JPWO2024085047A1 - - Google Patents

Info

Publication number
JPWO2024085047A1
JPWO2024085047A1 JP2024551733A JP2024551733A JPWO2024085047A1 JP WO2024085047 A1 JPWO2024085047 A1 JP WO2024085047A1 JP 2024551733 A JP2024551733 A JP 2024551733A JP 2024551733 A JP2024551733 A JP 2024551733A JP WO2024085047 A1 JPWO2024085047 A1 JP WO2024085047A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551733A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024085047A1 publication Critical patent/JPWO2024085047A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2024551733A 2022-10-19 2023-10-12 Pending JPWO2024085047A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022167986 2022-10-19
PCT/JP2023/036948 WO2024085047A1 (ja) 2022-10-19 2023-10-12 複層ポリイミドフィルム

Publications (1)

Publication Number Publication Date
JPWO2024085047A1 true JPWO2024085047A1 (https=) 2024-04-25

Family

ID=90737435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551733A Pending JPWO2024085047A1 (https=) 2022-10-19 2023-10-12

Country Status (3)

Country Link
JP (1) JPWO2024085047A1 (https=)
TW (1) TW202417547A (https=)
WO (1) WO2024085047A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119176940B (zh) * 2024-08-22 2025-10-10 广西菲玛特科技有限公司 一种五元共聚高Tg聚酰亚胺薄膜的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4193461B2 (ja) * 2001-10-11 2008-12-10 宇部興産株式会社 熱融着性ポリイミドおよび該ポリイミドを使用した積層体
WO2022080314A1 (ja) * 2020-10-14 2022-04-21 株式会社カネカ 複層ポリイミドフィルム、金属張積層板、及び複層ポリイミドフィルムの製造方法
WO2022085619A1 (ja) * 2020-10-22 2022-04-28 株式会社カネカ 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板
JP7745446B2 (ja) * 2020-12-24 2025-09-29 日鉄ケミカル&マテリアル株式会社 ポリイミドフィルム、金属張積層板、その製造方法及び回路基板

Also Published As

Publication number Publication date
WO2024085047A1 (ja) 2024-04-25
TW202417547A (zh) 2024-05-01

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