JPWO2025027927A1 - - Google Patents
Info
- Publication number
- JPWO2025027927A1 JPWO2025027927A1 JP2024562375A JP2024562375A JPWO2025027927A1 JP WO2025027927 A1 JPWO2025027927 A1 JP WO2025027927A1 JP 2024562375 A JP2024562375 A JP 2024562375A JP 2024562375 A JP2024562375 A JP 2024562375A JP WO2025027927 A1 JPWO2025027927 A1 JP WO2025027927A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023124943 | 2023-07-31 | ||
| JP2023124943 | 2023-07-31 | ||
| PCT/JP2024/010616 WO2025027927A1 (ja) | 2023-07-31 | 2024-03-18 | 圧電振動素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025027927A1 true JPWO2025027927A1 (https=) | 2025-02-06 |
| JP7691035B1 JP7691035B1 (ja) | 2025-06-11 |
| JPWO2025027927A5 JPWO2025027927A5 (https=) | 2025-07-08 |
Family
ID=94394983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562375A Active JP7691035B1 (ja) | 2023-07-31 | 2024-03-18 | 圧電振動素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250183872A1 (https=) |
| JP (1) | JP7691035B1 (https=) |
| CN (1) | CN119769028A (https=) |
| WO (1) | WO2025027927A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6035808B2 (ja) * | 2012-03-27 | 2016-11-30 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、及び電子機器 |
| JP2015065554A (ja) * | 2013-09-25 | 2015-04-09 | 日本電波工業株式会社 | 水晶振動片及び水晶デバイス |
| JP6842682B2 (ja) * | 2017-09-13 | 2021-03-17 | 株式会社村田製作所 | 水晶振動素子およびその製造方法 |
| WO2021045094A1 (ja) * | 2019-09-04 | 2021-03-11 | 株式会社村田製作所 | 圧電振動子及びその製造方法 |
| JP2022153702A (ja) * | 2021-03-30 | 2022-10-13 | 株式会社大真空 | 圧電フィルタ |
-
2024
- 2024-03-18 JP JP2024562375A patent/JP7691035B1/ja active Active
- 2024-03-18 WO PCT/JP2024/010616 patent/WO2025027927A1/ja active Pending
- 2024-03-18 CN CN202480003774.1A patent/CN119769028A/zh active Pending
-
2025
- 2025-02-10 US US19/049,138 patent/US20250183872A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7691035B1 (ja) | 2025-06-11 |
| WO2025027927A1 (ja) | 2025-02-06 |
| US20250183872A1 (en) | 2025-06-05 |
| CN119769028A (zh) | 2025-04-04 |
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