JPWO2024252830A1 - - Google Patents
Info
- Publication number
- JPWO2024252830A1 JPWO2024252830A1 JP2025525991A JP2025525991A JPWO2024252830A1 JP WO2024252830 A1 JPWO2024252830 A1 JP WO2024252830A1 JP 2025525991 A JP2025525991 A JP 2025525991A JP 2025525991 A JP2025525991 A JP 2025525991A JP WO2024252830 A1 JPWO2024252830 A1 JP WO2024252830A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/474—Batteries in combination with leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/868—Die-attach connectors and strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023092158 | 2023-06-05 | ||
| PCT/JP2024/016981 WO2024252830A1 (ja) | 2023-06-05 | 2024-05-07 | 半導体装置および車両 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024252830A1 true JPWO2024252830A1 (https=) | 2024-12-12 |
| JPWO2024252830A5 JPWO2024252830A5 (https=) | 2026-03-05 |
Family
ID=93795287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025525991A Pending JPWO2024252830A1 (https=) | 2023-06-05 | 2024-05-07 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20260090403A1 (https=) |
| JP (1) | JPWO2024252830A1 (https=) |
| WO (1) | WO2024252830A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0427148A (ja) * | 1990-05-22 | 1992-01-30 | Seiko Epson Corp | 半導体装置用リードフレーム |
| JP5620769B2 (ja) * | 2010-09-24 | 2014-11-05 | 新電元工業株式会社 | 樹脂封止型半導体装置の製造方法及び樹脂封止型半導体装置 |
| JP2015095474A (ja) * | 2013-11-08 | 2015-05-18 | アイシン精機株式会社 | 電子部品パッケージ |
| US10658276B2 (en) * | 2016-02-16 | 2020-05-19 | Tesla, Inc. | Device with top-side base plate |
-
2024
- 2024-05-07 WO PCT/JP2024/016981 patent/WO2024252830A1/ja not_active Ceased
- 2024-05-07 JP JP2025525991A patent/JPWO2024252830A1/ja active Pending
-
2025
- 2025-11-28 US US19/403,353 patent/US20260090403A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260090403A1 (en) | 2026-03-26 |
| WO2024252830A1 (ja) | 2024-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251126 |