JPWO2024062558A1 - - Google Patents

Info

Publication number
JPWO2024062558A1
JPWO2024062558A1 JP2024547995A JP2024547995A JPWO2024062558A1 JP WO2024062558 A1 JPWO2024062558 A1 JP WO2024062558A1 JP 2024547995 A JP2024547995 A JP 2024547995A JP 2024547995 A JP2024547995 A JP 2024547995A JP WO2024062558 A1 JPWO2024062558 A1 JP WO2024062558A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024547995A
Other languages
Japanese (ja)
Other versions
JP7847658B2 (ja
JPWO2024062558A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024062558A1 publication Critical patent/JPWO2024062558A1/ja
Publication of JPWO2024062558A5 publication Critical patent/JPWO2024062558A5/ja
Application granted granted Critical
Publication of JP7847658B2 publication Critical patent/JP7847658B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2024547995A 2022-09-21 2022-09-21 プローブカード用プローブ Active JP7847658B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/035187 WO2024062558A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Publications (3)

Publication Number Publication Date
JPWO2024062558A1 true JPWO2024062558A1 (https=) 2024-03-28
JPWO2024062558A5 JPWO2024062558A5 (https=) 2025-06-10
JP7847658B2 JP7847658B2 (ja) 2026-04-17

Family

ID=90454058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024547995A Active JP7847658B2 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Country Status (6)

Country Link
US (1) US20260098876A1 (https=)
JP (1) JP7847658B2 (https=)
KR (1) KR20250048474A (https=)
CN (1) CN119923568A (https=)
TW (1) TW202429089A (https=)
WO (1) WO2024062558A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260050010A1 (en) * 2022-09-21 2026-02-19 Japan Electronic Materials Corporation Probe for probe card

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007078371A (ja) * 2005-09-09 2007-03-29 Nhk Spring Co Ltd 導電性接触子および導電性接触子の製造方法
JP2008503734A (ja) * 2004-06-21 2008-02-07 カプレス・アクティーゼルスカブ プローブの位置合せを行なう方法
US20090315578A1 (en) * 2008-06-18 2009-12-24 Star Technologies Inc. Probe and probe card for integrated circuit devices using the same
JP2018515752A (ja) * 2015-03-31 2018-06-14 テクノプローベ エス．ピー．エー． 高周波適用のためのバーチカル接触プローブ、及びバーチカル接触プローブをもつ試験ヘッド
US20190064215A1 (en) * 2017-08-23 2019-02-28 Leeno Industrial Inc. Mems probe and test device using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008503734A (ja) * 2004-06-21 2008-02-07 カプレス・アクティーゼルスカブ プローブの位置合せを行なう方法
JP2007078371A (ja) * 2005-09-09 2007-03-29 Nhk Spring Co Ltd 導電性接触子および導電性接触子の製造方法
US20090315578A1 (en) * 2008-06-18 2009-12-24 Star Technologies Inc. Probe and probe card for integrated circuit devices using the same
JP2018515752A (ja) * 2015-03-31 2018-06-14 テクノプローベ エス．ピー．エー． 高周波適用のためのバーチカル接触プローブ、及びバーチカル接触プローブをもつ試験ヘッド
US20190064215A1 (en) * 2017-08-23 2019-02-28 Leeno Industrial Inc. Mems probe and test device using the same

Also Published As

Publication number Publication date
WO2024062558A1 (ja) 2024-03-28
KR20250048474A (ko) 2025-04-08
CN119923568A (zh) 2025-05-02
JP7847658B2 (ja) 2026-04-17
TW202429089A (zh) 2024-07-16
US20260098876A1 (en) 2026-04-09

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