JPWO2024004682A1 - - Google Patents
Info
- Publication number
- JPWO2024004682A1 JPWO2024004682A1 JP2024530687A JP2024530687A JPWO2024004682A1 JP WO2024004682 A1 JPWO2024004682 A1 JP WO2024004682A1 JP 2024530687 A JP2024530687 A JP 2024530687A JP 2024530687 A JP2024530687 A JP 2024530687A JP WO2024004682 A1 JPWO2024004682 A1 JP WO2024004682A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022103960 | 2022-06-28 | ||
| PCT/JP2023/022267 WO2024004682A1 (ja) | 2022-06-28 | 2023-06-15 | 基板液処理方法及び基板液処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004682A1 true JPWO2024004682A1 (https=) | 2024-01-04 |
Family
ID=89382149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530687A Pending JPWO2024004682A1 (https=) | 2022-06-28 | 2023-06-15 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024004682A1 (https=) |
| KR (1) | KR20250027803A (https=) |
| TW (1) | TW202417685A (https=) |
| WO (1) | WO2024004682A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3694250A (en) * | 1969-09-17 | 1972-09-26 | Macdermid Inc | Electroless copper plating |
| JPS59208078A (ja) * | 1983-05-02 | 1984-11-26 | ゼネラル・モ−タ−ズ・コ−ポレ−シヨン | 酸性塩化物水溶液の有効寿命を伸長する方法及びその為の装置 |
| JP2004300576A (ja) * | 2003-03-20 | 2004-10-28 | Ebara Corp | 基板処理方法及び基板処理装置 |
| JP2021072443A (ja) * | 2019-10-25 | 2021-05-06 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI833730B (zh) | 2018-02-21 | 2024-03-01 | 日商東京威力科創股份有限公司 | 多層配線之形成方法及記憶媒體 |
-
2023
- 2023-06-14 TW TW112122152A patent/TW202417685A/zh unknown
- 2023-06-15 JP JP2024530687A patent/JPWO2024004682A1/ja active Pending
- 2023-06-15 KR KR1020257002898A patent/KR20250027803A/ko active Pending
- 2023-06-15 WO PCT/JP2023/022267 patent/WO2024004682A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3694250A (en) * | 1969-09-17 | 1972-09-26 | Macdermid Inc | Electroless copper plating |
| JPS59208078A (ja) * | 1983-05-02 | 1984-11-26 | ゼネラル・モ−タ−ズ・コ−ポレ−シヨン | 酸性塩化物水溶液の有効寿命を伸長する方法及びその為の装置 |
| JP2004300576A (ja) * | 2003-03-20 | 2004-10-28 | Ebara Corp | 基板処理方法及び基板処理装置 |
| JP2021072443A (ja) * | 2019-10-25 | 2021-05-06 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202417685A (zh) | 2024-05-01 |
| WO2024004682A1 (ja) | 2024-01-04 |
| KR20250027803A (ko) | 2025-02-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241206 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260227 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260415 |