JPWO2024042899A1 - - Google Patents
Info
- Publication number
- JPWO2024042899A1 JPWO2024042899A1 JP2024542640A JP2024542640A JPWO2024042899A1 JP WO2024042899 A1 JPWO2024042899 A1 JP WO2024042899A1 JP 2024542640 A JP2024542640 A JP 2024542640A JP 2024542640 A JP2024542640 A JP 2024542640A JP WO2024042899 A1 JPWO2024042899 A1 JP WO2024042899A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/871—Bond wires and strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/886—Die-attach connectors and strap connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/767—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022132988 | 2022-08-24 | ||
| PCT/JP2023/025669 WO2024042899A1 (ja) | 2022-08-24 | 2023-07-12 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024042899A1 true JPWO2024042899A1 (https=) | 2024-02-29 |
| JPWO2024042899A5 JPWO2024042899A5 (https=) | 2024-10-21 |
Family
ID=90013057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024542640A Pending JPWO2024042899A1 (https=) | 2022-08-24 | 2023-07-12 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240387326A1 (https=) |
| EP (1) | EP4459674A4 (https=) |
| JP (1) | JPWO2024042899A1 (https=) |
| CN (1) | CN118575268A (https=) |
| WO (1) | WO2024042899A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123607A (ja) * | 2005-10-28 | 2007-05-17 | Toyota Motor Corp | 電気機器の冷却構造 |
| JP2011134979A (ja) * | 2009-12-25 | 2011-07-07 | Fuji Electric Co Ltd | 液体冷却式ヒートシンク |
| JP2013165096A (ja) * | 2012-02-09 | 2013-08-22 | Nissan Motor Co Ltd | 半導体冷却装置 |
| JP2016096272A (ja) * | 2014-11-14 | 2016-05-26 | 日産自動車株式会社 | 冷却器 |
| JP2017050375A (ja) * | 2015-09-01 | 2017-03-09 | 三菱電機株式会社 | 冷媒流路付き電気機器 |
| JP2017135285A (ja) * | 2016-01-28 | 2017-08-03 | 株式会社豊田自動織機 | 冷却器、及び冷却器の製造方法 |
| WO2020071058A1 (ja) * | 2018-10-03 | 2020-04-09 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565459B2 (ja) | 2010-04-21 | 2014-08-06 | 富士電機株式会社 | 半導体モジュール及び冷却器 |
| JP2013058518A (ja) | 2011-09-07 | 2013-03-28 | Meidensha Corp | 冷却装置 |
| WO2014069174A1 (ja) | 2012-10-29 | 2014-05-08 | 富士電機株式会社 | 半導体装置 |
| WO2016047335A1 (ja) | 2014-09-22 | 2016-03-31 | 富士電機株式会社 | 電子部品の冷却器 |
-
2023
- 2023-07-12 EP EP23857016.2A patent/EP4459674A4/en active Pending
- 2023-07-12 WO PCT/JP2023/025669 patent/WO2024042899A1/ja not_active Ceased
- 2023-07-12 JP JP2024542640A patent/JPWO2024042899A1/ja active Pending
- 2023-07-12 CN CN202380018126.9A patent/CN118575268A/zh active Pending
-
2024
- 2024-07-26 US US18/785,626 patent/US20240387326A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123607A (ja) * | 2005-10-28 | 2007-05-17 | Toyota Motor Corp | 電気機器の冷却構造 |
| JP2011134979A (ja) * | 2009-12-25 | 2011-07-07 | Fuji Electric Co Ltd | 液体冷却式ヒートシンク |
| JP2013165096A (ja) * | 2012-02-09 | 2013-08-22 | Nissan Motor Co Ltd | 半導体冷却装置 |
| JP2016096272A (ja) * | 2014-11-14 | 2016-05-26 | 日産自動車株式会社 | 冷却器 |
| JP2017050375A (ja) * | 2015-09-01 | 2017-03-09 | 三菱電機株式会社 | 冷媒流路付き電気機器 |
| JP2017135285A (ja) * | 2016-01-28 | 2017-08-03 | 株式会社豊田自動織機 | 冷却器、及び冷却器の製造方法 |
| WO2020071058A1 (ja) * | 2018-10-03 | 2020-04-09 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118575268A (zh) | 2024-08-30 |
| EP4459674A4 (en) | 2025-07-30 |
| WO2024042899A1 (ja) | 2024-02-29 |
| US20240387326A1 (en) | 2024-11-21 |
| EP4459674A1 (en) | 2024-11-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240813 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240813 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250507 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250703 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20250819 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251112 |