JPWO2024247739A1 - - Google Patents
Info
- Publication number
- JPWO2024247739A1 JPWO2024247739A1 JP2025523456A JP2025523456A JPWO2024247739A1 JP WO2024247739 A1 JPWO2024247739 A1 JP WO2024247739A1 JP 2025523456 A JP2025523456 A JP 2025523456A JP 2025523456 A JP2025523456 A JP 2025523456A JP WO2024247739 A1 JPWO2024247739 A1 JP WO2024247739A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023088226 | 2023-05-29 | ||
| PCT/JP2024/018095 WO2024247739A1 (ja) | 2023-05-29 | 2024-05-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024247739A1 true JPWO2024247739A1 (https=) | 2024-12-05 |
| JPWO2024247739A5 JPWO2024247739A5 (https=) | 2026-03-02 |
Family
ID=93657807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025523456A Pending JPWO2024247739A1 (https=) | 2023-05-29 | 2024-05-16 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024247739A1 (https=) |
| WO (1) | WO2024247739A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100983A (ja) * | 2001-09-21 | 2003-04-04 | Kyocera Corp | セラミック回路基板 |
| JP4100332B2 (ja) * | 2003-11-12 | 2008-06-11 | 株式会社デンソー | 電子装置およびその製造方法 |
| JP4759384B2 (ja) * | 2005-12-20 | 2011-08-31 | 昭和電工株式会社 | 半導体モジュール |
| WO2009150875A1 (ja) * | 2008-06-12 | 2009-12-17 | 株式会社安川電機 | パワーモジュールおよびその制御方法 |
| WO2011155165A1 (ja) * | 2010-06-11 | 2011-12-15 | パナソニック株式会社 | 樹脂封止型半導体装置及びその製造方法 |
| WO2016125673A1 (ja) * | 2015-02-02 | 2016-08-11 | 株式会社村田製作所 | 半導体モジュールおよびパワーコントロールユニット |
| JP6909629B2 (ja) * | 2017-05-10 | 2021-07-28 | ローム株式会社 | 半導体装置 |
| JP7317626B2 (ja) * | 2019-08-08 | 2023-07-31 | 株式会社三社電機製作所 | 半導体モジュール |
| JP7535909B2 (ja) * | 2020-10-20 | 2024-08-19 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法ならびに電力変換装置 |
-
2024
- 2024-05-16 WO PCT/JP2024/018095 patent/WO2024247739A1/ja not_active Ceased
- 2024-05-16 JP JP2025523456A patent/JPWO2024247739A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024247739A1 (ja) | 2024-12-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251114 |