JPWO2024253108A5 - - Google Patents
Info
- Publication number
- JPWO2024253108A5 JPWO2024253108A5 JP2024565311A JP2024565311A JPWO2024253108A5 JP WO2024253108 A5 JPWO2024253108 A5 JP WO2024253108A5 JP 2024565311 A JP2024565311 A JP 2024565311A JP 2024565311 A JP2024565311 A JP 2024565311A JP WO2024253108 A5 JPWO2024253108 A5 JP WO2024253108A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally expandable
- expandable microcapsules
- curable composition
- line passing
- top end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023092769 | 2023-06-05 | ||
| PCT/JP2024/020441 WO2024253108A1 (ja) | 2023-06-05 | 2024-06-05 | 硬化性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024253108A1 JPWO2024253108A1 (https=) | 2024-12-12 |
| JPWO2024253108A5 true JPWO2024253108A5 (https=) | 2026-02-26 |
Family
ID=93796059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024565311A Pending JPWO2024253108A1 (https=) | 2023-06-05 | 2024-06-05 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024253108A1 (https=) |
| TW (1) | TW202504959A (https=) |
| WO (1) | WO2024253108A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI554559B (zh) * | 2010-12-28 | 2016-10-21 | Sekisui Chemical Co Ltd | And a resin composition for foam molding |
| JP2021059044A (ja) * | 2019-10-04 | 2021-04-15 | ナブテスコ株式会社 | 造形用透明樹脂組成物および立体造形物 |
| JP6957776B1 (ja) * | 2020-05-01 | 2021-11-02 | 積水化学工業株式会社 | 熱膨張性マイクロカプセル |
| CN115591491A (zh) * | 2021-07-07 | 2023-01-13 | 香港科技大学(Hk) | 一种制备剪切增稠液体微胶囊的方法和由此获得的剪切增稠液体微胶囊及其应用 |
| JP2024175155A (ja) * | 2021-11-09 | 2024-12-18 | 東レエンジニアリング株式会社 | 立体造形物の製造方法 |
-
2024
- 2024-06-05 JP JP2024565311A patent/JPWO2024253108A1/ja active Pending
- 2024-06-05 TW TW113120817A patent/TW202504959A/zh unknown
- 2024-06-05 WO PCT/JP2024/020441 patent/WO2024253108A1/ja not_active Ceased
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