JPWO2024253108A5 - - Google Patents

Info

Publication number
JPWO2024253108A5
JPWO2024253108A5 JP2024565311A JP2024565311A JPWO2024253108A5 JP WO2024253108 A5 JPWO2024253108 A5 JP WO2024253108A5 JP 2024565311 A JP2024565311 A JP 2024565311A JP 2024565311 A JP2024565311 A JP 2024565311A JP WO2024253108 A5 JPWO2024253108 A5 JP WO2024253108A5
Authority
JP
Japan
Prior art keywords
thermally expandable
expandable microcapsules
curable composition
line passing
top end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024565311A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024253108A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/020441 external-priority patent/WO2024253108A1/ja
Publication of JPWO2024253108A1 publication Critical patent/JPWO2024253108A1/ja
Publication of JPWO2024253108A5 publication Critical patent/JPWO2024253108A5/ja
Pending legal-status Critical Current

Links

JP2024565311A 2023-06-05 2024-06-05 Pending JPWO2024253108A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023092769 2023-06-05
PCT/JP2024/020441 WO2024253108A1 (ja) 2023-06-05 2024-06-05 硬化性組成物

Publications (2)

Publication Number Publication Date
JPWO2024253108A1 JPWO2024253108A1 (https=) 2024-12-12
JPWO2024253108A5 true JPWO2024253108A5 (https=) 2026-02-26

Family

ID=93796059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565311A Pending JPWO2024253108A1 (https=) 2023-06-05 2024-06-05

Country Status (3)

Country Link
JP (1) JPWO2024253108A1 (https=)
TW (1) TW202504959A (https=)
WO (1) WO2024253108A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554559B (zh) * 2010-12-28 2016-10-21 Sekisui Chemical Co Ltd And a resin composition for foam molding
JP2021059044A (ja) * 2019-10-04 2021-04-15 ナブテスコ株式会社 造形用透明樹脂組成物および立体造形物
JP6957776B1 (ja) * 2020-05-01 2021-11-02 積水化学工業株式会社 熱膨張性マイクロカプセル
CN115591491A (zh) * 2021-07-07 2023-01-13 香港科技大学(Hk) 一种制备剪切增稠液体微胶囊的方法和由此获得的剪切增稠液体微胶囊及其应用
JP2024175155A (ja) * 2021-11-09 2024-12-18 東レエンジニアリング株式会社 立体造形物の製造方法

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