one image storage device 702 electronically connected to the analog-digital conversion unit 701, and analog-digital electronically connected to the TV camera 72. FIG. It is connected to the conversion unit 701 and the image storage device 702 and includes a central processing unit (CPU) for image processing.

Further, central processing unit 603 and 703 are electronically connected to one central processing unit 800, which central processing unit 800 is formed by the chips obtained by central processing unit 603 and 703. The inspection results of the upper surface and the lower surface of 20) are collectively determined and the air supply device described above, that is, the operating device of the pins 52 and 54 of the chip separator 50, shutters 66 and 76. And to send commands to the operating device for the chip sorting device 90 and the calculator 80 for controlling their operation.

In other words, the image memory devices 602 and 702 are electronically connected to the drinking vessel tracking device 802 through a switch 801.

Images of the upper surface portion and the lower surface portion of the chip 20 taken by the TV cameras 62 and 72 are respectively input to the analog-digital conversion units 601 and 701 as image signals.

The video signal is then digitized in analog-to-digital conversion units 601 and 701, respectively, and stored in video storage devices 602 and 702, and then in central processing units 603 and 703. Sent and processed.

In the emptied shape, the image of the chip is taken by the TV camera and exposed on the screen of the monitor 802, and the memory on the screen of the monitor 802 to be emptied therein is extracted, The area of the screen is emptied and the chip's capacity is measured.

The measurement of the capacity of the chip obtained from the vacant memory is then compared with the pre-determined value by determining whether the chip is easy or not.

The monitor is designed to provide black and white images.

Referring to FIGS. 12 (a) and 12 (b), the image 220 of the body portion of one chip appears black on the screen of the monitor, whereas the image 240 or the electrode portion of the chip is centered. The part (I) becomes white and the periphery of the center part (I) appears black on the screen.

In addition, the chip body image 220 is black portion E is revealed on the screen. This may occur depending on the situation on the surface of the chip body.

In the projected image, the image 200 of the chip taken by the TV camera is clearly visible at the center of the screen of the monitor 802.

When the image of the chip is not displayed on the screen, there is no chip on the component 420 (422) of the chip passage body 42 between the luminaire 64 (74) and the TV camera 62 (72). .

From the sides and top and bottom of the screen, the screen is erased from the memory corresponding to the center.

At this time, a boundary line in which the color of the chip image 200 is changed is found, thereby determining the outline of the image of the portions.

However, the L dimension, which is the total length of the chip, and the W dimension, which is the width of the chip, are measured, and the inclination Q of the chip on the component 420 (422) of the chip passage body 42 is measured.

If the chip is ruptured or cracked a lot, such a rupture and crack is found (see Figure 12 (b)).

Incidentally, the groove 42a of the chip passage body 42 is wider than the groove 42a of the chip so that the chip smoothly descends above the chip passage body.

Therefore, when the chip reaches the component 420 (422) of the chip passage body 42, the component 420 (422) of the chip passage body 42 in the transverse direction of the chip passage body 42. The chip may be stopped by the light stand 660 (770) of the shutter 66 (76) in a tilted up situation.

Such a tendency of chips may lead to errors in chip dimensioning. Therefore, the chip's dimensioning in the illuminated shape is calibrated on the basis of the chip's tilt Q measurement.

The slope of the chip Q is determined by one of the memory cancellations of the X coordinate and the minimum of the Y coordinate storage address corresponding to the minimum memory location of the Y coordinate in the center portion of the screen where the chip image 200 is revealed. It is determined by the deviation between the point determined by one of the X coordinate storage addresses corresponding to the maximum storage address of the Y coordinate in the center portion of the screen, and one of the maximum storage locations of the Y coordinate.

Examining the electrode of the chip divides the measured width W of the chip image 200 into three equal sizes along with two lines on the screen and measures the width dimension of the portions of the electrode image 240 along the line. The measurement of the width dimension of the portions of the electrode image along the lines dividing the measured dimension W of 200 is fixed based on the measurement regarding the tilt Q of the chip.

As seen above, the image of the chip appears on the screen at the same time as part E becomes white depending on the condition of the chip body surface.

This is to distinguish the white electrode image 240 and the white E portion of the chip body image, which first store the date of the dimension of the black and white region of the chip image, which can be displayed on the screen.

