JPWO2024101202A1 - - Google Patents

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Publication number
JPWO2024101202A1
JPWO2024101202A1 JP2024557335A JP2024557335A JPWO2024101202A1 JP WO2024101202 A1 JPWO2024101202 A1 JP WO2024101202A1 JP 2024557335 A JP2024557335 A JP 2024557335A JP 2024557335 A JP2024557335 A JP 2024557335A JP WO2024101202 A1 JPWO2024101202 A1 JP WO2024101202A1
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JP
Japan
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JP2024557335A
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Japanese (ja)
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JPWO2024101202A5 (https=
JP7721017B2 (ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
JP2024557335A 2022-11-09 2023-10-30 半導体装置、電力変換装置、および、半導体装置の製造方法 Active JP7721017B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022179277 2022-11-09
JP2022179277 2022-11-09
PCT/JP2023/039114 WO2024101202A1 (ja) 2022-11-09 2023-10-30 半導体装置、電力変換装置、および、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2024101202A1 true JPWO2024101202A1 (https=) 2024-05-16
JPWO2024101202A5 JPWO2024101202A5 (https=) 2025-01-30
JP7721017B2 JP7721017B2 (ja) 2025-08-08

Family

ID=91032849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024557335A Active JP7721017B2 (ja) 2022-11-09 2023-10-30 半導体装置、電力変換装置、および、半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7721017B2 (https=)
WO (1) WO2024101202A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102595A (ja) * 1985-10-29 1987-05-13 住友電気工業株式会社 レ−ザハンダ付け方法
JP2008119729A (ja) * 2006-11-14 2008-05-29 Fuji Electric Device Technology Co Ltd レーザ溶接方法
JP2008305902A (ja) * 2007-06-06 2008-12-18 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP2011258888A (ja) * 2010-06-11 2011-12-22 Sharp Corp 太陽電池モジュールの製造装置および製造方法
JP2018500172A (ja) * 2014-11-07 2018-01-11 ヴェバスト ソシエタス エウロペアWebasto Societas Europaea レーザ溶接による第1部品及び第2部品の加工方法及び関連装置
JP2020025027A (ja) * 2018-08-08 2020-02-13 三菱電機株式会社 電力用半導体装置及びその製造方法、並びに、電力変換装置
JP2022103052A (ja) * 2020-12-25 2022-07-07 富士電機株式会社 半導体モジュール、半導体装置および半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102595A (ja) * 1985-10-29 1987-05-13 住友電気工業株式会社 レ−ザハンダ付け方法
JP2008119729A (ja) * 2006-11-14 2008-05-29 Fuji Electric Device Technology Co Ltd レーザ溶接方法
JP2008305902A (ja) * 2007-06-06 2008-12-18 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP2011258888A (ja) * 2010-06-11 2011-12-22 Sharp Corp 太陽電池モジュールの製造装置および製造方法
JP2018500172A (ja) * 2014-11-07 2018-01-11 ヴェバスト ソシエタス エウロペアWebasto Societas Europaea レーザ溶接による第1部品及び第2部品の加工方法及び関連装置
JP2020025027A (ja) * 2018-08-08 2020-02-13 三菱電機株式会社 電力用半導体装置及びその製造方法、並びに、電力変換装置
JP2022103052A (ja) * 2020-12-25 2022-07-07 富士電機株式会社 半導体モジュール、半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JP7721017B2 (ja) 2025-08-08
WO2024101202A1 (ja) 2024-05-16

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