KR0121215Y1 - Cleaning apparatus for wafer - Google Patents
Cleaning apparatus for wafer Download PDFInfo
- Publication number
- KR0121215Y1 KR0121215Y1 KR92000374U KR920000374U KR0121215Y1 KR 0121215 Y1 KR0121215 Y1 KR 0121215Y1 KR 92000374 U KR92000374 U KR 92000374U KR 920000374 U KR920000374 U KR 920000374U KR 0121215 Y1 KR0121215 Y1 KR 0121215Y1
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- KR
- South Korea
- Prior art keywords
- wafer
- deionized water
- water supply
- cleaning
- present
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 고안은 웨이퍼를 세정시키는 탈이온수공급관이 웨이퍼가 담겨진 웨이퍼 카세트 내의 상부위치로 공기피스톤에 의해서 이동하여 상기 웨이퍼 카세트의 전체부위에 효과적으로 탈리온수를 사용해서 세정할 수 있으므로 인한 세정장치의 효율성 및 신뢰성을 대폭 향상시킨 것이다.The present invention is a deionized water supply pipe for cleaning the wafer is moved to the upper position in the wafer cassette containing the wafer by the air piston to effectively clean the entire area of the wafer cassette using the deionized water, the efficiency and reliability of the cleaning device It is greatly improved.
이를 위해, 본 고안은 세정조(1)의 양측에 설치된 한쌍의 탈이온수 공급관(2a)(2d)을 회동가능하게 링크(2)로 연결하여 공기피스톤(6)의 구동에 따라 탈이온수 공급관(2a)(2d)이 회동하도록 된 웨이퍼 세정장치이다.To this end, the present invention connects a pair of deionized water supply pipes (2a) (2d) installed on both sides of the cleaning tank (1) to the link (2) rotatably so that the deionized water supply pipe (2) in accordance with the operation of the air piston (6) 2a) is a wafer cleaning apparatus in which 2d is rotated.
Description
제1도는 종래 웨이퍼 세정장치의 사용상태도1 is a state diagram used in the conventional wafer cleaning apparatus
제2도는 본 고안의 설치상태를 나타낸 사시도2 is a perspective view showing the installation state of the subject innovation
제3도는 본 고안의 사용상태도3 is a state of use of the present invention
*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1:세정조 2:링크1: washing tank 2: link
2a,2b:탈이온수 공급관 3:웨이퍼2a, 2b: Deionized water supply pipe 3: wafer
4:웨이퍼 카세트 6:공기피스톤4: Wafer cassette 6: Air piston
본 고안은 웨이퍼 세정장치에 관한 것으로서, 더욱 상세하게는 웨이퍼가 담겨진 웨이퍼 카세트의 하단부위까지 탈이온수(DI)를 사용해서 효과적으로 세정할 수 있도록 한 것이다.The present invention relates to a wafer cleaning apparatus, and more particularly, to effectively clean up to the lower end of the wafer cassette containing the wafer by using deionized water (DI).
종래의 웨이퍼 세정장치는 제1도에 나타낸 바와같이, 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)가 세정조(1)에 상부로 부터 들어가서 세정조(1)상부에 설치된 한쌍의 탈이온수 공급관(2a)(2b)으로 부터 탈이온수가 분사되어 웨이퍼(3)를 세정했다.In the conventional wafer cleaning apparatus, as shown in FIG. 1, a pair of deionized water supply pipes in which the wafer cassette 4 containing the wafers 3 enters the cleaning tank 1 from above is provided on the cleaning tank 1 ( Deionized water was injected from 2a) (2b) to clean the wafer 3.
그러나, 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)가 세정조(1)에 안전하게 들어가기 위해 상기 세정조(1) 상부에 설치된 탈이온수 공급관(2a)(2b)은 상기 웨이퍼 카세트(4)의 넓이보다 큰폭을 유지해야 하는데에 따른 제1도에 나타낸 바와같이, 상기 웨이퍼(3)하단에 세정효과가 미치지 않는 부위가 필연적으로 발생했다.However, the deionized water supply pipes 2a and 2b provided on the cleaning tank 1 in order to safely enter the wafer cassette 4 containing the wafer 3 into the cleaning tank 1 have a width of the wafer cassette 4. As shown in FIG. 1 to maintain a larger width, a portion of the lower portion of the wafer 3 that does not have a cleaning effect necessarily occurred.
또한, 웨이퍼(3)를 고정시키기 위한 웨이퍼 카세트(4)의 하단에 형성된 통공(8)에 의해 상기 웨이퍼(3)의 하단에서도 세정효과가 떨어지게 되는 등의 문제점이 있었다.In addition, the through hole 8 formed at the lower end of the wafer cassette 4 for fixing the wafer 3 has a problem that the cleaning effect is lowered at the lower end of the wafer 3.
본 고안은 상기한 제반문제점을 해결하기 위한 것으로서, 본 고안은 탈이온수를 사용해서 웨이퍼가 담겨진 웨이퍼 카세트의 하단부위까지 효과적으로 세정할 수 있는 웨이퍼 세정장치를 제공하는데 그 목적이 있다.The present invention is to solve the above-mentioned problems, the present invention is to provide a wafer cleaning apparatus that can effectively clean the lower end of the wafer cassette containing the wafer using deionized water.