If the dimensions of the black and white region of the electrode image shown on the screen are in the stored data, the chip can determine that it is acceptable.

In addition, the electrodes of the chip may be dirty, dusty, cracked, or have a surface rupture.

As shown in FIG. 1 (12 (a)), when dust or the like appears black in the white electrode image I together with the image F on the screen, the black image F falls within the stored dimension date. If so, such a black image F may not be reconsidered.

The check method applied to the present invention is performed as a selective memory removal rather than a simple continuous memory removal, and depending on the present invention, the chip check may also be performed at a fairly high speed.

The drafting (13) describes the adjustment of the optical system of the second inspection device 70 shown in drafting (9).

In the control of FIG. 13, each part is evaluated equally with the same name, as shown in Figure 9, and the repetition of the description of those parts is unnecessary.

The adjustment in Figure 13 is interposed between the TV camera and the fifth cover plate 250 arranged on the component 422 of the chip-path body 42, and the first angled light is directed toward the chip 20. A radiator head and a second emitter head positioned below the part 42 of the chip-path body 442 and emitting light directly toward the chip 20 above the part 422 of the chip-path body 42. lost.

The first radiator head 750 has a conical and annular body.

The first fiber wire 752 is connected to one end of the first spinneret head.

The second fiber wire 753 was connected to one side of the second spinner 751.

First, the source of light 74 is located at any position between the second fiber wires 752, 753.

Therefore, the light emitted from the source 74 of light is transmitted to the first and second heads 750 and 751 through the first and second fiber wires 752 and 753.

The light is then directed directly to the chip 20 on the component 422 of the chip-path body 42 by the first and second radiator heads 750 and 751, respectively.

Under the control of the system 13, it is easy to control the light path and the light intensity from the light source 74 when compared to the optical system of the system 9.

Incidentally, it can be understood that the optical system of the drafting 13 is also adopted as the optical system of the first inspection device 60.

After the inspection of the chip has been taken in the above manner, the stopper 760 of the closure 76 of the second checker 70 which has hitherto stopped the chip on the component 422 of the chip passage body 42. Is guided to slide down the chip-path body 42 along the grooves 42a of the chip-path body 42 to move to the duty of the grooves 42a of the chip-path body 42.

While the chip on the chip-path body 42 is lowered, the chip finds a stop plate 81 (see scheme (4)) similar to the pins 52 and 54 of the chip separator 50 (see drawing (4)). Calculated by a chip calculator 80 consisting of a group (not shown).

After the chip is calculated by the chip calculator 80, the chip classifier 90 is reached.

The chip classifier 90 has instructions based on the inspection data of the chip to classify the chips falling above the chip-path body 42 into three groups, namely, acceptable chips, disadvantaged chips and unchecked chips. Is used as an institution to accept from the central processing unit (800).

The chip is treated as an unchecked chip where the chip cannot be reliably checked because of a mistake that may occur accidentally in the projected shape. As shown in Figure 4, the chip classifier 90 includes a sub-system with its own first to third chip passages 91a, 92, 93, and 94.

The second chippath 92 releases an acceptable chip through it, the third chippath 93 releases a defective chip therethrough, and the fourth chippath 94 sends an unchecked chip. It functions to emit through.

The subsystem 91 is mounted on the inclined surface 101 of the engine body 100 in such a way that it is connected to the groove 42a of the chip passage body 42, where the first chip passage 91a is In some cases, the chip-like components are received from the chip passage body 42.

The second chip passage 92 extends straight from the first chip passage 91a.

The second and third chip passages 93 and 94 extend like branches from the second chip passage 92 to the left and right, respectively.

Switching parts 95 and 96 are rotatably attached to the split portions of the second and third passages 93 and 94, and the third and fourth chip passages 93 and 94 can be opened and closed, respectively. It functions as an organ to make and to open and close the second passage (92).

In the drafting 14, a sixth cover plate 97 is attached above the subsystem 91.

Supports 901 and 902 support and penetrate the pillars that are rotationally supported by the subsystem 91.

The switch 95 is convex above the upper end of the support 901 and the switch 96 is convex above the upper end of the support 902.

At the bottom of the support 901 is an arm 903.

