JPWO2024184718A1 - - Google Patents
Info
- Publication number
- JPWO2024184718A1 JPWO2024184718A1 JP2025504875A JP2025504875A JPWO2024184718A1 JP WO2024184718 A1 JPWO2024184718 A1 JP WO2024184718A1 JP 2025504875 A JP2025504875 A JP 2025504875A JP 2025504875 A JP2025504875 A JP 2025504875A JP WO2024184718 A1 JPWO2024184718 A1 JP WO2024184718A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023032368 | 2023-03-03 | ||
| PCT/IB2024/051794 WO2024184718A1 (ja) | 2023-03-03 | 2024-02-26 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024184718A1 true JPWO2024184718A1 (https=) | 2024-09-12 |
Family
ID=92674229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025504875A Pending JPWO2024184718A1 (https=) | 2023-03-03 | 2024-02-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024184718A1 (https=) |
| KR (1) | KR20250159159A (https=) |
| CN (1) | CN120693790A (https=) |
| WO (1) | WO2024184718A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026078504A1 (ja) * | 2024-10-10 | 2026-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947763B (zh) * | 2010-08-06 | 2021-12-28 | 株式会社半导体能源研究所 | 半导体集成电路 |
| JP2014199709A (ja) * | 2013-03-14 | 2014-10-23 | 株式会社半導体エネルギー研究所 | 記憶装置、半導体装置 |
| KR102341741B1 (ko) * | 2014-10-10 | 2021-12-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 논리 회로, 처리 유닛, 전자 부품, 및 전자 기기 |
| US10177142B2 (en) * | 2015-12-25 | 2019-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Circuit, logic circuit, processor, electronic component, and electronic device |
| US10423203B2 (en) * | 2016-12-28 | 2019-09-24 | Intel Corporation | Flip-flop circuit with low-leakage transistors |
| JP2018195366A (ja) * | 2017-05-19 | 2018-12-06 | ソニーセミコンダクタソリューションズ株式会社 | 半導体回路、駆動方法、および電子機器 |
| TWI829663B (zh) * | 2018-01-19 | 2024-01-21 | 日商半導體能源研究所股份有限公司 | 半導體裝置以及其工作方法 |
-
2024
- 2024-02-26 CN CN202480012133.2A patent/CN120693790A/zh active Pending
- 2024-02-26 WO PCT/IB2024/051794 patent/WO2024184718A1/ja not_active Ceased
- 2024-02-26 JP JP2025504875A patent/JPWO2024184718A1/ja active Pending
- 2024-02-26 KR KR1020257027959A patent/KR20250159159A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024184718A1 (ja) | 2024-09-12 |
| CN120693790A (zh) | 2025-09-23 |
| KR20250159159A (ko) | 2025-11-10 |