JPWO2024241573A1 - - Google Patents
Info
- Publication number
- JPWO2024241573A1 JPWO2024241573A1 JP2023553732A JP2023553732A JPWO2024241573A1 JP WO2024241573 A1 JPWO2024241573 A1 JP WO2024241573A1 JP 2023553732 A JP2023553732 A JP 2023553732A JP 2023553732 A JP2023553732 A JP 2023553732A JP WO2024241573 A1 JPWO2024241573 A1 JP WO2024241573A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lenses (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019519 WO2024241573A1 (ja) | 2023-05-25 | 2023-05-25 | 反射型ビーム径可変光学系、レーザ加工ヘッドおよびレーザ加工機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7399367B1 JP7399367B1 (ja) | 2023-12-15 |
| JPWO2024241573A1 true JPWO2024241573A1 (https=) | 2024-11-28 |
| JPWO2024241573A5 JPWO2024241573A5 (https=) | 2025-04-30 |
Family
ID=89122217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023553732A Active JP7399367B1 (ja) | 2023-05-25 | 2023-05-25 | 反射型ビーム径可変光学系、レーザ加工ヘッドおよびレーザ加工機 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7399367B1 (https=) |
| WO (2) | WO2024241573A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102024111974A1 (de) * | 2024-04-29 | 2025-10-30 | Oliver Scheifinger | Lichtbündelungseinrichtung zum Konzentrieren von Licht für photoelektrische, photothermische und faseroptische Anwendungen, Einrichtung zum Ausrichten zumindest einer Lichtbündelungseinrichtung |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3538445B2 (ja) * | 1993-11-29 | 2004-06-14 | 東京電力株式会社 | レーザビーム伝送装置 |
| US5561544A (en) * | 1995-03-06 | 1996-10-01 | Macken; John A. | Laser scanning system with reflecting optics |
| JP5368261B2 (ja) * | 2008-11-06 | 2013-12-18 | ギガフォトン株式会社 | 極端紫外光源装置、極端紫外光源装置の制御方法 |
| JP2012137510A (ja) * | 2009-07-27 | 2012-07-19 | Chihiro Suzuki | 光学ユニット |
| WO2016116147A1 (de) * | 2015-01-21 | 2016-07-28 | Trumpf Lasersystems For Semiconductor Manufacturing Gmbh | Strahlführungseinrichtung, euv-strahlungserzeugungsvorrichtung und verfahren zum einstellen eines strahldurchmessers und eines öffnungswinkels eines laserstrahls |
-
2023
- 2023-05-25 WO PCT/JP2023/019519 patent/WO2024241573A1/ja not_active Ceased
- 2023-05-25 JP JP2023553732A patent/JP7399367B1/ja active Active
- 2023-11-15 WO PCT/JP2023/041104 patent/WO2024241606A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024241606A1 (ja) | 2024-11-28 |
| JP7399367B1 (ja) | 2023-12-15 |
| WO2024241573A1 (ja) | 2024-11-28 |
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