The chip sorting device 90 has one end to a cam that is rotatably supported by a support plate (not shown), a sliding rod attached obliquely in a housing 910 attached to the upper surface of the lower surface of the subsystem 904 and sub-system 91. It includes a cylindrical coil 909 attached to the top and bottom surfaces of the connected lever 905 and sub-system 91.

An unmarked slide bar connects one side of it to a cam follower connected to the surface of the cam 904.

The lever 905 is attached at one end with a roller 907 which is forcibly contacted with the arm 903 of the support 902 by a spring 908 extending between the arm 903 and the housing 910. It is becoming.

An arm 903 connected to the support 901 is attached to a cylindrical coil pin 909a adjacent to the cylindrical coil 909 via a connecting body 911.

Although not shown in the system 14, the support 902 has one arm attached to its lower end.

Like the arm 903 in the support 901, the invisible arm in the support 902 is in strong contact with the roller of another lever (not shown), which is formed in the same way as the lever 905. Another cam hole (not shown) in cam 904 is connected by a spring (not shown) extending between the invisible arm of support 902 and housing 910. It is becoming.

Furthermore, the unmarked arm of the support 902 is connected to a cylindrical coil pin on another cylindrical coil (not shown) via a connecting organ (not shown).

The method of operation of the actuators 95 and 96 will be explained with reference to the schemes 15a to 15c.

Actuators 95 and 96 are rotated or stopped by the combination of cam and cylindrical coil.

In particular, when the unmarked cylindrical coil attached to the actuator 96 is not in operation and the cam rotates, the rotation of the cam 904 causes the actuator 96 to move toward the unmarked arm on the support 902. Stimulating the roller of the unmarked lever, support 902 and arm in the right direction causing switch 96 to open fourth passage 94 and close second passage 92 as shown in drafting 15a. It rotates while the unmarked linkage is contracted.

At this time, the cylindrical coil 909 connected to the switch 95 is operated to expand the connecting engine 911 and the arm 903 is moved in the direction of the roller 907 of the lever 905.

The rotation of the arm 903 by the cam 904 is therefore hampered by the force applied to the arm 903 by the operation of the cylindrical coil 909.

The switch 95 is in a sperm state, i.e., closes the fourth passage 93 as shown in drafting 15a.

In this situation, the unchecked chip coming from the first passageway 91a is drawn towards the fourth passageway 94 by the switchgear 96 and the chip is discharged from the first passageway 94 via the fourth passageway 94. Passed.

In the state shown further in drafting 15b, the cylindrical coil which will be on the side of the switch 96 and the unmarked cylindrical coil attached to the switch 96 will be in the working chip.

In this situation, chips that are acceptable through the second passage 92 from the first passage 91a are discharged from the second passage 92.

In contrast to the situation in drafting 15a, in the situation shown in drafting 15c, switchgear 96 is in a stopped state, in which an unmarked cylindrical coil is operating and switchgear 95 is being rotated counterclockwise. This is because the cylindrical coil 909 is not operating, that is, the switch 95 is in a state to open the third passage 93 and close the second passage 92.

In this situation, the defective chip coming from the first passageway 91a is moved towards the third passageway 93 by the switchgear 95 and through the third passageway 93 the chip is released from the third passageway 93. .

The cylindrical coil is operated or stopped under the command of the central processing unit (CPU) 800.

As shown in drafting 15a, when an unmarked cylindrical coil attached to switchgear 98 is commanded to operate from central processing unit 800, the operation of the cylindrical coil causes expansion of the unmarked connecting organ. The switch 96 is rotated counterclockwise while the arm and the support 902 are not rotated.

The switch 96 is then brought into the situation shown in the drafting 15b. In addition, when the cylindrical coil 909 is commanded to operate from the central processing unit 800 as shown in the drawing of the system 15c, the operation of the cylindrical coil 909 causes the connecting body to be inflated so that the arm 903 and the support 901 are operated. ) Rotates and causes switch 95 to rotate clockwise.

The switch 95 is then in the state of drafting 15b.

Incidentally, when the gyro according to the invention is usually stopped or stopped in a sudden situation, the switchgear 96 is designed to safely stop as shown in drafting 15a, and the second passage 92 through which an acceptable chip passes. This prevents defective or unchecked chips from being accidentally passed through.

