JPWO2024161449A1 - - Google Patents

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Publication number
JPWO2024161449A1
JPWO2024161449A1 JP2024574064A JP2024574064A JPWO2024161449A1 JP WO2024161449 A1 JPWO2024161449 A1 JP WO2024161449A1 JP 2024574064 A JP2024574064 A JP 2024574064A JP 2024574064 A JP2024574064 A JP 2024574064A JP WO2024161449 A1 JPWO2024161449 A1 JP WO2024161449A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024574064A
Other languages
Japanese (ja)
Other versions
JP7835311B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2024161449A1 publication Critical patent/JPWO2024161449A1/ja
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Publication of JP7835311B2 publication Critical patent/JP7835311B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP2024574064A 2023-01-30 2023-01-30 レーザシステム Active JP7835311B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002830 WO2024161449A1 (ja) 2023-01-30 2023-01-30 レーザシステム

Publications (2)

Publication Number Publication Date
JPWO2024161449A1 true JPWO2024161449A1 (https=) 2024-08-08
JP7835311B2 JP7835311B2 (ja) 2026-03-25

Family

ID=92146259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574064A Active JP7835311B2 (ja) 2023-01-30 2023-01-30 レーザシステム

Country Status (2)

Country Link
JP (1) JP7835311B2 (https=)
WO (1) WO2024161449A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013133415A1 (ja) * 2012-03-09 2013-09-12 株式会社トヨコー レーザー照射装置、レーザー照射システム及び塗膜又は付着物除去方法
JP2018001199A (ja) * 2016-06-29 2018-01-11 株式会社Ihi 表面処理装置
US20190339512A1 (en) * 2018-05-02 2019-11-07 National Tsing Hua University Portable Surface Finishing Device Based on Coherent Light Source
WO2021005773A1 (ja) * 2019-07-11 2021-01-14 日本電信電話株式会社 レーザー光走査装置及びレーザー光走査方法
JP2021030271A (ja) * 2019-08-26 2021-03-01 フルサト工業株式会社 固着物除去装置
WO2021240778A1 (ja) * 2020-05-29 2021-12-02 三菱電機株式会社 レーザ加工システム
JP2021533996A (ja) * 2018-08-09 2021-12-09 コーニング インコーポレイテッド レーザービームの機械内プロファイリングのためのシステム、方法および装置
JP2023008405A (ja) * 2021-07-06 2023-01-19 日本電信電話株式会社 表面状態推定方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013133415A1 (ja) * 2012-03-09 2013-09-12 株式会社トヨコー レーザー照射装置、レーザー照射システム及び塗膜又は付着物除去方法
JP2018001199A (ja) * 2016-06-29 2018-01-11 株式会社Ihi 表面処理装置
US20190339512A1 (en) * 2018-05-02 2019-11-07 National Tsing Hua University Portable Surface Finishing Device Based on Coherent Light Source
JP2021533996A (ja) * 2018-08-09 2021-12-09 コーニング インコーポレイテッド レーザービームの機械内プロファイリングのためのシステム、方法および装置
WO2021005773A1 (ja) * 2019-07-11 2021-01-14 日本電信電話株式会社 レーザー光走査装置及びレーザー光走査方法
JP2021030271A (ja) * 2019-08-26 2021-03-01 フルサト工業株式会社 固着物除去装置
WO2021240778A1 (ja) * 2020-05-29 2021-12-02 三菱電機株式会社 レーザ加工システム
JP2023008405A (ja) * 2021-07-06 2023-01-19 日本電信電話株式会社 表面状態推定方法

Also Published As

Publication number Publication date
WO2024161449A1 (ja) 2024-08-08
JP7835311B2 (ja) 2026-03-25

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