JPWO2024095570A1 - - Google Patents
Info
- Publication number
- JPWO2024095570A1 JPWO2024095570A1 JP2024554273A JP2024554273A JPWO2024095570A1 JP WO2024095570 A1 JPWO2024095570 A1 JP WO2024095570A1 JP 2024554273 A JP2024554273 A JP 2024554273A JP 2024554273 A JP2024554273 A JP 2024554273A JP WO2024095570 A1 JPWO2024095570 A1 JP WO2024095570A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022176445 | 2022-11-02 | ||
| JP2022176445 | 2022-11-02 | ||
| PCT/JP2023/030260 WO2024095570A1 (ja) | 2022-11-02 | 2023-08-23 | インダクタ部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024095570A1 true JPWO2024095570A1 (https=) | 2024-05-10 |
| JPWO2024095570A5 JPWO2024095570A5 (https=) | 2025-05-30 |
| JP7687538B2 JP7687538B2 (ja) | 2025-06-03 |
Family
ID=90930153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024554273A Active JP7687538B2 (ja) | 2022-11-02 | 2023-08-23 | インダクタ部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250259783A1 (https=) |
| JP (1) | JP7687538B2 (https=) |
| CN (1) | CN120129946A (https=) |
| WO (1) | WO2024095570A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (ja) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | 回路基板及びその製造方法 |
| JP2007027649A (ja) * | 2005-07-21 | 2007-02-01 | Murata Mfg Co Ltd | 積層コイル部品及びその製造方法 |
| JP2008066592A (ja) * | 2006-09-08 | 2008-03-21 | Fuji Electric Holdings Co Ltd | 薄型磁気部品の製造方法 |
| JP2011096998A (ja) * | 2009-10-30 | 2011-05-12 | Samsung Electro-Mechanics Co Ltd | 凹凸パターン付きビアパッドを含む印刷回路基板及びその製造方法 |
| WO2017212990A1 (ja) * | 2016-06-07 | 2017-12-14 | 株式会社村田製作所 | 電子部品、振動板、電子機器および電子部品の製造方法 |
-
2023
- 2023-08-23 CN CN202380076159.9A patent/CN120129946A/zh active Pending
- 2023-08-23 WO PCT/JP2023/030260 patent/WO2024095570A1/ja not_active Ceased
- 2023-08-23 JP JP2024554273A patent/JP7687538B2/ja active Active
-
2025
- 2025-04-30 US US19/195,362 patent/US20250259783A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218525A (ja) * | 2002-01-18 | 2003-07-31 | Fujitsu Ltd | 回路基板及びその製造方法 |
| JP2007027649A (ja) * | 2005-07-21 | 2007-02-01 | Murata Mfg Co Ltd | 積層コイル部品及びその製造方法 |
| JP2008066592A (ja) * | 2006-09-08 | 2008-03-21 | Fuji Electric Holdings Co Ltd | 薄型磁気部品の製造方法 |
| JP2011096998A (ja) * | 2009-10-30 | 2011-05-12 | Samsung Electro-Mechanics Co Ltd | 凹凸パターン付きビアパッドを含む印刷回路基板及びその製造方法 |
| WO2017212990A1 (ja) * | 2016-06-07 | 2017-12-14 | 株式会社村田製作所 | 電子部品、振動板、電子機器および電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250259783A1 (en) | 2025-08-14 |
| JP7687538B2 (ja) | 2025-06-03 |
| CN120129946A (zh) | 2025-06-10 |
| WO2024095570A1 (ja) | 2024-05-10 |
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