Also, when a command is issued five times to indicate a chip defect, the device is supposed to stop and prevent the chip from being inspected incorrectly, which may be caused by dust and impurities attached to the chip.

Looking at scheme 16c in scheme 16a, the adjustment of sorting device 90 in scheme 14 is described.

The parts of the system (16a) indicated in the control of the system (16c) are not repeated because the same names and their descriptions are identical to those shown in the system (16).

Subsystem 91 indicating this adjustment includes large, rounded grooves 905 formed in the perimeter, including the point where chip passages 93 and 4 diverge. The rotating disk 951 is received in the round groove 950.

Adjustments from drafting 16a to drafting 16c include motors (not shown) mounted below subsystem 91 and motor regulators (not shown) mounted below subsystem 191.

The rotation support of the motor not shown passes through the sub-system 91 from the bottom and the rotating disk 951 is raised convexly at the upper end of the motor support, and the rotating disk 951 is adapted to be rotated by the motor.

The rotating disk 951 is formed such that the first straight groove 953 formed along the centerline in the disk and the axis of the disk slightly deviate from the center of the rotating disk 951 and cross the first straight groove 953. It includes a second straight groove 954 formed therein.

The first straight groove 953 induces an acceptable force passing through the first passageway 91a to the second passageway 92 and the second straight groove 954 defines the first passageway 91a. It passes the defective or unchecked chip that is passed through to the third passage 93 and the fourth passage 94.

When the first straight groove 953 of the rotating disk 951 is connected with the first passage 91a and the second passage 92 as shown in the drafting 16a, the first straight groove of the rotating disk 951 ( Acceptable chips coming from the first passageway 91a through 953 reach the second passageway 92 and are released from the second passageway 92.

Furthermore, the end 954 (a) of one side and the second (other) line groove 954 of the rotating disk 951 when the rotating disk 951 is rotated to the right (clockwise) by the driving force (motor). At the other end of the side, the first passage 91 (a) and the third passage 93 of the base 9 are each passed, as shown in Scheme 16 (b).

Thus, the incomplete chips in the chip passage body 42 may pass through the second linear groove to reach the first passage 91 and the third passage 93 and then exit the third passage 93. .

Furthermore, when the rotating disk 951 is rotated to the left (counterclockwise) direction by the driving force (the prime mover), the end of one side 954 (a) and the end of the second linear groove 954 of the rotating disk 951 The other side end 954 (b) has a first passage 91 (a) on the bottom 91 and a fourth passage 94 on the passage, respectively, as shown in Scheme 16 (c). Thus, the non-censored chips in the chip passage main body 42 have the second line groove 954 and the first passage 91 (a) of the rotating disk 951 to arrive at the fourth passage 94 of the base 91. Can pass).

It may then exit the fourth passage 94 of the base 91.

The second passageway 92 of the base 91 passes through the first linear groove of the rotating disk 951 and communicates with the first passageway of the base 91 and the third (93) and fourth (94) bases (91). It can be seen from the previous description when the part is closed.

Then, when one side of the third (93) and the fourth (94) passages of the bottom (91) passes through the second line groove (953) to the first passage of the bottom (91), the third (93) of the bottom (91) The other side of the and fourth passageway 94 and the second passageway 92 are closed by the base 91 portion.

Incidentally, the rotating disk 951 in consideration of the linear grooves of the (953) and (954) of the rotating disk (951) to communicate with the passages 91 (a), (92), (93) and (94) of the bottom surface (91). The rotation of) is controlled by an invisible motor controller, which is operated to receive a command from the central processing unit 800 to move.

In the change (modification) to 16 (a) through scheme 16 (c), the sorting operation of the chips can be effective only by the rotating disk motor, the motor control device.

The change (modification) is therefore simpler in structure than the chip sorting time of drafting (14).

Incidentally, according to this invention, the apparatus is usually stopped due to an urgent situation. At this time, the rotating disk 951 is operated to be stopped in the state of draft 16 (c).

Thus, chips not classified at this time are securely directed toward the fourth passage 94.

In addition, as shown in the drawing 16 (b) or 16 (c), the state of the rotating disk 951 is kept out.

As a result, defective or uncensored chips pass through the second groove 954 of the rotating disk 951 and the device (machine) is stopped.

At this time, the rotating disk 951 is operated to stop in the drawing 16 (c) state.

