JPWO2023234084A1 - - Google Patents
Info
- Publication number
- JPWO2023234084A1 JPWO2023234084A1 JP2024524348A JP2024524348A JPWO2023234084A1 JP WO2023234084 A1 JPWO2023234084 A1 JP WO2023234084A1 JP 2024524348 A JP2024524348 A JP 2024524348A JP 2024524348 A JP2024524348 A JP 2024524348A JP WO2023234084 A1 JPWO2023234084 A1 JP WO2023234084A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022087309 | 2022-05-30 | ||
| PCT/JP2023/018853 WO2023234084A1 (ja) | 2022-05-30 | 2023-05-22 | 二成分型室温硬化性オルガノポリシロキサン組成物及び該組成物を含有する各種物品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023234084A1 true JPWO2023234084A1 (https=) | 2023-12-07 |
Family
ID=89024752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024524348A Pending JPWO2023234084A1 (https=) | 2022-05-30 | 2023-05-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023234084A1 (https=) |
| WO (1) | WO2023234084A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649363A (ja) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP2000234057A (ja) * | 1998-12-14 | 2000-08-29 | Shin Etsu Chem Co Ltd | 室温速硬化性組成物 |
| JP2001107023A (ja) * | 1999-07-30 | 2001-04-17 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
| JP2002226708A (ja) * | 2001-01-30 | 2002-08-14 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
| WO2015093139A1 (ja) * | 2013-12-17 | 2015-06-25 | 信越化学工業株式会社 | 多成分系室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び該硬化物からなる成型物 |
| WO2022009759A1 (ja) * | 2020-07-07 | 2022-01-13 | 信越化学工業株式会社 | 二成分型室温速硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び物品 |
| WO2023068094A1 (ja) * | 2021-10-19 | 2023-04-27 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物、接着剤、シール剤及びコーティング剤 |
-
2023
- 2023-05-22 WO PCT/JP2023/018853 patent/WO2023234084A1/ja not_active Ceased
- 2023-05-22 JP JP2024524348A patent/JPWO2023234084A1/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649363A (ja) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP2000234057A (ja) * | 1998-12-14 | 2000-08-29 | Shin Etsu Chem Co Ltd | 室温速硬化性組成物 |
| JP2001107023A (ja) * | 1999-07-30 | 2001-04-17 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
| JP2002226708A (ja) * | 2001-01-30 | 2002-08-14 | Three Bond Co Ltd | 自動車用室温硬化性シール材組成物 |
| WO2015093139A1 (ja) * | 2013-12-17 | 2015-06-25 | 信越化学工業株式会社 | 多成分系室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び該硬化物からなる成型物 |
| WO2022009759A1 (ja) * | 2020-07-07 | 2022-01-13 | 信越化学工業株式会社 | 二成分型室温速硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び物品 |
| WO2023068094A1 (ja) * | 2021-10-19 | 2023-04-27 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物、接着剤、シール剤及びコーティング剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023234084A1 (ja) | 2023-12-07 |
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