JPWO2024219244A5 - - Google Patents

Info

Publication number
JPWO2024219244A5
JPWO2024219244A5 JP2025515156A JP2025515156A JPWO2024219244A5 JP WO2024219244 A5 JPWO2024219244 A5 JP WO2024219244A5 JP 2025515156 A JP2025515156 A JP 2025515156A JP 2025515156 A JP2025515156 A JP 2025515156A JP WO2024219244 A5 JPWO2024219244 A5 JP WO2024219244A5
Authority
JP
Japan
Prior art keywords
island
thickness direction
recess
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025515156A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024219244A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/013901 external-priority patent/WO2024219244A1/ja
Publication of JPWO2024219244A1 publication Critical patent/JPWO2024219244A1/ja
Publication of JPWO2024219244A5 publication Critical patent/JPWO2024219244A5/ja
Pending legal-status Critical Current

Links

JP2025515156A 2023-04-21 2024-04-04 Pending JPWO2024219244A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023070164 2023-04-21
PCT/JP2024/013901 WO2024219244A1 (ja) 2023-04-21 2024-04-04 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024219244A1 JPWO2024219244A1 (cg-RX-API-DMAC7.html) 2024-10-24
JPWO2024219244A5 true JPWO2024219244A5 (cg-RX-API-DMAC7.html) 2026-01-26

Family

ID=93152872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515156A Pending JPWO2024219244A1 (cg-RX-API-DMAC7.html) 2023-04-21 2024-04-04

Country Status (2)

Country Link
JP (1) JPWO2024219244A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024219244A1 (cg-RX-API-DMAC7.html)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290032A (ja) * 1989-12-14 1990-11-29 Hitachi Ltd レジンモールド型半導体装置の製造方法
JP2531088B2 (ja) * 1993-04-30 1996-09-04 日本電気株式会社 半導体装置およびその製造方法
JPH08204099A (ja) * 1995-01-31 1996-08-09 Rohm Co Ltd 半導体装置の構造及び形成方法
JP5180722B2 (ja) * 2008-07-30 2013-04-10 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
JP5341473B2 (ja) * 2008-10-31 2013-11-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置およびその製造方法
JP6228904B2 (ja) * 2014-10-16 2017-11-08 新電元工業株式会社 半導体装置の製造方法、半導体装置、金型およびリードフレーム
US11502014B2 (en) * 2018-09-19 2022-11-15 Rohm Co., Ltd. Semiconductor device
US20230245954A1 (en) * 2020-07-13 2023-08-03 Rohm Co., Ltd. Semiconductor device, and production method for semiconductor device

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