As mentioned above, in the means and the device for the optical check of the shape of the chip and in the device, since the individual TV cameras must be able to capture a clear image of the chip, the chip is irradiated with light directly and indirectly.

In addition, the image of the chip displayed on the monitor screen is processed by the CPU (central processing unit) to go to a predetermined storage location on the screen and perform image processing at high speed.

In addition, the chips are distinguished based on the inspection data obtained from the image processing cross-section so that the chips can move on the chip-path body in a predetermined direction by means of injection holes that are individually stopped at the inspection position and automatically distinguish chips quickly and accurately.

Moreover, the chips move on the chip-path body in a predetermined direction by the injection hole so that the chip can move smoothly on the chip-path body in the predetermined direction, even if static electricity and frictional resistance are generated between the chips and the chip-path body.

As described above, the chip-path body can slide down on the chip-path body under the attraction force of gravity where the chips lean.

In this case, the sliding of the chips on the chip passage main body is facilitated by the injection hole.

The cover plates, except for the fourth cover plate, may be made of a transparent material such as, for example, transparent glass so that the chips can be seen in the thin grooves of the chip passage body.

In addition, both edges of the U-shaped thin groove of the chip-path body are rather sensitive to the image of both edge portions within the perspective of the TV camera that cannot be captured by the resolution function of the TV camera.

As such, these objects can be clearly and efficiently achieved by the above and described above, and changes can be made within the above structure without departing from the scope of the invention, and all objects are contained within the above description or in the accompanying drawings. What is shown will be interpreted as illustrative and not limited judgment.

In addition, the following claims are intended to cover all general and specific features of the invention within the description, and all claims in the language of the invention will be described within this scope.

Claims (28)

