JPWO2024166492A1 - - Google Patents

Info

Publication number
JPWO2024166492A1
JPWO2024166492A1 JP2024576123A JP2024576123A JPWO2024166492A1 JP WO2024166492 A1 JPWO2024166492 A1 JP WO2024166492A1 JP 2024576123 A JP2024576123 A JP 2024576123A JP 2024576123 A JP2024576123 A JP 2024576123A JP WO2024166492 A1 JPWO2024166492 A1 JP WO2024166492A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024576123A
Other languages
Japanese (ja)
Other versions
JPWO2024166492A5 (https=
JP7845515B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024166492A1 publication Critical patent/JPWO2024166492A1/ja
Publication of JPWO2024166492A5 publication Critical patent/JPWO2024166492A5/ja
Application granted granted Critical
Publication of JP7845515B2 publication Critical patent/JP7845515B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/422PN diodes having the PN junctions in mesas
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/035Etching a recess in the emitter region 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • H10D12/032Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/417Insulated-gate bipolar transistors [IGBT] having a drift region having a doping concentration that is higher at the collector side relative to other parts of the drift region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/418Insulated-gate bipolar transistors [IGBT] having a drift region having a doping concentration that is higher at the emitter side relative to other parts of the drift region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50Physical imperfections
    • H10D62/53Physical imperfections the imperfections being within the semiconductor body 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/232Emitter electrodes for IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/62Electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/161IGBT having built-in components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
JP2024576123A 2023-02-07 2023-11-21 半導体装置 Active JP7845515B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023016604 2023-02-07
JP2023016604 2023-02-07
PCT/JP2023/041808 WO2024166492A1 (ja) 2023-02-07 2023-11-21 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2024166492A1 true JPWO2024166492A1 (https=) 2024-08-15
JPWO2024166492A5 JPWO2024166492A5 (https=) 2025-04-17
JP7845515B2 JP7845515B2 (ja) 2026-04-14

Family

ID=92262926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024576123A Active JP7845515B2 (ja) 2023-02-07 2023-11-21 半導体装置

Country Status (5)

Country Link
US (1) US20250185334A1 (https=)
JP (1) JP7845515B2 (https=)
CN (1) CN119654982A (https=)
DE (1) DE112023002505T5 (https=)
WO (1) WO2024166492A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020213254A1 (ja) * 2019-04-16 2020-10-22 富士電機株式会社 半導体装置および製造方法
WO2021210293A1 (ja) * 2020-04-16 2021-10-21 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2022016842A (ja) * 2020-07-13 2022-01-25 富士電機株式会社 半導体装置
WO2022244802A1 (ja) * 2021-05-19 2022-11-24 富士電機株式会社 半導体装置および製造方法
US20230036039A1 (en) * 2021-07-29 2023-02-02 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020213254A1 (ja) * 2019-04-16 2020-10-22 富士電機株式会社 半導体装置および製造方法
WO2021210293A1 (ja) * 2020-04-16 2021-10-21 富士電機株式会社 半導体装置および半導体装置の製造方法
JP2022016842A (ja) * 2020-07-13 2022-01-25 富士電機株式会社 半導体装置
WO2022244802A1 (ja) * 2021-05-19 2022-11-24 富士電機株式会社 半導体装置および製造方法
US20230036039A1 (en) * 2021-07-29 2023-02-02 Fuji Electric Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
DE112023002505T5 (de) 2025-04-30
US20250185334A1 (en) 2025-06-05
CN119654982A (zh) 2025-03-18
WO2024166492A1 (ja) 2024-08-15
JP7845515B2 (ja) 2026-04-14

Similar Documents

Publication Publication Date Title
CA3250564A1 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR202022009269U2 (https=)
BR202022005961U2 (https=)
BY13169U (https=)
BY13175U (https=)
CN307049898S (https=)
CN307048723S (https=)
CN307048389S (https=)
CN307047765S (https=)
CN307046650S (https=)
CN307045776S (https=)
CN307045650S (https=)
CN307045452S (https=)
CN307045230S (https=)
CN307044453S (https=)
BY24004C1 (https=)
BY13162U (https=)
BY13176U (https=)
BY13164U (https=)
BY13174U (https=)
BY13172U (https=)
BY13170U (https=)
BY13165U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250130

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260316

R150 Certificate of patent or registration of utility model

Ref document number: 7845515

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150