JPWO2024161449A1 - - Google Patents

Info

Publication number
JPWO2024161449A1
JPWO2024161449A1 JP2024574064A JP2024574064A JPWO2024161449A1 JP WO2024161449 A1 JPWO2024161449 A1 JP WO2024161449A1 JP 2024574064 A JP2024574064 A JP 2024574064A JP 2024574064 A JP2024574064 A JP 2024574064A JP WO2024161449 A1 JPWO2024161449 A1 JP WO2024161449A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024574064A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024161449A1 publication Critical patent/JPWO2024161449A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP2024574064A 2023-01-30 2023-01-30 Pending JPWO2024161449A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002830 WO2024161449A1 (ja) 2023-01-30 2023-01-30 レーザシステム

Publications (1)

Publication Number Publication Date
JPWO2024161449A1 true JPWO2024161449A1 (enrdf_load_stackoverflow) 2024-08-08

Family

ID=92146259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574064A Pending JPWO2024161449A1 (enrdf_load_stackoverflow) 2023-01-30 2023-01-30

Country Status (2)

Country Link
JP (1) JPWO2024161449A1 (enrdf_load_stackoverflow)
WO (1) WO2024161449A1 (enrdf_load_stackoverflow)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574354B2 (ja) * 2012-03-09 2014-08-20 株式会社トヨコー 塗膜除去方法及びレーザー塗膜除去装置
JP6807016B2 (ja) * 2016-06-29 2021-01-06 株式会社Ihi 表面処理装置
TW201946719A (zh) * 2018-05-02 2019-12-16 國立清華大學 可攜式同調光表面處理裝置
WO2020033290A1 (en) * 2018-08-09 2020-02-13 Corning Incorporated Systems, methods, and apparatuses for in machine profiling of a laser beam
JP7197012B2 (ja) * 2019-07-11 2022-12-27 日本電信電話株式会社 レーザー光走査装置及びレーザー光走査方法
JP2021030271A (ja) * 2019-08-26 2021-03-01 フルサト工業株式会社 固着物除去装置
JP6854984B1 (ja) * 2020-05-29 2021-04-07 三菱電機株式会社 レーザ加工システム
JP2023008405A (ja) * 2021-07-06 2023-01-19 日本電信電話株式会社 表面状態推定方法

Also Published As

Publication number Publication date
WO2024161449A1 (ja) 2024-08-08

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20250328