(a) supplying chipped components toward the chipping device to push the chipped parts into the chipping device in a predetermined direction; (b) separately dividing the chip-like components to prevent the chip-like components from each other at two predetermined inspection positions, one by one, while pushing the chip-like components into the chip passage device; (c) with regard to the chip-type component, at a position at the predetermined inspection position described above to select an optical image of one of the surface top and the inner surface of the chip-type component by means of a first TV camera as a signal of a television. Successively shining light, and (d) successively at another position of the inspection position intended to select, by means of a second television camera, an optical image of the top surface of the chip-like component and the other inner surface as the signal of the television. (E) a central processing unit and television storage, at least an analog-to-digital conversion unit and the chip as described above, for processing the signal of the television with image processing sections and obtaining data on the appearance of the chip-like component; The television set with image processing cross sections each including the inclination angle of the chip-shaped component at each predetermined inspection position of the passageway. A chip consisting of a step of sending a signal and checking whether the chip is satisfactory or incomplete in its appearance on the basis of the above data, and (f) and classifying the chip-type component based on the above test results. A method of optically inspecting the appearance of molded parts and classifying chipped parts. The method of claim 1, wherein the step (a) is composed of a step of ejecting air to the opposite side of the chip passage device by gently pushing the chip-shaped components into the chip-shaped body. Optically inspecting the appearance of chip-shaped components and classifying chip-shaped components. The chip passage device according to claim 1, wherein the chip passage device has a vertically substantially U-shape by pushing the chip-shaped components along the curved U-shape of the body into the elongated sieve. A method for distinguishing chip-shaped components, characterized in that they are composed of lattice. 4. The elongated sieve of claim 3, wherein said chip-like components are pushed into said elongated sieve along said elongated sieve and bent U-shape. And optically inspecting the appearance of the chip-shaped components, characterized in that it comprises a step of flowing air in a curved U-shaped shape of the chip-shaped components. The chip of claim 1, wherein the chip passage device is inclined at an angle of about 40 to 50 degrees with respect to the horizontal plate due to the sliding of the chip-shaped components into the chip passage device. -Optically inspect the appearance of the shaped components and distinguish chip-shaped components. 4. The elongated sieve of claim 3, wherein the elongated sieve is about 40 DEG relative to the horizontal plate as the chip-like components slide into the elongated sieve along the curved U-shape of the elongated sieve. Method for optically inspecting the appearance of the chip-shaped components, characterized in that the inclination of the angle of the chip-shaped components. 6. The method of claim 5, wherein the step (a) is composed of a step of ejecting air to the opposite side of the chip passage device due to the smooth sliding of the chip-shaped components into the chip passage device. Optically inspecting the appearance of the chip-shaped components and classifying the chip-shaped components. 7. A step according to claim 6, wherein said step (a) causes air to flow in the curved U-shape of said elongated sieve as said chip-shaped components slide smoothly into said chip passage device. And optically inspecting the appearance of the chip-shaped components, and classifying the chip-shaped components. The method of claim 1, wherein the step (f) comprises the steps of classifying the chip-shaped components into three groups: acceptable, incomplete, and unidentified. Optically inspect and distinguish chip-shaped parts. The method of claim 1, wherein the step (f) comprises the chip passage devices, wherein the primary circuit for receiving the chip-shaped component is connected to the primary circuit, and the chip-shaped component is discharged. Secondary circuits received from the chip-type components of the primary circuit evaluated as chip-type components in the step of inspecting the chip-type components, and incomplete parts and uninspected parts of the inspection step branched from the secondary circuits. It is operated by a sorting device based on a base having a tertiary and quaternary circuit that accepts the chip-shaped components of the primary circuit that are evaluated as the part of the circuit, and the secondary, tertiary, Two gate members rotatably placed in the bottom position for opening and closing of the quaternary circuit and an optical appearance of the chip-shaped components, wherein the main body is operated to receive instructions from the image processing section for operating the gate members. Inspected and chip-type How to classify the product. 11. The method of claim 10, wherein the step (f) further comprises a predetermined number of incomplete and uninspected chip-shaped components by the gate member continuing to pass through the third and second circuits, respectively. When orienting the furnace, one of the above-mentioned gate members acts as a way to open the quaternary circuit for the unidentified chip-shaped components and the steps causing the sorting device to stop. A method of optically inspecting the appearance of chip-like components consisting of causative steps and classifying the chip-like components. The method of claim 1, wherein the step (f) comprises the chip passage devices, wherein the primary circuit for receiving the chip-shaped component is connected to the primary circuit, and the chip-shaped component is discharged. Secondary circuits received from the chip-shaped parts of the primary circuit evaluated as chip-type parts in the step of inspecting the chip-shaped parts for the above, and incomplete parts and uninspected parts of the inspection step branched from the secondary circuits. It is operated by a classifier consisting of a base having tertiary and quaternary circuits that accept the chip-shaped components of the primary circuits, which are evaluated as parts of the circuits, corresponding to the branching points of the tertiary and quaternary circuits. And actuating the main body to receive instructions from the two gate members rotatably placed at the bottom for opening and closing of the quaternary circuit and the image processing cross section for actuating the gate members, wherein step (f) is incomplete and uninspected. The planned number of chip-shaped components is different Steps that cause the sorting device to stop when orientating to the tertiary and quaternary circuits as gate members that continue to pass through the tertiary and secondary circuits, and for untested chip-type components. A method for optically inspecting the appearance of a chip-type component and classifying the chip-type component, characterized in that it comprises a step for causing one of the gate members acting by opening the quaternary circuit. The method of claim 1, wherein the separate separation of the chip-shaped components in step (a) is performed with the first pin to prevent the first of the chip-shaped components pushed into the chip passage device. On the contrary, the chip path device is performed with a sorting device composed of second pins to catch the next chip-shaped component, and the first and second pins are placed on the entire chip path device and up and down with respect to the chip path device. Optically inspecting the appearance of the chip-like component, and classifying the chip-shaped component. 