JPWO2024089850A1 - - Google Patents
Info
- Publication number
- JPWO2024089850A1 JPWO2024089850A1 JP2024552617A JP2024552617A JPWO2024089850A1 JP WO2024089850 A1 JPWO2024089850 A1 JP WO2024089850A1 JP 2024552617 A JP2024552617 A JP 2024552617A JP 2024552617 A JP2024552617 A JP 2024552617A JP WO2024089850 A1 JPWO2024089850 A1 JP WO2024089850A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
- H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/040219 WO2024089850A1 (ja) | 2022-10-27 | 2022-10-27 | 研磨液、研磨方法、部品の製造方法、及び、半導体部品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024089850A1 true JPWO2024089850A1 (https=) | 2024-05-02 |
Family
ID=90830326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024552617A Pending JPWO2024089850A1 (https=) | 2022-10-27 | 2022-10-27 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250263582A1 (https=) |
| JP (1) | JPWO2024089850A1 (https=) |
| KR (1) | KR20250078464A (https=) |
| CN (1) | CN119234296A (https=) |
| WO (1) | WO2024089850A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4874022B2 (ja) | 2006-07-19 | 2012-02-08 | ペガサスミシン製造株式会社 | ミシンの針折れ検出装置 |
| JP2010106994A (ja) | 2008-10-31 | 2010-05-13 | Ntn Corp | 流体軸受装置 |
| JP2011171446A (ja) * | 2010-02-17 | 2011-09-01 | Hitachi Chem Co Ltd | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| WO2021081145A1 (en) * | 2019-10-22 | 2021-04-29 | Cmc Materials, Inc. | Polishing composition and method with high selectivity for silicon nitride and polysilicon over silicon oxide |
| WO2021162111A1 (ja) * | 2020-02-13 | 2021-08-19 | 昭和電工マテリアルズ株式会社 | Ｃｍｐ研磨液及び研磨方法 |
-
2022
- 2022-10-27 JP JP2024552617A patent/JPWO2024089850A1/ja active Pending
- 2022-10-27 KR KR1020257011134A patent/KR20250078464A/ko active Pending
- 2022-10-27 CN CN202280095523.1A patent/CN119234296A/zh active Pending
- 2022-10-27 US US18/856,974 patent/US20250263582A1/en active Pending
- 2022-10-27 WO PCT/JP2022/040219 patent/WO2024089850A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024089850A1 (ja) | 2024-05-02 |
| KR20250078464A (ko) | 2025-06-02 |
| CN119234296A (zh) | 2024-12-31 |
| US20250263582A1 (en) | 2025-08-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250804 |