JPWO2024204569A1 - - Google Patents
Info
- Publication number
- JPWO2024204569A1 JPWO2024204569A1 JP2025511172A JP2025511172A JPWO2024204569A1 JP WO2024204569 A1 JPWO2024204569 A1 JP WO2024204569A1 JP 2025511172 A JP2025511172 A JP 2025511172A JP 2025511172 A JP2025511172 A JP 2025511172A JP WO2024204569 A1 JPWO2024204569 A1 JP WO2024204569A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023059448 | 2023-03-31 | ||
| JP2023059447 | 2023-03-31 | ||
| JP2023059449 | 2023-03-31 | ||
| PCT/JP2024/012708 WO2024204569A1 (ja) | 2023-03-31 | 2024-03-28 | 基板分離装置、基板処理装置および基板分離方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024204569A1 true JPWO2024204569A1 (enExample) | 2024-10-03 |
Family
ID=92906751
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511173A Pending JPWO2024204570A1 (enExample) | 2023-03-31 | 2024-03-28 | |
| JP2025511172A Pending JPWO2024204569A1 (enExample) | 2023-03-31 | 2024-03-28 | |
| JP2025511174A Pending JPWO2024204571A1 (enExample) | 2023-03-31 | 2024-03-28 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511173A Pending JPWO2024204570A1 (enExample) | 2023-03-31 | 2024-03-28 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511174A Pending JPWO2024204571A1 (enExample) | 2023-03-31 | 2024-03-28 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20260033274A1 (enExample) |
| EP (1) | EP4693370A1 (enExample) |
| JP (3) | JPWO2024204570A1 (enExample) |
| KR (3) | KR20250165420A (enExample) |
| CN (3) | CN120814026A (enExample) |
| TW (3) | TW202441676A (enExample) |
| WO (3) | WO2024204570A1 (enExample) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU706524B2 (en) * | 1996-03-28 | 1999-06-17 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for laminating boards |
| JP2877800B2 (ja) * | 1997-03-27 | 1999-03-31 | キヤノン株式会社 | 複合部材の分離方法、分離された部材、分離装置、半導体基体の作製方法および半導体基体 |
| JP4323577B2 (ja) * | 1997-12-26 | 2009-09-02 | キヤノン株式会社 | 分離方法および半導体基板の製造方法 |
| JP2000091304A (ja) * | 1998-09-09 | 2000-03-31 | Canon Inc | 試料の分離装置及び分離方法及び分離の監視装置並びに基板の製造方法 |
| JP2000164905A (ja) * | 1998-09-22 | 2000-06-16 | Canon Inc | 光電変換装置の製造方法とその製造装置 |
| JP2000150456A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の分離装置及び分離方法 |
| JP2002353081A (ja) * | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び分離方法 |
| TWI597770B (zh) * | 2013-09-27 | 2017-09-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
| WO2020066492A1 (ja) * | 2018-09-25 | 2020-04-02 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
| US12087588B2 (en) * | 2018-10-23 | 2024-09-10 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
-
2024
- 2024-03-28 WO PCT/JP2024/012709 patent/WO2024204570A1/ja not_active Ceased
- 2024-03-28 KR KR1020257035976A patent/KR20250165420A/ko active Pending
- 2024-03-28 JP JP2025511173A patent/JPWO2024204570A1/ja active Pending
- 2024-03-28 EP EP24780671.4A patent/EP4693370A1/en active Pending
- 2024-03-28 CN CN202480014877.8A patent/CN120814026A/zh active Pending
- 2024-03-28 JP JP2025511172A patent/JPWO2024204569A1/ja active Pending
- 2024-03-28 WO PCT/JP2024/012708 patent/WO2024204569A1/ja not_active Ceased
- 2024-03-28 CN CN202480014831.6A patent/CN120752733A/zh active Pending
- 2024-03-28 KR KR1020257035977A patent/KR20250165421A/ko active Pending
- 2024-03-28 KR KR1020257035277A patent/KR20250165397A/ko active Pending
- 2024-03-28 CN CN202480014687.6A patent/CN120752732A/zh active Pending
- 2024-03-28 WO PCT/JP2024/012710 patent/WO2024204571A1/ja not_active Ceased
- 2024-03-28 JP JP2025511174A patent/JPWO2024204571A1/ja active Pending
- 2024-03-29 TW TW113112151A patent/TW202441676A/zh unknown
- 2024-03-29 TW TW113111986A patent/TWI888082B/zh active
- 2024-03-29 TW TW113111979A patent/TW202441638A/zh unknown
-
2025
- 2025-09-29 US US19/343,307 patent/US20260033274A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250165420A (ko) | 2025-11-25 |
| KR20250165397A (ko) | 2025-11-25 |
| EP4693370A1 (en) | 2026-02-11 |
| TWI888082B (zh) | 2025-06-21 |
| WO2024204570A1 (ja) | 2024-10-03 |
| JPWO2024204571A1 (enExample) | 2024-10-03 |
| JPWO2024204570A1 (enExample) | 2024-10-03 |
| CN120814026A (zh) | 2025-10-17 |
| WO2024204571A1 (ja) | 2024-10-03 |
| US20260033274A1 (en) | 2026-01-29 |
| WO2024204569A1 (ja) | 2024-10-03 |
| KR20250165421A (ko) | 2025-11-25 |
| CN120752733A (zh) | 2025-10-03 |
| CN120752732A (zh) | 2025-10-03 |
| TW202505583A (zh) | 2025-02-01 |
| TW202441676A (zh) | 2024-10-16 |
| TW202441638A (zh) | 2024-10-16 |