2. The method of claim 1, wherein the chip-shaped components are comprised of a count step of the chip-shaped components pushed into the chip passage device. The chip passage device constitutes a base, an elongated sieve mounted on the electroplated base and having a substantially vertical U-shape in the vertical plane, and the elongated sieve provided at least two positions at which the chip-like component is examined. Is made of a transparent material, mounted on an electroplated base, connected to one end of the elongated sieve of the chipping device, and feeding the electroplated chip-shaped component over the elongated sieve of the electrolyzer chipping device. The component feeder and the chip-shaped component from the electrical component feeder to operate flexibly along the U-shaped groove of the elongated sieve of the chip passage device, which is delivered in a predetermined direction. In order to separate one by one the plurality of devices placed in the predetermined positions of the elongated sieves of one chip path device and the chip-shaped parts that have been transmitted one by one. And a chip-type part sorter arranged on the base, in which the chip-shaped part that has been delivered from the parts feeder that was posted and placed near a part of the elongated sieve that was posted was mounted on the base. Optically inspect one of the upper and lower surface portions of the chip-shaped component classified by the sorting device described above at any one of the inspection positions described above, the first optical system, at least one analog digital conversion unit, video memory, The first inspection device constituting the first image processing unit constituting the central processing unit, and the first optical system described above, comprise at least first lighting means for illuminating the beams in a straight line and at an angle toward the chip-shaped component. Electrical chip-shaped portions in which light rays from the first lighting means, which are transmitted as video signals, are shined in a straight line and at an angle. The first side of the camera constitutes a first TV camera for capturing an image, and the first first TV camera is electrically connected to an electrical analog digital conversion unit of the first image processing surface, and immediately after the first first inspection device. A second optical system for optically inspecting the image of the upper and lower surfaces of the chip-shaped component, mounted on the base and mounted at another of the above-described inspection positions, in another of the above-described inspection positions. And a second inspection device constituting a second image processing surface constituting at least one analog digital conversion unit, a video memory and a central processing unit, and the foregoing second optical system is aligned in a straight line towards at least the chip-type component. And the light beams from the second light means for illuminating the beams obliquely and the second light means electricly transmitted as a video signal are straight. A second TV camera for picking up images of the other side of the chip-shaped component, which is illuminated at an angle, is constructed. The second TV camera is electrically connected to the analog digital conversion unit of the second image processing surface. Connected to, and arranged at the other end of the elongated sieve of the previously described chip passage device, and the elongated sieve classifying the chip-shaped parts as described on the basis of the inspection data obtained by the first and second inspection devices described above. And an apparatus for optically inspecting and classifying the chip-shaped parts, which comprises the sorting device for accommodating the chip-shaped parts. 16. The elongated sieve of claim 15, wherein said elongated sieve is inclined at an angle of about 40 [deg.]-150 [deg.] To the horizontal plane, thereby along the said U-shaped groove of the elongated sieve, in which the chip-like component described above is posted. Apparatus for optically inspecting and classifying an electric chip-shaped component, characterized by sliding over an elongated sieve. 16. The device according to claim 15, wherein the electric means for causing the electric chip-shaped component to operate smoothly along the electric U-shaped groove of the electric elongated sieve is located at the electric scheduled position of the electric elongated sieve. Optically inspecting the electrically powered chip-shaped part, comprising an air supply device for causing the formed air passage and the air to flow into the electrically U-shaped groove of the elongated sieve which is passed through the electric passage. And sorting apparatus. 16. The apparatus of claim 15, further comprising a cover plate arranged at a predetermined predetermined position of said elongated sieve, wherein the chip-shaped component described above is provided with an electrical U-shaped groove of said elongated sieve. Therefore, the air supply device that causes the electric means for smooth operation to flow into the air passage formed in the cover plate and the air U-shaped groove of the elongated sieve which is passed through the electric air passage. Apparatus for optically inspecting and classifying the electric chip-shaped components, characterized in that the configuration. 16. The glass plate of claim 15, further comprising a glass plate arranged in a passageway in a center zone of light rays emitted from each of the first and second optical systems of the first and second optical systems. An electric chip characterized by a contrast in brightness between the chip-shaped component parts illuminated by the zone and the electrically-chiped component parts illuminated by the peripheral zone of the uniform central beam of light. Apparatus for optically inspecting and classifying shaped parts. 