JPWO2023248416A1 - - Google Patents
Info
- Publication number
- JPWO2023248416A1 JPWO2023248416A1 JP2022562906A JP2022562906A JPWO2023248416A1 JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1 JP 2022562906 A JP2022562906 A JP 2022562906A JP 2022562906 A JP2022562906 A JP 2022562906A JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2022/025061 WO2023248416A1 (ja) | 2022-06-23 | 2022-06-23 | プリウェットモジュール、およびプリウェット方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023248416A1 true JPWO2023248416A1 (enrdf_load_stackoverflow) | 2023-12-28 |
JPWO2023248416A5 JPWO2023248416A5 (enrdf_load_stackoverflow) | 2024-05-28 |
Family
ID=89379289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022562906A Pending JPWO2023248416A1 (enrdf_load_stackoverflow) | 2022-06-23 | 2022-06-23 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023248416A1 (enrdf_load_stackoverflow) |
WO (1) | WO2023248416A1 (enrdf_load_stackoverflow) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005264245A (ja) * | 2004-03-18 | 2005-09-29 | Ebara Corp | 基板の湿式処理方法及び処理装置 |
JP6397620B2 (ja) * | 2012-12-11 | 2018-09-26 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 電気メッキの方法及び装置 |
JP7067863B2 (ja) * | 2016-12-28 | 2022-05-16 | 株式会社荏原製作所 | 基板を処理するための方法および装置 |
JP2022059253A (ja) * | 2020-10-01 | 2022-04-13 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
JP7008863B1 (ja) * | 2021-05-31 | 2022-01-25 | 株式会社荏原製作所 | プリウェットモジュール、脱気液循環システム、およびプリウェット方法 |
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2022
- 2022-06-23 JP JP2022562906A patent/JPWO2023248416A1/ja active Pending
- 2022-06-23 WO PCT/JP2022/025061 patent/WO2023248416A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023248416A1 (ja) | 2023-12-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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