JP7835311B2 - レーザシステム - Google Patents
レーザシステムInfo
- Publication number
- JP7835311B2 JP7835311B2 JP2024574064A JP2024574064A JP7835311B2 JP 7835311 B2 JP7835311 B2 JP 7835311B2 JP 2024574064 A JP2024574064 A JP 2024574064A JP 2024574064 A JP2024574064 A JP 2024574064A JP 7835311 B2 JP7835311 B2 JP 7835311B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- light
- light spot
- spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/002830 WO2024161449A1 (ja) | 2023-01-30 | 2023-01-30 | レーザシステム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024161449A1 JPWO2024161449A1 (https=) | 2024-08-08 |
| JP7835311B2 true JP7835311B2 (ja) | 2026-03-25 |
Family
ID=92146259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024574064A Active JP7835311B2 (ja) | 2023-01-30 | 2023-01-30 | レーザシステム |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7835311B2 (https=) |
| WO (1) | WO2024161449A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013133415A1 (ja) | 2012-03-09 | 2013-09-12 | 株式会社トヨコー | レーザー照射装置、レーザー照射システム及び塗膜又は付着物除去方法 |
| JP2018001199A (ja) | 2016-06-29 | 2018-01-11 | 株式会社Ihi | 表面処理装置 |
| US20190339512A1 (en) | 2018-05-02 | 2019-11-07 | National Tsing Hua University | Portable Surface Finishing Device Based on Coherent Light Source |
| WO2021005773A1 (ja) | 2019-07-11 | 2021-01-14 | 日本電信電話株式会社 | レーザー光走査装置及びレーザー光走査方法 |
| JP2021030271A (ja) | 2019-08-26 | 2021-03-01 | フルサト工業株式会社 | 固着物除去装置 |
| WO2021240778A1 (ja) | 2020-05-29 | 2021-12-02 | 三菱電機株式会社 | レーザ加工システム |
| JP2021533996A (ja) | 2018-08-09 | 2021-12-09 | コーニング インコーポレイテッド | レーザービームの機械内プロファイリングのためのシステム、方法および装置 |
| JP2023008405A (ja) | 2021-07-06 | 2023-01-19 | 日本電信電話株式会社 | 表面状態推定方法 |
-
2023
- 2023-01-30 JP JP2024574064A patent/JP7835311B2/ja active Active
- 2023-01-30 WO PCT/JP2023/002830 patent/WO2024161449A1/ja not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013133415A1 (ja) | 2012-03-09 | 2013-09-12 | 株式会社トヨコー | レーザー照射装置、レーザー照射システム及び塗膜又は付着物除去方法 |
| JP2018001199A (ja) | 2016-06-29 | 2018-01-11 | 株式会社Ihi | 表面処理装置 |
| US20190339512A1 (en) | 2018-05-02 | 2019-11-07 | National Tsing Hua University | Portable Surface Finishing Device Based on Coherent Light Source |
| JP2021533996A (ja) | 2018-08-09 | 2021-12-09 | コーニング インコーポレイテッド | レーザービームの機械内プロファイリングのためのシステム、方法および装置 |
| WO2021005773A1 (ja) | 2019-07-11 | 2021-01-14 | 日本電信電話株式会社 | レーザー光走査装置及びレーザー光走査方法 |
| JP2021030271A (ja) | 2019-08-26 | 2021-03-01 | フルサト工業株式会社 | 固着物除去装置 |
| WO2021240778A1 (ja) | 2020-05-29 | 2021-12-02 | 三菱電機株式会社 | レーザ加工システム |
| JP2023008405A (ja) | 2021-07-06 | 2023-01-19 | 日本電信電話株式会社 | 表面状態推定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024161449A1 (https=) | 2024-08-08 |
| WO2024161449A1 (ja) | 2024-08-08 |
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