상기한 목적을 달성하기 위해 본 고안은 세정조의 양측에 한쌍의 탈이온수 공급관을 설치하도록 된 것에 있어서, 탈이온수 공급관을 회동가능하게 링크로 연결하여 공기피스톤의 구동에 따라 탈이온수 공급관이 회동하도록 된 웨이퍼 세정장치이다.In order to achieve the above object, the present invention is to install a pair of deionized water supply pipe on both sides of the cleaning tank, by connecting the deionized water supply pipe to the link rotatably to rotate the deionized water supply pipe in accordance with the operation of the air piston Wafer cleaning device.
이하, 본 고안의 일실시예를 첨부된 도면 제2도 내지 제3도를 참조하여 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 2 to 3.
제2도는 본 고안의 설치상태를 나타낸 사시도이고, 제3도는 본 고안의 사용상태도로서, 세정조(1)의 양측에 링크(2)로서 연결된 한쌍의 탈이온수 공급관(2a)(2b)이 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)내의 상부에서 전·후로 회전가능하게 설치되고, 상기 탈이온수 공급관(2a)(2b)의 내측 둘레면에는 탈이온수를 공급하기 위한 노즐(5)이 설치된다.2 is a perspective view showing an installation state of the present invention, and FIG. 3 is a use state diagram of the present invention, in which a pair of deionized water supply pipes 2a and 2b connected to both sides of the cleaning tank 1 as a link 2 are wafers. It is rotatably installed forward and backward from the upper part in the wafer cassette 4 containing (3), and the nozzle 5 for supplying deionized water is provided in the inner peripheral surface of the deionized water supply pipe 2a, 2b. .
또한, 탈이온수 공급관(2a)(2b)의 일측하부에는 각각 상기 탈이온수 공급관(2a)(2d)을 전·후로 작동시키는 공기피스톤(6)이 설치되고, 상기 탈이온수 공급관(2a)(2b)의 일측에는 탈이온수를 공급하는 공급라인(7)이 연결되어 구성된다.In addition, an air piston 6 for operating the deionized water supply pipes 2a and 2d before and after the deionized water supply pipes 2a and 2b, respectively, is installed, and the deionized water supply pipes 2a and 2b are respectively provided. One side of the) is configured to be connected to the supply line 7 for supplying deionized water.
이와같이 구성된 본 고안은 제2도내지 제3도에 나타낸 바와같이, 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)가 세정조(1)에 들어가면, 상기 세정조(1)의 양측에 설치된 한상의 탈이온수 공급관(2a)(2b)이 공기피스톤(6)에 의해 상기 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)내의 상부위치로 이동하여 웨이퍼(3)를 세정하게 된다.According to the present invention configured as described above, as shown in FIGS. 2 to 3, when the wafer cassette 4 containing the wafer 3 enters the cleaning tank 1, the defrosting of the upper limit provided on both sides of the cleaning tank 1 is performed. The ionized water supply pipes 2a and 2b are moved to an upper position in the wafer cassette 4 in which the wafer 3 is held by the air piston 6 to clean the wafer 3.
이때 탈이온수 공급관(2a)(2b)이 웨이퍼(3)가 담겨진 웨이퍼 카세트(4)내의 상부위치에서 탈이온수를 상기 웨이퍼(3)에 분사시키므로 인한 제3도에 나타낸 바와 같이, 상기 웨이퍼 카세트(4)의 전부위에 효과적으로 탈이온수를 사용해서 세정할 수 있게 된다.At this time, as shown in FIG. 3, the deionized water supply pipes 2a and 2b spray deionized water onto the wafer 3 at an upper position in the wafer cassette 4 in which the wafer 3 is contained. It is possible to effectively use deionized water over all the parts of 4).
이상에서와 같이, 본 고안은 웨이퍼(3)를 세정시키는 탈이온수 공급관(2a)(2b)이 웨에퍼(3)가 담겨진 웨이퍼 카세트(4)내의 상부위치로 공기피스톤(6)에 의해서 이동하여 상기 웨이퍼 카세트(4)의 전체부위에 효과적으로 탈이온수를 사용해서 세정할 수 있으므로 인한 세정장치의 효율성 및 신뢰성을 대폭 향상시킨 매우 유용한 고안이다.As described above, the present invention moves the deionized water supply pipe (2a) (2b) for cleaning the wafer (3) by the air piston (6) to the upper position in the wafer cassette (4) containing the wafer (3) By using the deionized water to effectively clean the entire portion of the wafer cassette 4 is a very useful design that greatly improved the efficiency and reliability of the cleaning device.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92000374U KR0121215Y1 (en) | 1992-01-14 | 1992-01-14 | Cleaning apparatus for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92000374U KR0121215Y1 (en) | 1992-01-14 | 1992-01-14 | Cleaning apparatus for wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930018772U KR930018772U (en) | 1993-08-21 |
| KR0121215Y1 true KR0121215Y1 (en) | 1998-08-01 |
Family
ID=19327813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92000374U KR0121215Y1 (en) | 1992-01-14 | 1992-01-14 | Cleaning apparatus for wafer |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0121215Y1 (en) |
-
1992
- 1992-01-14 KR KR92000374U patent/KR0121215Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930018772U (en) | 1993-08-21 |
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