JPWO2023248416A1 - - Google Patents

Info

Publication number
JPWO2023248416A1
JPWO2023248416A1 JP2022562906A JP2022562906A JPWO2023248416A1 JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1 JP 2022562906 A JP2022562906 A JP 2022562906A JP 2022562906 A JP2022562906 A JP 2022562906A JP WO2023248416 A1 JPWO2023248416 A1 JP WO2023248416A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022562906A
Other languages
Japanese (ja)
Other versions
JPWO2023248416A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248416A1 publication Critical patent/JPWO2023248416A1/ja
Publication of JPWO2023248416A5 publication Critical patent/JPWO2023248416A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022562906A 2022-06-23 2022-06-23 Pending JPWO2023248416A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025061 WO2023248416A1 (ja) 2022-06-23 2022-06-23 プリウェットモジュール、およびプリウェット方法

Publications (2)

Publication Number Publication Date
JPWO2023248416A1 true JPWO2023248416A1 (enrdf_load_stackoverflow) 2023-12-28
JPWO2023248416A5 JPWO2023248416A5 (enrdf_load_stackoverflow) 2024-05-28

Family

ID=89379289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022562906A Pending JPWO2023248416A1 (enrdf_load_stackoverflow) 2022-06-23 2022-06-23

Country Status (2)

Country Link
JP (1) JPWO2023248416A1 (enrdf_load_stackoverflow)
WO (1) WO2023248416A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP6397620B2 (ja) * 2012-12-11 2018-09-26 ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated 電気メッキの方法及び装置
JP7067863B2 (ja) * 2016-12-28 2022-05-16 株式会社荏原製作所 基板を処理するための方法および装置
JP2022059253A (ja) * 2020-10-01 2022-04-13 株式会社荏原製作所 めっき装置及びめっき方法
JP7008863B1 (ja) * 2021-05-31 2022-01-25 株式会社荏原製作所 プリウェットモジュール、脱気液循環システム、およびプリウェット方法

Also Published As

Publication number Publication date
WO2023248416A1 (ja) 2023-12-28

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