JPWO2024111236A5 - - Google Patents
Info
- Publication number
- JPWO2024111236A5 JPWO2024111236A5 JP2024559981A JP2024559981A JPWO2024111236A5 JP WO2024111236 A5 JPWO2024111236 A5 JP WO2024111236A5 JP 2024559981 A JP2024559981 A JP 2024559981A JP 2024559981 A JP2024559981 A JP 2024559981A JP WO2024111236 A5 JPWO2024111236 A5 JP WO2024111236A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- curable resin
- composition according
- curable
- compound
- Prior art date
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022187039 | 2022-11-24 | ||
| PCT/JP2023/034193 WO2024111236A1 (ja) | 2022-11-24 | 2023-09-21 | 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111236A1 JPWO2024111236A1 (https=) | 2024-05-30 |
| JPWO2024111236A5 true JPWO2024111236A5 (https=) | 2026-05-01 |
Family
ID=91195384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024559981A Pending JPWO2024111236A1 (https=) | 2022-11-24 | 2023-09-21 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024111236A1 (https=) |
| KR (1) | KR20250110797A (https=) |
| CN (1) | CN119894942A (https=) |
| WO (1) | WO2024111236A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63152604A (ja) * | 1986-12-17 | 1988-06-25 | Showa Highpolymer Co Ltd | 光硬化可能な樹脂組成物 |
| JP3098085B2 (ja) * | 1991-12-25 | 2000-10-10 | 化薬アクゾ株式会社 | 重合開始剤組成物及びこれを使用した重合方法 |
| KR100907983B1 (ko) * | 2006-12-27 | 2009-07-16 | 제일모직주식회사 | 접착력 유지가 우수한 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름 |
| US7851930B1 (en) * | 2008-06-04 | 2010-12-14 | Henkel Corporation | Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties |
| PL3155040T3 (pl) * | 2014-06-12 | 2020-05-18 | Nouryon Chemicals International B.V. | Sposób zwiększania wytrzymałości stopu polipropylenu |
| JP6456134B2 (ja) | 2014-12-23 | 2019-01-23 | ナミックス株式会社 | 導電性樹脂組成物、ディスペンス用導電性樹脂組成物、ダイアタッチ剤、および半導体装置 |
| EP3401928B1 (en) * | 2017-05-09 | 2021-08-18 | Henkel AG & Co. KGaA | Electrically conductive adhesive for attaching solar cells |
| JP6844680B2 (ja) | 2019-12-12 | 2021-03-17 | 昭和電工マテリアルズ株式会社 | 先供給型アンダーフィル材、先供給型アンダーフィル材の硬化物、電子部品装置及び電子部品装置の製造方法 |
-
2023
- 2023-09-21 KR KR1020257011386A patent/KR20250110797A/ko active Pending
- 2023-09-21 JP JP2024559981A patent/JPWO2024111236A1/ja active Pending
- 2023-09-21 WO PCT/JP2023/034193 patent/WO2024111236A1/ja not_active Ceased
- 2023-09-21 CN CN202380068729.XA patent/CN119894942A/zh active Pending
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