JPWO2025041384A1 - - Google Patents

Info

Publication number
JPWO2025041384A1
JPWO2025041384A1 JP2025541301A JP2025541301A JPWO2025041384A1 JP WO2025041384 A1 JPWO2025041384 A1 JP WO2025041384A1 JP 2025541301 A JP2025541301 A JP 2025541301A JP 2025541301 A JP2025541301 A JP 2025541301A JP WO2025041384 A1 JPWO2025041384 A1 JP WO2025041384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025541301A
Other languages
Japanese (ja)
Other versions
JPWO2025041384A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025041384A1 publication Critical patent/JPWO2025041384A1/ja
Publication of JPWO2025041384A5 publication Critical patent/JPWO2025041384A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2025541301A 2023-08-23 2024-05-13 Pending JPWO2025041384A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023135597 2023-08-23
PCT/JP2024/017566 WO2025041384A1 (ja) 2023-08-23 2024-05-13 セラミック基板及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2025041384A1 true JPWO2025041384A1 (enExample) 2025-02-27
JPWO2025041384A5 JPWO2025041384A5 (enExample) 2026-02-04

Family

ID=94731848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025541301A Pending JPWO2025041384A1 (enExample) 2023-08-23 2024-05-13

Country Status (4)

Country Link
US (1) US20260089838A1 (enExample)
JP (1) JPWO2025041384A1 (enExample)
CN (1) CN121729988A (enExample)
WO (1) WO2025041384A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08172273A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd セラミック配線基板及びその実装構造体
JP5977180B2 (ja) * 2012-03-05 2016-08-24 京セラ株式会社 配線基板
JP6026898B2 (ja) * 2013-01-25 2016-11-16 京セラ株式会社 セラミック配線基板
JP6753423B2 (ja) * 2018-01-11 2020-09-09 株式会社村田製作所 積層コイル部品
JP7535005B2 (ja) * 2021-03-31 2024-08-15 Tdk株式会社 積層電子部品

Also Published As

Publication number Publication date
CN121729988A (zh) 2026-03-24
US20260089838A1 (en) 2026-03-26
WO2025041384A1 (ja) 2025-02-27

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251104

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251104