JPWO2024090276A1 - - Google Patents
Info
- Publication number
- JPWO2024090276A1 JPWO2024090276A1 JP2024552980A JP2024552980A JPWO2024090276A1 JP WO2024090276 A1 JPWO2024090276 A1 JP WO2024090276A1 JP 2024552980 A JP2024552980 A JP 2024552980A JP 2024552980 A JP2024552980 A JP 2024552980A JP WO2024090276 A1 JPWO2024090276 A1 JP WO2024090276A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263418682P | 2022-10-24 | 2022-10-24 | |
| PCT/JP2023/037424 WO2024090276A1 (ja) | 2022-10-24 | 2023-10-16 | 基板支持器及びプラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024090276A1 true JPWO2024090276A1 (https=) | 2024-05-02 |
Family
ID=90830683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024552980A Pending JPWO2024090276A1 (https=) | 2022-10-24 | 2023-10-16 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250246416A1 (https=) |
| JP (1) | JPWO2024090276A1 (https=) |
| KR (1) | KR20250095635A (https=) |
| CN (1) | CN120077479A (https=) |
| TW (1) | TW202433655A (https=) |
| WO (1) | WO2024090276A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6581275B2 (en) * | 2001-01-22 | 2003-06-24 | Applied Materials Inc. | Fabricating an electrostatic chuck having plasma resistant gas conduits |
| US20030010292A1 (en) * | 2001-07-16 | 2003-01-16 | Applied Materials, Inc. | Electrostatic chuck with dielectric coating |
| JP5984504B2 (ja) * | 2012-05-21 | 2016-09-06 | 新光電気工業株式会社 | 静電チャック、静電チャックの製造方法 |
| JP2019029384A (ja) * | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| JP7149739B2 (ja) | 2018-06-19 | 2022-10-07 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| JP7232404B2 (ja) * | 2018-07-30 | 2023-03-03 | Toto株式会社 | 静電チャック |
| JP7402411B2 (ja) * | 2018-10-30 | 2023-12-21 | Toto株式会社 | 静電チャック |
| JP7534292B2 (ja) * | 2018-11-01 | 2024-08-14 | ラム リサーチ コーポレーション | Ｈｅ孔着火／アーク放電を防止する特徴を有する高出力静電チャック |
| JP7204893B2 (ja) * | 2019-03-29 | 2023-01-16 | 京セラ株式会社 | ガスプラグ、静電吸着用部材およびプラズマ処理装置 |
| JP7387764B2 (ja) * | 2019-05-24 | 2023-11-28 | アプライド マテリアルズ インコーポレイテッド | 結合層の保護が改善された基板支持キャリア |
| US20200411355A1 (en) * | 2019-06-28 | 2020-12-31 | Applied Materials, Inc. | Apparatus for reduction or prevention of arcing in a substrate support |
| KR102768789B1 (ko) * | 2021-02-04 | 2025-02-14 | 엔지케이 인슐레이터 엘티디 | 반도체 제조 장치용 부재 및 그 제법 |
-
2023
- 2023-10-16 JP JP2024552980A patent/JPWO2024090276A1/ja active Pending
- 2023-10-16 WO PCT/JP2023/037424 patent/WO2024090276A1/ja not_active Ceased
- 2023-10-16 CN CN202380073930.7A patent/CN120077479A/zh active Pending
- 2023-10-16 KR KR1020257015522A patent/KR20250095635A/ko active Pending
- 2023-10-19 TW TW112139908A patent/TW202433655A/zh unknown
-
2025
- 2025-04-21 US US19/183,966 patent/US20250246416A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202433655A (zh) | 2024-08-16 |
| US20250246416A1 (en) | 2025-07-31 |
| CN120077479A (zh) | 2025-05-30 |
| WO2024090276A1 (ja) | 2024-05-02 |
| KR20250095635A (ko) | 2025-06-26 |