JPWO2024252672A1 - - Google Patents
Info
- Publication number
- JPWO2024252672A1 JPWO2024252672A1 JP2025525915A JP2025525915A JPWO2024252672A1 JP WO2024252672 A1 JPWO2024252672 A1 JP WO2024252672A1 JP 2025525915 A JP2025525915 A JP 2025525915A JP 2025525915 A JP2025525915 A JP 2025525915A JP WO2024252672 A1 JPWO2024252672 A1 JP WO2024252672A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/021559 WO2024252672A1 (ja) | 2023-06-09 | 2023-06-09 | 基板収納容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024252672A1 true JPWO2024252672A1 (https=) | 2024-12-12 |
| JPWO2024252672A5 JPWO2024252672A5 (https=) | 2026-04-06 |
Family
ID=93795858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025525915A Pending JPWO2024252672A1 (https=) | 2023-06-09 | 2023-06-09 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024252672A1 (https=) |
| KR (1) | KR20260020094A (https=) |
| CN (1) | CN121100400A (https=) |
| TW (1) | TW202448781A (https=) |
| WO (1) | WO2024252672A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH062272Y2 (ja) * | 1988-02-25 | 1994-01-19 | 信越ポリマー株式会社 | ウェーハ容器の上部緩衝板 |
| JP3938293B2 (ja) * | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | 精密基板収納容器及びその押さえ部材 |
| JP5072067B2 (ja) * | 2006-11-27 | 2012-11-14 | 信越ポリマー株式会社 | 基板収納容器 |
| WO2018185894A1 (ja) * | 2017-04-05 | 2018-10-11 | ミライアル株式会社 | 基板収納容器 |
-
2023
- 2023-06-09 JP JP2025525915A patent/JPWO2024252672A1/ja active Pending
- 2023-06-09 KR KR1020257039870A patent/KR20260020094A/ko active Pending
- 2023-06-09 WO PCT/JP2023/021559 patent/WO2024252672A1/ja not_active Ceased
- 2023-06-09 CN CN202380098079.3A patent/CN121100400A/zh active Pending
-
2024
- 2024-06-07 TW TW113121297A patent/TW202448781A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202448781A (zh) | 2024-12-16 |
| CN121100400A (zh) | 2025-12-09 |
| KR20260020094A (ko) | 2026-02-10 |
| WO2024252672A1 (ja) | 2024-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251202 |