JPWO2024184718A1 - - Google Patents

Info

Publication number
JPWO2024184718A1
JPWO2024184718A1 JP2025504875A JP2025504875A JPWO2024184718A1 JP WO2024184718 A1 JPWO2024184718 A1 JP WO2024184718A1 JP 2025504875 A JP2025504875 A JP 2025504875A JP 2025504875 A JP2025504875 A JP 2025504875A JP WO2024184718 A1 JPWO2024184718 A1 JP WO2024184718A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025504875A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024184718A1 publication Critical patent/JPWO2024184718A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K3/00Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/353Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
    • H03K3/356Bistable circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
JP2025504875A 2023-03-03 2024-02-26 Pending JPWO2024184718A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023032368 2023-03-03
PCT/IB2024/051794 WO2024184718A1 (ja) 2023-03-03 2024-02-26 半導体装置

Publications (1)

Publication Number Publication Date
JPWO2024184718A1 true JPWO2024184718A1 (https=) 2024-09-12

Family

ID=92674229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025504875A Pending JPWO2024184718A1 (https=) 2023-03-03 2024-02-26

Country Status (4)

Country Link
JP (1) JPWO2024184718A1 (https=)
KR (1) KR20250159159A (https=)
CN (1) CN120693790A (https=)
WO (1) WO2024184718A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026078504A1 (ja) * 2024-10-10 2026-04-16 株式会社半導体エネルギー研究所 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107947763B (zh) * 2010-08-06 2021-12-28 株式会社半导体能源研究所 半导体集成电路
JP2014199709A (ja) * 2013-03-14 2014-10-23 株式会社半導体エネルギー研究所 記憶装置、半導体装置
KR102341741B1 (ko) * 2014-10-10 2021-12-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 논리 회로, 처리 유닛, 전자 부품, 및 전자 기기
US10177142B2 (en) * 2015-12-25 2019-01-08 Semiconductor Energy Laboratory Co., Ltd. Circuit, logic circuit, processor, electronic component, and electronic device
US10423203B2 (en) * 2016-12-28 2019-09-24 Intel Corporation Flip-flop circuit with low-leakage transistors
JP2018195366A (ja) * 2017-05-19 2018-12-06 ソニーセミコンダクタソリューションズ株式会社 半導体回路、駆動方法、および電子機器
TWI829663B (zh) * 2018-01-19 2024-01-21 日商半導體能源研究所股份有限公司 半導體裝置以及其工作方法

Also Published As

Publication number Publication date
WO2024184718A1 (ja) 2024-09-12
CN120693790A (zh) 2025-09-23
KR20250159159A (ko) 2025-11-10

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