16. The first and second pins according to claim 15, wherein the sorting device described above is arranged on the electrically extended portion of the elongated sieve described above in such a way that it is arranged along the longitudinal direction of the elongated sieve described above at a predetermined interval therebetween. To configure an actuating device for receiving commands from the first and second image processing planes that cause the two pins and the first and second pins to move vertically relative to the elongated sieves. Apparatus for optically inspecting and classifying the electroplated chip-shaped component. 16. The method according to claim 15, wherein the images of both edge portions are taken into account in consideration of each of the first TV cameras described above. Apparatus for optically inspecting and sorting electrical chip-shaped components, characterized in that both edges of the U-shaped grooves are sharpened. 16. The electric chip-type electric machine according to claim 15, further comprising a shutter device for stopping the chip-type parts separated by the electric separators at each of the electric inspection positions of the electric elongated sieve. Device for optically inspecting and classifying parts. 16. The apparatus of claim 15, further comprising a computing device for calculating the electrically chip-shaped components mounted on the electrically powered base in such a manner as to operate on the previously elongated sieves and to be disposed prior to the electrically sorting device. For optically inspecting and classifying chip-like components. 16. The electric first device of claim 15, wherein the sorting device has first, second, third, and fourth passages, the first first, second, third, and fourth passages arranged side by side with the U-shaped grooves of the elongated body which houses the chip-shaped component. The chip-type extending from the passage and the first passage described above, which extends as a connection of the first passage, and which is determined to be accommodated in the first and second inspection devices for discharging the previously acceptable chip-shaped component. Determination of defects in the first and second inspection devices for discharging chip-like parts, which are branched from the second passage and the second passage for accommodating the component, and which are defective and uninspected. A chip-shaped component for accommodating the chip-shaped component from the first passage described above and a chip-type component which is determined to be defective among the chip-shaped components which cannot be inspected in the first and second inspection apparatuses described above. A substrate having second and fourth passages; Two doors corresponding in position to the branch of the fourth passage, rotatably arranged at the point of the substrate to open and close the second, third, and fourth passages described above; members) and an operating unit for receiving commands from the first and second image processing units, which are electrically operated to operate the door member. The retainer described above essentially has a warped recess, a first passage connected to one end of the recess and a second, third and fourth passages connected to the recess. The first U-shaped groove of one extension and the other end are connected and extend from the recessed portion and the first passage for receiving the chip-shaped component from the extension. It is housed in the first and second inspection devices described above, in parallel with one passage, facing the shape portion of the first passage described above and for discharging the chip-shaped component in the form of an acceptable chip described above. A chip which extends in such a way as to be inserted between the second passage for receiving the chip-shaped component and the passage for passage from the portion of the recess that is determined to be capable of -brother In order to release the product, it has a chip-shaped component which is determined to be defective and a third third passage for accommodating the chip-shaped component which cannot be inspected in the first and second inspection apparatuses described above. The first substrate is accommodated in the electrical recess of the substrate, and the first passage and the second passage are exchanged with each other, and are formed along the centerline of the rotating disk. A second internal groove which allows the first linear groove, the first passage described above and the third passage described above to communicate with each other, and the fourth passage communicated by the first passage described above to communicate with each other; A circular rotating disk having a second inner groove formed in a manner in which an axis thereof is slightly displaced from the centerline of the rotating disk in the rotating disk, and intersected with the inner inner groove, The first passage and the second passage, which are operated by the screw, are rotated in an alternating manner by passing through the first groove of the rotating disk and the third passage, which is communicated with each other. Rotate in such a way that they communicate with each other through the second grooves of the developed rotating disk, or that the first passage and the fourth passages mentioned communicate with each other through the second grooves of the rotating disk. Apparatus for optically inspecting and classifying chip-shaped components, characterized in that consisting of an operating device for performing commands from the first and second image processing apparatus described above. 27. The electric disk of claim 25, wherein the electric actuator is arranged in a manner below the electric substrate of the electric separator, in which the rotating shaft penetrates the electric substrate of the electric separator. It is mounted on the electric rotation shaft of the motor, and comprises a motor control device for receiving a command from the first and second image processing unit which is electric to control the rotation of the motor. Devices for optically inspecting and sorting. 16. The optical system of claim 15, wherein the first and second optical systems described above comprise reflectors for reflecting a portion of the light beams, which are irradiated at an angle to the chip-like components on the chip passages electrically from the electrical optics. Apparatus for optically inspecting and classifying chip-shaped components, characterized in that the. 16. The device of claim 15, wherein said first and second optical devices are connected to said lighting device through the first fiber cable and are obliquely from said lighting device for the chip-shaped component on said chip passage. Light from the illuminator, which is connected to the first light irradiation head for irradiating the light, and the chip-shaped component which is connected to the illuminating device through the second optical fiber cable and is above the chip passage. Apparatus for optically inspecting and classifying chip-shaped components, characterized in that it comprises a second light irradiation head for irradiating the light straight.

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